electronica 2014: Alle Termine im Überblick automotive Forum

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1 automotive Forum Innovative Approach for Cell Monitoring and Cell Equalization in Safety Critical Energy Storage Systems Dr. Thomas Müller ams AG, Unterpremstätten International Rectifier dedicated Chipset for Digital Power Conversion in U-Hybrid Cars Davide Giacomini International Rectifier GmbH, Neu-Isenburg New design challenges for electronic components in the 48V Board net High efficiency with major applications Mustafa Dinc Vishay Electronic GmbH, Selb Advanced sensors for vehicle CO2 reduction Thorsten Munzig TE Connectivity, Bensheim Meeting New Integration Challenges in Cars Kent Robinett Maxim Integrated, San Jose, CA Memory Trends and Requirements in Automotive in Automotive Infotainment and ADAS Applications: Optimizing Memory to Achieve Hi-Performance and Low-Power Architectures Jeffrey Bader 12:30-13:00 h 13:00-13:30 h 13:30-14:00 h 14:00-14:30 h 14:30-15:00 h 15:00-15:30 h Micron Technology, Boise, ID :00 Seite 1

2 automotive Forum System Validation: Automated Testing of Lighting Systems Combinging traditional methods with real-time tests and image processing Carlos Urquizar AED Engineering GmbH, München Powering LEDs for automotive Hans Zweers ROHM Semiconductor GmbH, Willich Silicon Solutins for Driving Advanced Automotive Lighting Systems Upcoming applications offer safety advantages, convenience options and energy savings Lance Williams ON Semiconductor, Phoenix Podiumsdiskussion Bedeutung der Software für das vernetzte Fahrzeug - Technologische Herausforderungen und deren Umsetzung in der Lieferkette Moderator: Alfred Vollmer, Automobil Elektronik Teilnehmer: Dr. Günther Heling, Vector Informatik GmbH Lars Reger, NXP Semiconductors Germany GmbH Martin Schleicher, Elektrobit Automotive GmbH Manfred Bek, ZF Friedrichshafen AG Dr. Stefan Bunzel, Continental Automotive GmbH Jürgen Weyer, Freescale Semiconductor, Inc. Spannungsklassen in der E-Mobilität Edmund Erich 15:30-16:00 h 16:00-16:30 h 16:30-17:00 h 10:00-11:00 h 11:00-11:30 h Delphi, Wuppertal :00 Seite 2

3 automotive Forum Charging Infrastructure - status quo and look-out Michael-Günther Zeyen vancom GmbH & Co. KG Qualifizierung und Erprobung von leistungselektronischen Modulen im elektrifizierten Antriebsstrang des Automobils Dr. Martin Rittner Robert Bosch GmbH Automotive Electronics Semiconductors & Sensors, Reutlingen Auswirkung von Electrical Overstress (EOS) auf die Automobilelektronik Christoph Thienel Robert Bosch GmbH Automotive Electronics Semiconductors & Sensors, Reutlingen Consumer Components for Automotive Stefan Lehmann Freescale Halbleiter Deutschland GmbH, München Innovative CE in Automotive Applications Dr. Ansgar Groene Robert Bosch GmbH Automotive Electronics Semiconductors & Sensors, Reutlingen Podiumsdiskussion Usage of Consumer Components in Vehicles - Threat or Opportunity? Moderator: Peter Gresch, Opt E GP Consulting 11:30-12:00 h 12:00-12:30 h 12:30-13:00 h 13:00-13:30 h 13:30-14:00 h 14:00-15:00 h Teilnehmer: Dr. Georg Blume, Robert Bosch GmbH Dr. Ansgar Groene, Robert Bosch GmbH :00 Seite 3

4 automotive Forum Stefan Lehmann, Freescale Halbleiter Deutschland GmbH Jörg-Michael Schneider, NXP Semiconductors Josef Sedlmeier, EPCOS AG A Member of TDK-EPC Corporation Roundtable The basics for Autonomous Driving - does the optimistic driver assistance roadmap need to be challenged? Moderator: Markus Schöttle, ATZelektronik Teilnehmer: Helmut Keller, Spokesman of ZVEI Robustness Validation Forum and Managing Director, Keller Consulting & Engineering Services in Reutlingen Andreas Reuter, Lawyer, Stuttgart (Germany) Dr.-Ing. Marko Wolf, Head of Engineering Europe, ESCRYPT GmbH A short introduction to AUTOSAR Simon Fürst BMW AG Absicherungsstrategien für AUTOSAR-Steuergeräte-Software Matthias Symann dspace GmbH, Paderborn AUTOSAR Software from Renesas - Products and Solutions Frank Faoro Renesas Electronics, Düsseldorf Time Synchronization in distributed systems acc. to AUTOSAR Bernd Jesse 15:00-17:00 h 10:00-10:10 h 10:10-10:40 h 10:40-11:10 h 11:10-11:40 h Vector Informatik GmbH, Stuttgart :00 Seite 4

