4. ELECTRONIC ENGINEERING AND MANUFACTURING DAY (EED) OBSOLESCENCE MANAGEMENT

Transkript

1 4. ELECTRONIC ENGINEERING AND MANUFACTURING DAY (EED) OBSOLESCENCE MANAGEMENT

2 Agenda Überblick EBV Weltweiter Halbleitermarkt Langzeit-Verfügbarkeit EBV-LTB-Prozess, Langzeit-Einlagerung(Kosten, Gewährleistung, NCNR) Überblick TI

3 EBV Elektronik in Kurzform 1969: Gründung durch Erich Fischer 2000: Übernahme durch Avnet Inc. 2008: Vertriebsbüro in Nürnberg Umsatz: ca. 1.4 Mrd. Mitarbeiter: ca. 900 Warenbestand: ca. 300 Mio. Marktanteil: ca. 24 % (laut DMASS) 3

4 Unsere Zielmärkte 4

5 Der weltweite Halbleiter-Markt Mobile/Tablet PC Consumer Automotive Industrial 5

6 Unser Support-Model 6

7 Altera: Life-Cycle Management - FPGAs, CPLDs, and HardCopy ASICs - Up to15 years typical 7

8 Strategien der Halbleiter Hersteller Atmel: ARM Flash MCU Long-term Availability since April

9 Strategien der Halbleiter Hersteller 9

10 10

11 NXP: Introduces Longevity Program for ARM Cortex-M Microcontrollers Minimum 10 years of availability brings supply assurance to customers 11

12 Spansion: Long-Term Memory Program Spansion guarantees to offer either the exact OPN or an OPN with a compatible set of Core Features for 10 years for NOR products and 5 years for NAND products 12

13 STMicroelectronics: Produkte für Industrie und Automotive sind auf eine Verfügbarkeit von mind. 15 Jahren ausgelegt. Auf Anfrage kann hier dem Kunden/Distributor eine entsprechende schriftliche Stellungnahme zugeschickt werden. 13

14 Preisentwicklung über den Lebenszyklus 14

15 EBV-PCN-Prozess Jede Kunde erhält eine Abkündigungsschreiben per , sofern das betroffene Produkt bei uns in den letzten 24 Monaten gekauft wurde EBV unterbreitet auf Wunsch einen Ersatzvorschlag 15

16 PCN-Suche auf der EBV-Homepage 16

17 Langzeit- Einlagerung bei EBV Resteinlagerung ggf. unter Stickstoff Handlings- und Finanzierungsadder NCNR = Non Cancelable, Non Returnable Gewährleistung entfällt spätestens 24 Monate nach dem LastShipDate Alter DateCode muss zugelassen werden 17

18 Überblick TI

19 TI Analog s Obsolescence Policy TI will not obsolete a product for convenience In the event that TI can no longer build a part, we offer one of the most generous policies Formal customer notification through PCN system 12 months to place orders An additional 6 months to take product TI will review each case individually to ensure a smooth transition 19

20 PCN Overview TI deploys a structured Change Management/PCN process aligned with: JEDEC JESD46C and TI internal Quality Standard QSM009 Quality Product Process Change Control Industry dynamics, Customer demand and the need to mitigate identified issues typically drive the change process with a sense of urgency to ensure Continuity of Supply to our Customers Customers have the option to evaluate TI s proposed changes through sample request Contact information for feedback is given on each PCN Customer rejections are handled individually with the customer. 20

21 TI PCN Methodology TI PCN procedures are derived from and consistent with JEDEC Standards: Major/Minor change classification Form, fit, function, quality or reliability Notification period Minimum of 90 day notice prior to implementation of major change PCN content Samples / Data 30 day evaluation period from receipt Qualification requirements Customer Distributors, contract manufacturers and customers who directly purchased affected product in prior 2 year period 21

22 Customer Notification Process 90 days minimum Customer PCN Qualification If Sample / Data Requested Implement Change Qual Plan 30 day Sample Request Period Qual Complete Qual Report 30 day Sample Evaluation Period Notification Types Informational Information only announcement of a minor device change. Typically used for change categories such as packing material or non-spec datasheet revisions. 90 day PCN Notification of major device change. Contains qualification plan or results and 30 day sample request period. 22

23 PCN content Each registered Customer Contact receives the following information in a Texas Instruments PCN: Cover Letter introducing the change Products affected by the change Technical details of the change Change Type Reason for the Change Qualification Plan Request for samples /Qual data Content of PCN aligns with JEDEC requirements 23

24 Automotive Quality Overview Commitment to Automotive Quality Automotive Quality Management System (TS16949) Automotive Quality Management Processes Automotive 5 phase development process Automotive APQP Process PPAP for Release Zero Defect Launch Strategy (ZDL) Process/Product Qualification according AEC-Q100 Automotive Change Management Process (PCN) Automotive Complaint Management day return cycle time target Automotive problem solving tools (8D,3x5Why, Ishikawa, etc.) Automotive Red Team approach Dedicated Automotive Quality Support (Application) Team in Freising Environmental Quality Management System (ISO14001) 24

25 TI Sites Certifications Texas Instruments sites maintain compliance to ISO 9001 Quality Management System and ISO Environmental Management System Certifications TI is also TS certified; a mandatory requirement to be a proven and reliable partner for Automotive! Link to external web updated TI sites certifications 25

26 Ensuring New Technology Robustness Key areas to ensure technology robustness during development Process Sensitivity Study Larger sample size relative to prior silicon nodes: more lots, more variables will be characterized. FMEA Methodology Introducing a standardized FMEA software for better capture of data information. Good continuity of the FMEA document from development through production. Extensive Intrinsic Yield Program Dedicated team for root cause and corrective action. More comprehensive in-line defect inspection during development. Apply Lessons Learned as a deliverable during technology development Actively evaluate and incorporate best practices from prior nodes into new technologies

27 Distribution is today. Tomorrow is EBV.