1) Seite 25. Lichtstärke. Luminous Intensity I F = 20 ma I V (mcd) Bestellnummer Ordering Code

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1 6-lead in-line MULILED Enhanced opical Power LED (hinfilm / hingan) Lead (Pb) Free Produc - RoHS Complian LRB GFG Released Besondere Merkmale Gehäuseyp: weißes P-LCC-6 Gehäuse, Konraserhöhung durch schwarze Oberfläche (RGB-Displays) und diffuser Silikon-Verguß Besonderhei des Baueils: addiive Farbmischung durch unabhängige nseuerung aller Chips Wellenlänge: 65 nm (red), 58 nm (rue green), 47 nm (blau) bsrahlwinkel: Lamberscher Srahler ( ) echnologie: hinfilm (ro), hingan (rue grün, blau) opischer Wirkungsgrad: 45 lm/w (ro), 5 lm/w (rue grün), lm/w (blau) Gruppierungsparameer: Lichsärke, Wellenlänge Verarbeiungsmehode: für alle SM-Besückechniken geeigne Lömehode: Reflow Löen Vorbehandlung: nach JEDEC Level 4 Gurung: mm Gur mi /Rolle, ø8 mm oder 4/Rolle, ø33 mm ESD-Fesigkei: ESD-sensiives Baueil nwendungen Videoleinwände Vollfarb-Displays Feaures package: whie P-LCC-6 package, higher conras by a black surface (RGB-Displays) and diffused silicone resin feaure of he device: addiive mixure of color simuli by independen driving of each chip wavelengh: 65 nm (red), 58 nm (rue green), 47 nm (blue) viewing angle: Lamberian Emier ( ) echnology: hinfilm (red), hingan (rue green, blue) opical efficiency: 45 lm/w (red), 5 lm/w (rue green), lm/w (blue) grouping parameer: luminous inensiy, wavelengh assembly mehods: suiable for all SM assembly mehods soldering mehods: reflow soldering precondiioning: acc. o JEDEC Level 4 aping: mm ape wih /reel, ø8 mm or 4/reel, ø33 mm ESD-wihsand volage: ESD sensiive device pplicaions video walls in oudoor areas full color displays 4--8

2 LRB GFG Besellinformaion Ordering Informaion yp Emissionsfarbe ) Seie 5 Lichsärke ype LRB GFG Color of Emission red rue green blue ) page 5 Luminous Inensiy = m I V (mcd) red rue green blue Besellinformaion Ordering Informaion yp ype LRB GFG-7W-+V77-9+R59-49-L LRB GFG-7W-+V77-9+R59-49-S Besellnummer Ordering Code Q65877 Q6595 nm: Die oben genannen ypbezeichnungen umfassen die besellbaren Selekionen. Diese besehen aus wenigen Helligkeisgruppen (siehe Seie 7 für nähere Informaionen). Es wird nur eine einzige Helligkeisgruppe pro Gur geliefer. Z.B.: LRB GFG-7W-+V77-9+R59-49-L bedeue, dass auf dem Gur nur eine der Helligkeisgruppen 7, 9, U, U5, U7, U9, V, V5, V7, V9 oder W enhalen is. Um die Liefersicherhei zu gewährleisen, können einzelne Helligkeisgruppen nich besell werden. Gleiches gil für die Farben, bei denen Wellenlängengruppen gemessen und gruppier werden. Pro Gur wird nur eine Wellenlängengruppe geliefer. Z.B.: LRB GFG-7W-+V77-9+R59-49-L bedeue, dass auf dem Gur nur eine der Wellenlängengruppen -, -3, -4, -5, -6, -7, -8 oder -9 enhalen is (siehe Seie 8 für nähere Informaion). Z.B.: LRB GFG-7W-+V77-9+R59-49-L bedeue, dass das Baueil innerhalb der auf Seie 4 spezifizieren Grenzen geliefer wird. Um die Liefersicherhei zu gewährleisen, können einzelne Wellenlängengruppen nich besell werden. LRB GFG-7W-+V77-9+R59-49-L bedeue Lieferung auf einer ø33 mm Rolle. LRB GFG-7W-+V77-9+R59-49-S bedeue Lieferung auf einer ø8 mm Rolle. nm: he above ype Numbers represen he order groups which include only a few brighness groups (see page 7 for explanaion). Only one group will be shipped on each reel (here will be no mixing of wo groups on each reel). E.g. LRB GFG-7W-+V77-9+R59-49-L means ha only one group 7, 9, U, U5, U7, U9, V, V5, V7, V9 oder W will be shippable for any one reel. In order o ensure availabiliy, single brighness groups will no be orderable. In a similar manner for colors where wavelengh groups are measured and binned, single wavelengh groups will be shipped on any one reel. E.g. LRB GFG-7W-+V77-9+R59-49-L means ha only wavelengh group -, -3, -4, -5, -6, -7, -8 or -9 will be shippable (see page 8 for explanaion). E.g. LRB GFG-7W-+V77-9+R59-49-L means ha he device will be shiped wihin he specified limis as saed on page 4. In order o ensure availabiliy, single wavelengh groups will no be orderable. LRB GFG-7W-+V77-9+R59-49-L means delivery on ø33 mm reel. LRB GFG-7W-+V77-9+R59-49-S means delivery on ø8 mm reel