5 automotive Forum Experiences of ZF with the introduction of AUTOSAR Dr. Roland Geiger ZF Friedrichshafen AG How to handle functional safety in AUTOSAR-based developments efficiently - the new AUTOSAR concept "Safety Extensions" Sugandar Swetharanyam KPIT Technologies GmbH Start-up mit Autosar: Das erste Design - schnell und preiswert Uwe Schuhmann STMicroelectronics Commoditisation of automotive functional safety architectures - innovation in the face of consolidation and cost effectiveness Christopher Temple Infineon Technologies AG, Neubiberg HAL15xy, functional safety on 1mm² Carolin Kaiser Micronas GmbH, Freiburg Smart redundant ASILC Angular Position Sensor IC Functional Safety Management in Smart Sensor development Dr. Vincenzo Sacco 11:40-12:00 h 12:00-12:30 h 12:30-13:00 h 13:30-14:00 h 14:00-14:30 h 14:30-15:00 h :00 Seite 5

6 automotive Forum Melexis Technologies NV, Tessenderlo Interaction of the main ISO26262 work products and tools during the development of a mixed signal hardware ASIC or ASSP Yves Renard, Functional Safety Manager, Automotive Business Unit ON Semiconductor, Phoenix Qualifikation/ Produkthaftung/ persönliche Haftung Andreas Reuter Reuter Technologie GmbH Automated Driving: The Challenge to move from Fail-Safe towards Fail-Operational Systems Dipl.-Ing. Eric Schmidt TTTech Automotive GmbH, Wien Addressing divergence between safety and usage of latest technologies from automotive MCU semiconductor supplier perspective Christophe Maitrjean STMicroelectronics Connected Drive - a personalized mobility experience Simon Euringer BMW AG The Future Networked Car Brett Stark 15:00-15:30 h 15:30-16:00 h 16:00-16:30 h 16:30-17:00 h Fr :00-10:30 h Fr :30-11:00 h Continental Automotive GmbH :00 Seite 6

7 automotive Forum Evolution of the security in the automotive MCU Overview of the security in the automotive - State of the art countermeasures and consequences - Car2X future and possible development of the security framework Fr :00-11:30 h Roberto Colombo STMicroelectronics Ethernet in Infotainment Stefan Singer Freescale Halbleiter Deutschland GmbH, München The Challenge to transmitting 10+ Gbps in the car reliably and ISO26262-compliant APIX3-3rd generation of the Automotive Pixel Link soon to come Jochen Schyma INOVA Semiconductors GmbH, München Secure Vehicle to X communications in practice Clara Ottero Perez Fr :30-12:00 h Fr :00-12:30 h Fr :30-13:00 h NXP Semiconductors Netherlands B.V., Eindhoven :00 Seite 7

8 electronica Forum CEO Roundtable Internet of Things: Possibilities, Challenges and the Question of Security Teilnehmer: Dr. Reinhard Ploss, CEO, Infineon Technologies AG Carlo Bozotti, President and CEO, STMicroelectronics Rich Clemmer, President and CEO, NXP Semiconductors Germany GmbH Gregg A. Lowe, President and CEO, Freescale Semiconductor Infineon Technologies AG, Neubiberg NXP Semiconductors Netherlands B.V., Eindhoven Freescale Halbleiter Deutschland GmbH, München STMicroelectronics World Electronic Industries : Production forecast till 2017 Olivier Coulon DECISION Etudes & Conseil Cybersecurity Herausforderungen in digitalen Wertschöpfungsnetzen Tom Köhler, Executive Vice President - InfoCom IABG Industrieanlagen-Betriebsgesellschaft mbh Wie sich Unternehmen mit Schwachstellenanalysen und Security Reviews auf Hacking-Angriffe vorbereiten können Jan-Tilo Kirchhoff Compass Security Deutschland GmbH Cyber Security - Concept to Reality Sebastian Rohr 11:00-12:00 h 12:00-13:00 h 14:00-14:30 h 14:30-15:00 h 15:00-15:30 h Accessec GmbH :00 Seite 8

9 electronica Forum Bericht zur Cyber-Sicherheitslage Susanne Jantsch Referat Lagezentrum und CERT-Bund, Bundesamt für Sicherheit in der Informationstechnik (BSI) Emerging Opportunities & Eco-System for Electronics Systems Design & Manufacturing in India Rajoo Goel ELCINA Electronic Industries Association of India, New Delhi Roundtable Discussion / Session One Security in Embedded Systems - The Challenges And Solutions Teilnehmer: Roger May, System Architect, Industrial, Altera Will Keegan, Product Manager, LynxSecure Separation Kernel Hypervisor; Lynx Software Technologies, Inc. Jürgen Spänkuch, Head of Business Line Platform Security, Infineon Technologies AG Peter Claydon, CEO, ContinuumBridge Ltd. Marco Wolf, Head of Engineering Europe, ESCRYPT GmbH - Embedded Security Norbert Asche, Texas Instruments Veranstalter: Electronic Specifier Ltd., Kent Roundtable Discussion / Session Two Security in Embedded Systems - The Challenges And Solutions Teilnehmer: Frank van den Berg, Technical Director, EMEA, Green Hills Software Alan Grau, President, Icon Laboratories, Inc. David Beal, Senior Product Manager, Xilinx, Inc. Christophe Tremlet, Security Segment Manager, Maxim Integrated Products Inc. Michele Scarlatella, Central Marketing Director, Secure MCU Division, STMicroelectronics Dirk Akemann, Partnership Marketing Manager, SEGGER Microcontroller GmbH & Co.KG Veranstalter: Electronic Specifier Ltd., Kent ECSEL Joint Undertaking Implementing Horizon 2020 Dr. Andreas Wild, Executive Director, ECSEL Joint Undertaking 15:30-16:00 h 16:00-17:00 h 10:00-11:30 h 11:30-13:00 h 13:00-14:00 h :00 Seite 9

10 electronica Forum Dr. Ina Sebastian, Infineon Technologies AG Prof. Heinrich Daembkes, Airbus Defence and Space Dr. Gunter Lugert, Siemens AG Power Semiconductors in Smart Energy Applications Dr. Martin Schulz Infineon Technologies AG, Neubiberg Freescale Helps Ease Interoperability Challenges for the Internet of Things Sylvain Gardet 14:00-14:30 h 14:30-15:00 h Freescale Halbleiter Deutschland GmbH, München Podiumsdiskussion Energy Efficient Semiconductors - How They will Change our Lives From Energy Harvesting to IoT, Smart Production, Smart Buildings, 15:00-16:00 h Smart Grids and beyond Moderator: Heinz Arnold, WEKA Fachmedien GmbH; Markt & Technik Teilnehmer: Dave Freeman, TI Fellow and CTO for Power Management, Texas Instruments Deutschland GmbH Joy Weiss, President Dust Networks Product Group, Linear Technology GmbH Sajol Goshal, VP Strategic für den Bereich Sensorik und Wireless-Konnektivität, ams AG Dr. Martin Schulz, Infineon Technologies AG Roger Westberg, Business Development Mgr., Europe Smart Metering & Energy Measurement Solutions, Maxim Integrated Products Inc. Carmelo Papa, Executive Vice President, General Manager, Industrial & Power Discrete Group, STMicroelectronics Matt Saunders, Sr. Marketing Manager - MCU + RF EMEA, Silicon Labs Die rote Couch - VIP-Talk Moderator: Christian Fischbach, publish-industry Verlag GmbH Dr. Reinhard Pfeiffer, Stellvertretender Vorsitzender der Geschäftsführung, Messe München GmbH Die rote Couch - VIP-Talk Smart Home Moderator: 16:00-16:20 h 16:20-16:40 h :00 Seite 10