3 LRB GFG Grenzwere Maximum Raings Bezeichnung Parameer Beriebsemperaur Operaing emperaure range Lageremperaur Sorage emperaure range Sperrschichemperaur Juncion emperaure Durchlasssrom Forward curren ( S =5 C) Soßsrom Surge curren p = µs, D =.5, =5 C ) Seie 5 Sperrspannung Reverse volage ( =5 C) ) page 5 (min.) (max.) Symbol Symbol red Were Values rue green blue op 4 + C sg 4 + C j + 5 C Einhei Uni m M 3 3 m V R 5 V

4 LRB GFG Kennwere Characerisics ( S = 5 C) Bezeichnung Parameer Wellenlänge des emiieren Liches Wavelengh a peak emission = m 4) Seie 5 Dominanwellenlänge (min.) 4) page 5 Dominan wavelengh (yp.) = m Spekrale Bandbreie bei 5 % I rel max Specral bandwidh a 5 % I rel max = m (yp.) (max.) (yp.) Symbol Symbol red Were Values rue green blue λ peak nm λ dom Einhei Uni nm nm nm λ nm bsrahlwinkel bei 5 % I V (Vollwinkel) (yp.) ϕ Grad Viewing angle a 5 % I V deg. 5) Seie 5 Durchlassspannung (min.) 5) page 5 Forward volage (yp.) = m (max.) Sperrsrom (yp.) Reverse curren (max.) V R = 5 V (blue / rue green); V (red) emperaurkoeffizien von λ peak emperaure coefficien of λ peak = m; C C emperaurkoeffizien von λ dom emperaure coefficien of λ dom = m; C C emperaurkoeffizien von V F emperaure coefficien of V F = m; C C Opischer Wirkungsgrad Opical efficiency = m Wärmewidersand hermal resisance Sperrschich/Umgebung 3) page 5 Juncion/ambien 3 Sperrschich/Löpad Juncion/solder poin 3) Seie 5 * Einzelgruppen siehe Seie 8 Individual groups on page 8 **R h (max) basier auf saisischen Weren R h (max) is based on saisic values (yp.) (yp.) (yp.) (yp.) chip on chips on V F V F V F I R I R V V V µ µ C λpeak nm/k C λdom.7.3. nm/k C V mv/k η op 45 5 lm/w R h J R h J R h JS ** ** ** K/W K/W K/W

5 LRB GFG 6) Seie 5 Farborgruppen Chromaiciy Coordinae Groups 6) page rue green red 63 OH blue

6 LRB GFG Gruppe Group Cx Cy Gruppe Group Cx Cy red nm.: Noe: Die Farbkoordinaen des Mischliches können innerhalb des gekennzeichneen Bereichs des Farbdreiecks erware werden. he color coordinaes of he mixed ligh can be expeced wihin he marked area of he color riangle