11 electronica Forum Dr. Karlhorst Klotz, publish-industry Verlag GmbH - Energy 2.0 Markus Kreitmair, Innovation Manager, EnOcean GmbH Die rote Couch - VIP-Talk Smart Home Moderator: Dr. Karlhorst Klotz, publish-industry Verlag GmbH - Energy 2.0 Bharat Shenoy, Director of Technical Marketing, Littelfuse Europe GmbH Keynote Speech Dr. Joseph Niemela, Head of Applied Physics and Office of External Activities (OEA), Global Coordinator of the Secretariat for International Year of Light 2015, Abdus Salam International Centre for Theoretical Physics (ICTP) Trieste, Italy Veranstalter: Luger Research e.u., Dornbirn Panel Discussion International Year of Light Strategies and Technologies Teilnehmer: Prof. Mehmet Arik, Ozyegin University, Turkey Prof. Reine Karlsson, Lund University, Sweden Dr. Nicola Trivellin, LightCube SRL, Italy Dr. Joseph Niemela, ICTP, Italy Dr. Christopher Keusch, Everlight Electronics Europe GmbH, Germany Veranstalter: Luger Research e.u., Dornbirn Panel Discussion Trends in SSL Lighting - Electronic Designs for Lighting Teilnehmer: Sebastian Hülck, Vertical Segment Director Lighting EMEA, EBV Elektronik GmbH & Co. KG, an Avnet company Dr. Reto Häring, CTO, Instrument Systems Anton J.D. Gschwändler, Head of Business lighting, CeramTec GmbH Benjamin Garufo, ledxon modular gmbh, ledxon modular gmbh Dr. Nicola Trivellin, Co-Founder, LightCube SRL 16:40-17:00 h 10:00-10:15 h 10:15-11:30 h 11:45-13:00 h Veranstalter: Luger Research e.u., Dornbirn :00 Seite 11

12 electronica Forum Fachkarriere vs Managementlaufbahn: Welcher Weg führt langfristig zum Erfolg? Moderator: Renate Schuh-Eder, SchuhEder Consulting GmbH Teilnehmer: Arnt Stumpf, Manager Personalentwicklung, Würth Elektronik eisos Beatrice Tamas, HR Manager, STMicroelectronics Frank Vernauer, Geschäftsführer, P4 Career Consultants Karen Oßmann, HR Manager, Robert Bosch GmbH Prof. Heather Hofmeister, Professorin für Arbeitssoziologie, Goethe-Universität Frankfurt Organic and Printed Electronics - Introduction Wolfgang Mildner, OE-A Vice Chairman Europe; Founder MSW OE-A Heraeus? Portfolio to support Printed Electronic Industry Dr. Andreas Elschner, Vice President Technology Heraeus Precious Metals GmbH & Co. KG Organic and Printed Electronics from an End-User Perspective Anna De Maria, Sales Manager DINEMA SPA, Brescia (BS) Optical Sensors in Printed and Plastic Electronics Laurent Jamet, Co-founder & Business Development Director ISORG Flexible Touch Sensors Based on Transparent Conductive PolyTC Metal Mesh Films Dr. Wolfgang Clemens, Head of Product Management PolyTC 13:30-14:30 h 14:30-14:45 h 14:45-15:00 h 15:00-15:15 h 15:15-15:30 h 15:30-15:45 h :00 Seite 12

13 electronica Forum PolyIC GmbH & Co. KG Flexible Smart Systems Based on Printing and Hybrid Integration Techniques Prof. Jukka Hast, Research Professor - VTT printed intelligence VTT Die rote Couch - VIP-Talk Die Zukunft ist smart: Smart Grid / Smart Metering / Smart Home Moderator: Christian Fischbach E&E Faszination Elektronik Student Day Veranstalter: semica c/o SchuhEder Consulting GmbH VDE Prüf- und Zertifizierungsinstitut GmbH, Offenbach 15:45-16:00 h 16:00-17:00 h Fr :00-14:15 h :00 Seite 13

14 embedded Forum Internet of Things: Challenges and Opportunities Designing connected systems for the IoT Avner Goren Texas Instruments Deutschland GmbH, Freising ARM-based Microcontrollers, FPGAs & SoCs Intelligent system solutions with flexible microcontroller system Harald Friedrich EBV Elektronik GmbH & Co.KG, Poing ARM-based Microcontrollers, FPGAs & SoCs Connectivity in the Industrial world Adrian Valenzuela Texas Instruments Deutschland GmbH, Freising Starter-Kits and Reference Designs Introduction Mark Burr-Lonnon Mouser Electronics, München Starter-Kits and Reference Designs MultiSIM Blue Raymond Yin Mouser Electronics, München Starter-Kits and Reference Designs Architecting System Solutions to Solve Customer Problems - TI Designs 13:00-13:30 h Halle A6 / A :00-15:30 h Halle A6 / A :30-16:00 h Halle A6 / A :00-11:05 h Halle A6 / A :05-11:30 h Halle A6 / A :30-12:00 h Halle A6 / A :00 Seite 14

15 embedded Forum Ajinder Singh Texas Instruments Deutschland GmbH, Freising Starter-Kits and Reference Designs STM32 Open Development Environment Alessandro Cremonesi STMicroelectronics Starter-Kits and Reference Designs Introducing Intel?s Edison board Dr. Matthias Hahn Intel Corporation Small Form Factor Boards Computer on Module - Carrier Board Design Challenges Patrick Dietrich Connect Tech Inc, Guelph Ontario Small Form Factor Boards The ARM module market story Wolfgang Heinz-Fischer TQ Group, Seefeld Internet of Things: Chips, Tools & Software for Device Development IzoT - the Multi Protocol Industrial IoT Solution Hans Happ 12:00-12:30 h Halle A6 / A :30-13:00 h Halle A6 / A :00-13:30 h Halle A6 / A :30-14:00 h Halle A6 / A :00-15:30 h Halle A6 / A6.353 Avnet Memec, Avnet EMG GmbH, Poing :00 Seite 15

16 embedded Forum Internet of Things: Chips, Tools & Software for Device Development A Gigabyter?s Guide to the IoT Galaxy Amit Gattani 15:30-16:00 h Halle A6 / A6.353 Micron Embedded Business Internet of Things: Chips, Tools & Software for Device Development Code coverage without instrumentation: New methods and tools to ensure software quality in electronically control units in accordance with ISO Heiko Riessland 16:00-16:30 h Halle A6 / A6.353 pls Programmierbare Logik & Systeme GmbH, Lauta Motor Control Solutions System-on-Chip Motor Controller for cost and space efficient solutions for DC & BLDC motor drive automotive applications Daniel Mysliwitz Infineon Technologies AG, Neubiberg Motor Control Solutions Accelerating Motor Control Algorithms with SoC FPGA?s Roger May, Altera GmbH Harald Friedrich, EBV Elektronik GmbH & Co. KG Motor Control Solutions Protecting your system from overvoltages, miswiring and power off conditions while maintaining precision performance Sean Brown Analog Devices GmbH, München Motor Control Solutions Leveraging New Products and Innovative Design Tools to Accelerate Motor Drive Development Cycles Mike Gilbert 11:00-11:30 h Halle A6 / A :30-12:00 h Halle A6 / A :00-12:30 h Halle A6 / A :30-13:00 h Halle A6 / A :00 Seite 16

17 embedded Forum Texas Instruments Deutschland GmbH, Freising Security for the Internet of Things: Challenges and Solutions Security for the Internet of Things Martin Klimke Infineon Technologies AG, Neubiberg Security for the Internet of Things: Challenges and Solutions The benefits of public key cryptography to embedded systems Christophe Tremlet Maxim Integrated, San Jose, CA Security for the Internet of Things: Challenges and Solutions IoT security should be hard, by definition Kerry Maletsky ATMEL Corporation, San Jose, CA Embedded Computing Selection Criteria for Embedded Modules and Boards Peter Eckelmann MSC Technologies GmbH, Stutensee Embedded Computing 48 V is the new 12 V Robert Gendron 13:00-13:30 h Halle A6 / A :30-14:00 h Halle A6 / A :00-14:30 h Halle A6 / A :00-15:30 h Halle A6 / A :30-16:00 h Halle A6 / A6.353 VICOR, Ismaning :00 Seite 17

18 embedded Forum Embedded Computing ARM Carrier Board and Industrial Panel PCs, designed and developed by Data Modul Thomas Wolfmüller DATA MODUL AG, Munich Embedded Computing emmc for Embedded Computing Applications Cecilia Regolo Victor Tsai SMART Modular Technologies, Newark, CA Open Standards for Embedded Computing Boards & Modules SMARC, Qseven, enuc - SGET standards for embedded applications SGET Member Companies Smart Energy Smart Grid beyond just Smart Utility Meters Kripa Venkat 16:00-16:30 h Halle A6 / A :30-17:00 h Halle A6 / A6.353 Fr :00-13:00 h Halle A6 / A6.353 Fr :00-13:30 h Halle A6 / A6.353 Texas Instruments Deutschland GmbH, Freising :00 Seite 18

19 PCB & Components Market Place What are the applications and the value of MEMS in the IoT? Michel Allain Yole Développement MEMS and Sensors enhance life in the IoT Werner Neumann STMicroelectronics MEMS as enabler of Internet of Things and Services Jeanne Forget Bosch Sensortec GmbH, Reutlingen Radio Communication powered by Energy Harvesting Armin Anders EnOcean GmbH Medical Technologies and the Internet of Things Frank Kuhn Hahn-Schickard-Gesellschaft - Inst. f. Mikroaufbautechnik How to bring MEMS into a foundry? The challenge of MEMS product implementation Dr. Peter Merz 13:00-13:25 h 13:25-13:50 h 13:50-14:15 h 14:15-14:40 h 14:40-15:05 h 15:05-15:30 h X-FAB MEMS Foundry :00 Seite 19