7 LRB GFG Floaing Bins red 7 = [mcd] 9 = [mcd] U = [mcd] U5 = [mcd] U7 = [mcd] U9 = [mcd] V = [mcd] V5 = [mcd] V7 = [mcd] V9 =....59[mcd] W = [mcd] Floaing Bins rue green V7 = [mcd] V9 = [mcd] W = [mcd] 5 = [mcd] 7 = [mcd] Floaing Bins blue R5 = 5... [mcd] R7 = [mcd] R9 = [mcd] S = [mcd] S5 = [mcd] S7 = [mcd] S9 = [mcd] = [mcd] 5 = [mcd] 7 = [mcd] 9 = [mcd]

8 LRB GFG 4) Seie 5 Wellenlängengruppen (Dominanwellenlänge) 4) page 5 Wavelengh Groups (Dominan Wavelengh) Gruppe Group rue green Einhei Gruppe blue Uni Group min. max. min. max nm nm nm nm nm nm nm nm nm nm nm nm nm nm Einhei Uni Gruppenbezeichnung auf Eike Group Name on Label Beispiel: 7-+V7-+R5-4 Example: 7-+V7-+R5-4 Brighness Group Wellenlänge (keine Gruppierung) Wavelengh (no grouping) Brighness Group Wellenlänge Wavelengh Helligkeisgruppe Helligkeisgruppe Helligkeisgruppe Brighness Group Wellenlänge Wavelengh (red) (red) (rue green) (rue green) (blue) (blue) 7 V7 R5 4 nm.: In einer Verpackungseinhei / Gur is immer nur eine Helligkeisgruppe pro Farbe enhalen. Noe: No packing uni / ape ever conains more han one brighness group per color

9 LRB GFG 6) Seie 5 Relaive spekrale Emission 6) page 5 Relaive Specral Emission V(λ) = spekrale ugenempfindlichkei / Sandard eye response curve I rel = f (λ); S = 5 C; = m % OHL54 I rel 8 V λ 6 4 red blue rue green nm 7 λ

10 LRB GFG 6) Seie 5 bsrahlcharakerisik 6) page 5 Radiaion Characerisic I rel = f (ϕ); S = 5 C, = m (R); m (); m (B) red, rue green, blue..8 red green blue OHL Viewing ngle 6) Seie 5 bsrahlcharakerisik 6) page 5 Radiaion Characerisic I rel = f (ϕ); S = 5 C, = m (R); m (); m (B) red, rue green, blue..8 red green blue OHL Viewing ngle 4--8

11 LRB GFG 6) Seie 5 Durchlasssrom 6) page 5 Forward Curren = f (V F ); S = 5 C m 5 OHL3763 6) 7) Seie 5 Relaive Lichsärke Relaive Luminous Inensiy I V /I V ( m) = f ( ); S = 5 C I V I V ( m) 6) 7) page 5 OHL48 red rue green blue green blue red V 4.5 6) Seie 5 Relaive Lichsärke Relaive Luminous Inensiy I V /I V (5 C) = f ( S ); = m.6 6) page 5 V F OHL m I V I V (5 C) blue rue green red C j 4--8

12 LRB GFG 6) Seie 5 Dominane Wellenlänge 6) page 5 Dominan Wavelengh blue, λ dom = f ( ); S = 5 C λ dom 475 nm OHL3764 6) Seie 5 Dominane Wellenlänge 6) page 5 Dominan Wavelengh rue green, λ dom = f ( ); S = 5 C λ dom 55 nm OHL m I F m I F 4--8

13 LRB GFG Maximal zulässiger Durchlasssrom ro Max. Permissible Forward Curren red = f (); chip on 5 m 4 OHL3558 Maximal zulässiger Durchlasssrom ro Max. Permissible Forward Curren red = f (); 3 chips on 5 m 4 OHL S 3 S emp. ambien S emp. solder poin C Maximal zulässiger Durchlasssrom rue grün Max. Permissible Forward Curren rue green = f (); chip on 6 m 5 OHL387 3 Maximal zulässiger Durchlasssrom rue grün Max. Permissible Forward Curren rue green = f (); 3 chips on 6 m 5 emp. ambien S emp. solder poin Do no use curren below 3 m C OHL387 4 S 4 S 3 3 S emp. ambien emp. solder poin S emp. ambien emp. solder poin Do no use below 5 m C Do no use below 5 m C