20 PCB & Components Market Place Science Community: Status Quo and Vision Prof. Dr. Christoph Kutter Fraunhofer-Einrichtung für Modulare Festkörper-Technologien EMFT Business Outlook for the Global Electronics Industry Walt Custer Custer Consulting Group, The Sea Ranch, CA ZVEI - Technical Commission Board, Topics, Development of a White Book Bernd Enser, Sanmina-SCI Germany SANMINA Corporation, San Jose, CA Supply Chain Management in the Electronics Industry Ernst Kastenholz, Zollner Elektronik AG Hans Ehm, Infineon Technologies AG Tom Effert, Leopold Kostal GmbH & Co. KG Manuela Zeppin, Infineon Technologies AG Connecting your need for speed? Thierry Goossens FCI Deutschland GmbH, Oberursel Comprassion mount contact technology in application for device connections Michael Greuter 15:30-15:55 h 16:00-16:30 h 10:00-11:00 h 11:00-13:00 h 14:00-14:30 h 14:30-15:00 h METZ CONNECT GmbH, Blumberg :00 Seite 20

21 PCB & Components Market Place AXI + AOI = AXOI, die Formel für 100% optische Prüfabdeckung Andreas Türk GÖPEL electronic GmbH, Jena Embedded System Access - Eine Testtechnologie stellt sich vor Hosea Lukas Busse GÖPEL electronic GmbH, Jena Business Outlook for the Global Electronics Industry Walt Custer Custer Consulting Group, The Sea Ranch, CA Market Trends and Outlook: Ceramic Hybridcircuits - Printed Circuit Boards - Electronic Assemblies Moderator: D.G. Weiss, Ingenieurbüro Weiss Teilnehmer: Michael Gasch, Data 4PCB Jörg Jungbauer, TQ-Systems GmbH Dirk Schönherr, Lust Hybrid-Technik GmbH Component Cleanliness Jürgen Frey, EPCOS AG Harald Hundt, Vacuumschmelze GmbH & Co. KG Mark Nikolussi, Robert Bosch GmbH Services in EMS Initiative Obsolescence-Management Was ist Obsoleszenz - Obsoleszenz-Management in der Lieferkette - Obsoleszenz erfordert Management - Risiken managen Moderator: Michael Velmeden, cms electronics gmbh 15:00-15:30 h 15:30-16:00 h 16:00-16:30 h 10:00-11:00 h 11:00-12:15 h 12:15-13:30 h Teilnehmer: Helmut Bechtold, PROFECTUS GmbH Electronic Solutions :00 Seite 21

22 PCB & Components Market Place Ludwig Hiebl, Zollner Elektronik AG Dr. Peter Schmitt, CCS - Customer Care & Solutions Holding Ulrich Ermel, TQ-Systems GmbH Design Chain Markus Biener, Zollner Elektronik AG Rainer Pludra, AT & S AG Arnold Wiemers, Ilfa GmbH Rework & Repair Thomas Lauer EADS Cassidian Electronics Business Outlook for the Global Electronics Industry Walt Custer Custer Consulting Group, The Sea Ranch, CA Material for the future - your challenge our solution! EMC-Roadmap and product developments Elke Krüger CCI Eurolam GmbH, Dreieich HMI - neuartige Eingabe- und Bedienkonzepte anhand kapazitiver Leiterplatten auf Glas Norbert Krütt FELA GmbH, Villingen-Schwenningen Simplifying the selection of Application Specific materials Martin Cotton 13:30-14:45 h 14:45-16:00 h 16:00-16:30 h Fr :00-10:30 h Fr :30-11:00 h Fr :00-11:30 h Ventec Europe Ltd, Leamington Spa :00 Seite 22

23 PCB & Components Market Place Design for Test - Ein wichtiges Kettenglied der Design Chain Dr. Peter Schmitt ccs Group TEST-OK functional test system - Advanced functional test solutions Hans Roelvink TEST-OK BV, Rotterdam ENTEK OM ORGANIC METAL PCB Final Finish Bridging the OSP-Metallic final finish gap Chris Klok Enthone GmbH RFID on PCB - much more than Industry 4.0 Mount one more component and make a PCB and product smarter than a smart phone Alexander M. Schmoldt Murata Elektronik GmbH, Nürnberg Flexible Printed Circuits (FPC) in automotive applications Harald Schenk Mektec Europe GmbH, Weinheim Obligatory requirements to reduce CO2 emissions and increase passenger safety challenge the automotive industry Christian Roessle Fr :30-12:00 h Fr :00-12:30 h Fr :30-13:00 h Fr :00-13:30 h Fr :30-14:00 h Fr :00-14:30 h SCHWEIZER ELECTRONIC AG, Schramberg :00 Seite 23

24 PCB & Components Market Place How to create a Smart-EMS-Factory An approach for small and medium-sized businesses Raimund Antonitsch cms electronics gmbh, Klagenfurt am Wörthersee Business Outlook for the Global Electronics Industry Walt Custer Fr :30-15:00 h Fr :00-15:30 h Custer Consulting Group, The Sea Ranch, CA :00 Seite 24

25 exhibitor Forum The new Generation Display-PMOLED Zoe Chen Raystar Optronics, Inc., Taichung PWG technology "The next generation for low cost high accuracy linear position sensing" Dr. Brian Johnson Littelfuse Europe GmbH, Bremen Sensirions new Humidity and Temperature Sensor Series for the Automotive and Appliance Market Dr. Henri Ehrke Sensirion AG, Staefa How to optimize the return of your investment in test-equipment Edgar Leckel Keysight Technologies Deutschland GmbH DC-CT - A High Performance Direct Current Sensing Technology Dr. Uros Platise KOLEKTOR Group, Idrija Bitte nicht stören - Befilterung von DC/DC-Wandlern Thomas Rechlin 13:30-14:00 h Halle B5 / B :00-14:30 h Halle B5 / B :30-15:00 h Halle B5 / B :00-15:30 h Halle B5 / B :30-16:00 h Halle B5 / B :30-11:00 h Halle B5 / B5.151 RECOM Electronic GmbH, Neu-Isenburg :00 Seite 25

26 exhibitor Forum High performance and short lead-time: cost-effective, custom DC-DC power How to get maximum flexibility and the shortest time to market with complete control of budget and schedule Stephen Oliver VICOR, Ismaning No-compromise AC-DC power system design using modular component technology Stephen Oliver VICOR, Ismaning High Voltage (HVDC) Power Distribution and Conversion in Datacenters, Aerospace, Microgrids and Transportation Stephen Oliver VICOR, Ismaning Power Density - designing in the negative space Karim Wassef GE Critical Power, Oberhaching Highly Efficient 1mW Isolated DC-DC Converter Analog meets Digital Matthias Ulmann Texas Instruments Deutschland GmbH, Freising Lift the Output Power from 1.6kW to 3.2kW and beyond A modular Power Factor Corrected MCU controlled Battery Charger Platform for 1-phase and 3-phase systems Roberto Scibilia 11:00-11:30 h Halle B5 / B :30-12:00 h Halle B5 / B :00-12:30 h Halle B5 / B :30-13:00 h Halle B5 / B :00-13:30 h Halle B5 / B :30-14:00 h Halle B5 / B :00 Seite 26

27 exhibitor Forum Texas Instruments Deutschland GmbH, Freising Design review of a CUK converter Design Review of a CUK Converter to supply a sensitive wideband Voice Line Card VoIP 16-bit/16kHz Bernd Geck Texas Instruments Deutschland GmbH, Freising The Connected Future will not be Battery Powered How the Internet of Things will drive a revolution in low power electronic devices Ishai Naveh Adesto Technologies, Sunnyvale, CA When Lightning Strikes?Are Your Outdoor LED Designs Safe? Lightning always strikes more than once. Are your Outdoor LED designs protected? Bharat Shenoy Littelfuse Europe GmbH, Bremen Making Power Design Easy for the Embedded Engineer Industry Trends in Automated Power Component Selection, Power Device Modeling, and Power System Modeling Sean Crilly VICOR, Ismaning Einpresstechnologie - Neuheiten der Diehl Metal Applications GmbH Oliver Thie Diehl Metal Applications GmbH, Berlin Invest India and Manufacturing Oppurtunities Vinod Sharma 14:00-14:30 h Halle B5 / B :30-15:00 h Halle B5 / B :00-15:30 h Halle B5 / B :00-16:30 h Halle B5 / B :30-11:00 h Halle B5 / B :00-11:30 h Halle B5 / B :00 Seite 27