14 LRB GFG Maximal zulässiger Durchlasssrom blau Max. Permissible Forward Curren blue = f (); chip on 6 m 5 OHL3873 Maximal zulässiger Durchlasssrom blau Max. Permissible Forward Curren blue = f (); 3 chips on 6 m 5 OHL S 4 S 3 3 S emp. ambien emp. solder poin S emp. ambien emp. solder poin Do no use below 5 m C Do no use below 5 m C Exemplarische durchschniliche Lebensdauer für milere Helligkeisgruppe Exemplary median Lifeime for median ) page 7 Brighness Group ) Seie 7 Bedingungen Condiions milere Lebensdauer median Lifeime Einhei Uni = m (blue, rue green) = 5 m (red) S = 5 C >.* Beriebssunden operaing hours = 5 m (blue, rue green) = m (red) S = 85 C 7.* Beriebssunden operaing hours * lifeime L5 / B

15 LRB GFG Zulässige Impulsbelasbarkei Permissible Pulse Handling Capabiliy Duy cycle D = parameer, = 5 C = f ( p ); red ( Chip on).4 D = P OHL356 Zulässige Impulsbelasbarkei Permissible Pulse Handling Capabiliy Duy cycle D = parameer, = 5 C = f ( p ); red (3 Chips on).4 D = P OHL D = D = Zulässige Impulsbelasbarkei Permissible Pulse Handling Capabiliy Duy cycle D = parameer, = 85 C = f ( p ); red ( Chip on).4 D = P p s OHL Zulässige Impulsbelasbarkei Permissible Pulse Handling Capabiliy Duy cycle D = parameer, = 85 C = f ( p ); red (3 Chips on).4 D = P p s OHL D = D = p s p s

16 LRB GFG Zulässige Impulsbelasbarkei Permissible Pulse Handling Capabiliy Duy cycle D = parameer, = 5 C = f ( p ); rue green ( Chip on) D = OHL3566 OHL75 Zulässige Impulsbelasbarkei Permissible Pulse Handling Capabiliy Duy cycle D = parameer, = 5 C = f ( p ); rue green (3 Chips on) I F D = P OHL3568 OHL D = D = D = D = Zulässige Impulsbelasbarkei Permissible Pulse Handling Capabiliy Duy cycle D = parameer, = 85 C = f ( p ); rue green ( Chip on) D = s p OHL76 OHL Zulässige Impulsbelasbarkei Permissible Pulse Handling Capabiliy Duy cycle D = parameer, = 85 C = f ( p ); rue green (3 Chips on).4.35 I F.3 D = P s p OHL735 OHL D = D = D = D = s p s p

17 LRB GFG Zulässige Impulsbelasbarkei Permissible Pulse Handling Capabiliy Duy cycle D = parameer, = 5 C = f ( p ); blue ( Chip on) D = OHL75 OHL357 Zulässige Impulsbelasbarkei Permissible Pulse Handling Capabiliy Duy cycle D = parameer, = 5 C = f ( p ); blue (3 Chips on) I F D = P OHL734 OHL D = D = D = D = Zulässige Impulsbelasbarkei Permissible Pulse Handling Capabiliy Duy cycle D = parameer, = 85 C = f ( p ); blue ( Chip on) D = s p OHL76 OHL Zulässige Impulsbelasbarkei Permissible Pulse Handling Capabiliy Duy cycle D = parameer, = 85 C = f ( p ); blue (3 Chips on) I F P D = s p OHL735 OHL D = D = D = D = s p s p

18 LRB GFG 8) Seie 5 Maßzeichnung 8) page 5 Package Oulines C Cahode Blue (B) node Blue (B) C Cahode rue Green () node rue Green () C3 Cahode Red (R) 3 node Red (R)

19 LRB GFG Gewich / pprox. weigh: 8) Seie 5 Gurung / Polariä und Lage Verpackungseinhei 8) page 5 Mehod of aping / Polariy and Orienaion Packing 4 mg /Rolle, ø8 mm oder 4/Rolle, ø33 mm uni /reel, ø8 mm or 4/reel, ø33 mm

20 LRB GFG 8) 9) Seie 5 Empfohlenes Löpaddesign Reflow 8) 9) page 5 Recommended Solder Pad Reflow Löen Soldering Package marking Package marking Solder resis (Lösop Lack) Package marking OHPY