28 exhibitor Forum Electronics & Computer Software Export Promotion Council 24/7 Electronics Manufacturing enabled by developer`s DNA Intelligent automation concepts and vertical integration - enabler for competitive electronics manufacturing in Western Europe Stefan Juchem Prodrive Technologies, EM Son New Ceramic Safety Capacitors for Automotive Applications Dr. Christian Münch Vishay Electronic GmbH, Selb Seamless integration of counting and dry storage for electronic SMD components; OC-Scan CCX with ToTech Super Dry Dr. Jan Richarz optical control GmbH & Co. KG, Weißenohe Parylenebeschichtung Dauerhafte Versiegelung elektronischer Baugruppen mit extremen Anforderungen Rudolf Heicks Heicks Industrieelektronik GmbH, Geseke Award Ceremony Texas Instruments Innovation Challenge - European Analog Design Contest 2014 Veranstalter: Texas Instruments Deutschland GmbH, Freising 11:30-12:00 h Halle B5 / B :00-12:30 h Halle B5 / B :30-13:00 h Halle B5 / B :00-13:30 h Halle B5 / B5.151 Fr :00-12:00 h Halle B5 / B :00 Seite 28

29 electronica automotive conference (kostenpflichtige Vorträge) Ligthing - Keynote Lighting Is the New Competition Arena of Car Makers Dr. Wolfgang Huhn, Head of Lighting and Vision Systems Audi Ingolstadt, Audi AG Sensor Fusion - Keynote Sensor Fusion: Computer Power Becoming as Important as Horse Power? Jean-Francois Tarabbia, Group Sen. VP, R&D and Product Marketing, Valeo Connectivity - Keynote Smart and Connected Transportation Prof. Dr. Hermann Eul, General Manager Intel Mobile and Communications Group, Intel Corporate Vice President, Intel Corporation Sensor Fusion Making Bertha Drive Dr.-Ing. Uwe Franke, Head of Daimler?s Image Understanding Group, Daimler AG Connectivity Delivering the Connected Vehicle User Experience Bruno Pinto, Technical Sales Manager, Visteon Innovation & Technology GmbH Visteon Corporation, Kerpen Lighting New Exterior Automotive Lighting Needs Electronics Thomas Fröhlich, Director Electronic Engineering, Automotive Lighting GmbH Sensor Fusion Integrated Platform for Automated Driving Dr.-Ing. Alois Seewald, Technical Director, Integrated Active + Passive Safety Technologies, TRW Automotive GmbH Connectivity From Mechanical Key to Mobile Phone App - Driver Authorization through the Ages Wolfgang Stehle, Team Manager System Design, MARQUARDT GmbH Mo :00-10:30 h - Room 5 Mo :30-11:00 h - Room 5 Mo :00-11:30 h - Room 5 Mo :00-12:30 h - Room 4 Mo :00-12:30 h - Room 5 Mo :00-12:30 h - Room 2 Mo :30-13:00 h - Room 4 Mo :30-13:00 h - Room :00 Seite 29

30 electronica automotive conference (kostenpflichtige Vorträge) Ligthing Innovative Light Functions for Automotive Applications - Challenges in System Engineering and Robustness Validation Dr.-Ing. Wolfgang Pohlmann, Head of Opto Mechatronic Technology, Hella KGaA Hueck & Co. Connectivity Tomorrow?s Automobiles Will Talk to One Another? Safely and Securely Lars Reger, Vice President R&D, Strategy & New Business - Automotive, NXP Semiconductors NXP Semiconductors Netherlands B.V., Eindhoven Lighting Camera Based Driver Assistance - from Comfort to Safety Mechatronical Function Integration, a "Sensor-Farm" Alternative Mo :30-13:00 h - Room 2 Mo :00-14:30 h - Room 5 Mo :00-14:30 h - Room 2 Frank Bläsing, Head of Innovation, Leopold Kostal GmbH & Co. KG KOSTAL Kontakt Systeme GmbH, Lüdenscheid Sensor Fusion Relevance of AEC Q100 Update for ISO Axel Köhnen, Senior Safety Expert, TÜV Süd AG Dr. Andreas Preussger, Director Quality Management, Infineon Technologies AG Infineon Technologies AG, Neubiberg Lighting Application Trends in Automotive Lighting Dr. Claus Allgeier, Vice President & General Manager Automotive Solid State Lighting, OSRAM GmbH OSRAM Opto Semiconductors GmbH, Regensburg Sensor Fusion Two Key Challenges for Automated Driving Jean-Francois Chouteau, General Manager Global ADAS Solution Group, Renesas Electronics Europe Mo :00-14:30 h - Room 4 Mo :30-15:00 h - Room 2 Mo :30-15:00 h - Room :00 Seite 30

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