21 LRB GFG Löbedingungen Vorbehandlung nach JEDEC Level 4 Soldering Condiions Precondiioning acc. o JEDEC Level 4 Reflow Löprofil für bleifreies Löen (nach J-SD-D.) Reflow Soldering Profile for lead free soldering (acc. o J-SD-D.) 3 C 5 4 C 7 C L p OH C 5 S 5 5 C s 3 Profile Feaure Ramp-up Rae o Prehea* ) 5 C o 5 C ime s from Smin o Smax (5 C o C Recommendaion Pb-Free (SngCu) ssembly Max. Raings C / sec 3 C / sec s Ramp-up Rae o Peak* ) C / sec 3 C / sec 8 C o P Liquidus emperure L 7 C min. 6sec max. sec ime L above L 8sec max. sec Peak emperaure P 45 C max. 6 C ime wihin 5 C of he specified peak emperaure P - 5K Ramp-down Rae* P o C ime 5 C o Peak emperaure sec min. sec max. 3sec 3 K / sec 6 K / sec maximum ll emperaures refer o he cener of he package, measured on he op of he componen * slope calculaion / : max. 5 sec; fulfillmen for he whole -range max. 8 min. 4--8

22 LRB GFG Barcode-Produk-Eike (BPL) Barcode-Produc-Label (BPL) Gurverpackung ape and Reel EXM MP MPL LE OSRM OSRM Opo Opo Semiconducors ors Semiconducors (6P) BCH (6P) BCH ENO: E NO: Bach Number Bar Code () () LO LO NO: NO: Lo Number MD) MD/M: (9D) D/C: Dae (9D) Code D/C: 34 Bar Code (X) PROD NO: (Q)QY: 9999 (G) GROUP: (X) PROD NO: Produc Code (Q)QY: Produc Quaniy per Reel Bar Code LX XXXX Lxxx xxxx Produc Name RoHS Complian RoHS Complian ML emp S ML emp 45 S C R X XXX C X Sample W BIN: XX-XX-X-XXX-X Bin: Bin Informaion Color Bin: Bin Informaion Color Bin3: Bin Informaion Color 3 ddiional EX Pack: RXX R77 DEMY DEMY XXX PCKVR: Packing ype X_X3_34.34 _ X XX-XX-X-X X-X-X Color Color Color 3 (G) GROUP: X-X-X+X-X-X+X-X-X Forward Volage Group Wavelengh Group Brighness Group OH4563 OH343 D P P F E W N 3. ±.5 P Label Direcion of unreeling ape dimensions in mm (inch) W Direcion of unreeling Leader: min. 4 mm * railer: min. 6 mm * *) Dimensions acc. o IEC 686-3; EI 48-D OHY34 W P P P D E F ±. (.57 ±.4) 8 ±. (.35 ±.4) ±.5 (.79 ±.).5 +. ( ).75 ±. (.69 ±.4) 5.5 ±.5 (.7 ±.) Reel dimensions in mm (inch) W N min W W max 8 (7) (.47) 6 (.36).4 + ( ) 8.4 (.74) 33 (3) (.47) 6 (.36).4 + ( ) 8.4 (.74) 4--8

23 _< C). _< _< C). 44 _< Bin3: ML a C R WE Please check he HIC immidiaely afer bag opening. Discard if circles overrun. void meal conac. Do no ea. LRB GFG rockenverpackung und Maerialien Dry Packing Process and Maerials OSRM Moisure-sensiive label or prin Barcode label Humidiy indicaor Barcode label Comparaor check do 5% % 5% If we, pars sill adequaely dry. change desiccan If we, examine unis, if necessary bake unis If we, examine unis, if necessary bake unis 44 ML a C R CUION his bag conains MOISURE SENSIIVE OPO SEMICONDUCORS LEVEL If blank, see bar code label. Shelf life in sealed bag: 4 monhs a < 4 C and < 9% relaive humidiy (RH).. fer his bag is opened, devices ha will be subjeced o infrared reflow, vapor-phase reflow, or equivalen processing (peak package body emp. If blank, see bar code label a) Mouned wihin a facory condiions of 3 C/6% RH. Floor ime see below b) Sored a % RH. 3. Devices require baking, before mouning, if: a) Humidiy Indicaor Card is > % when read a 3 C ± 5 C, or b) a or b is no me. 4. If baking is required, reference IPC/JEDEC J-SD-33 for bake procedure. Bag seal dae (if blank, seal dae is idenical wih dae code). Dae and ime opened: Moisure Level Floor ime > Year Moisure Level 4 Floor ime 7 Hours Moisure Level Floor ime Year Moisure Level 5 Floor ime 48 Hours Moisure Level a Floor ime 4 Weeks Moisure Level 5a Floor ime 4 Hours Moisure Level 3 Floor ime 68 Hours Moisure Level 6 Floor ime 6 Hours Desiccan Humidiy Indicaor MIL-I-8835 OSRM nm.: Noe: Feucheempfindliche Produke sind verpack in einem rockenbeuel zusammen mi einem rockenmiel und einer Feucheindikaorkare Bezüglich rockenverpackung finden Sie weiere Hinweise im Inerne und in unserem Shor Form Caalog im Kapiel Gurung und Verpackung uner dem Punk rockenverpackung. Hier sind Normenbezüge, uner anderem ein uszug der JEDEC-Norm, enhalen. Moisure-senisive produc is packed in a dry bag conaining desiccan and a humidiy card. Regarding dry pack you will find furher informaion in he inerne and in he Shor Form Caalog in chaper ape and Reel under he opic Dry Pack. Here you will also find he normaive references like JEDEC. Karonverpackung und Maerialien ransporaion Packing and Maerials OH539 Barcode label Barcode label CUION his bag conains MOISURE SENSIIVE OPO SEMICONDUCORS LEVEL If blank, see bar code label. Shelf life in sealed bag: 4 monhs a < 4 C and < 9% relaive humidiy (RH).. fer his bag is opened, devices ha will be subjeced o infrared reflow, vapor-phase reflow, or equivalen processing (peak package body emp. If blank, see bar code label a) Mouned wihin a facory condiions of 3 C/6% RH. Floor ime see below b) Sored a % RH. 3. Devices require baking, before mouning, if: a) Humidiy Indicaor Card is > % when read a 3 C ± 5 C, or b) a or b is no me. 4. If baking is required, reference IPC/JEDEC J-SD-33 for bake procedure. Bag seal dae (if blank, seal dae is idenical wih dae code). Dae and ime opened: Moisure Level Floor ime > Year Moisure Level 4 Floor ime 7 Hours Moisure Level Floor ime Year Moisure Level 5 Floor ime 48 Hours Moisure Level a Floor ime 4 Weeks Moisure Level 5a Floor ime 4 Hours Moisure Level 3 Floor ime 68 Hours Moisure Level 6 Floor ime 6 Hours OSRM Opo Semiconducors (6P) BCH NO: () LO NO: 998 3GH34 Muser (X) PROD NO: (9D) D/C: 45 (Q)QY: LSY 676 Muli OPLED Bin: P-- Bin: Q-- emp S 4 C R 3 6 C R ddiional EX R77 PCKVR: (G) GROUP: R8 DEMY P-+Q- OSRM Opo Semiconducors (6P) BCH NO: () LO NO: 998 3GH34 Muser (X) PROD NO: (9D) D/C: 45 (Q)QY: LSY 676 Muli OPLED Bin: P-- Bin: Q-- Bin3: emp S 4 C R 3 6 C R ddiional EX R77 PCKVR: (G) GROUP: R8 DEMY P-+Q- OSRM Packing Sealing label OH

24 LRB GFG Revision Hisory: 4--8 Previous Version: -3-6 Page Subjecs (major changes since las revision) Dae of change 8 Package oulines updaed Ordering code for reel ø8 mm added OS-IN all Final daashee creaed --7 OS-IN pplicaion recommendaion adaped 4--8 enion please! he informaion describes he ype of componen and shall no be considered as assured characerisics. erms of delivery and righs o change design reserved. Due o echnical requiremens componens may conain dangerous subsances. For informaion on he ypes in quesion please conac our Sales Organizaion. If prined or downloaded, please find he laes version in he Inerne. Packing Please use he recycling operaors known o you. We can also help you ge in ouch wih your neares sales office. By agreemen we will ake packing maerial back, if i is sored. You mus bear he coss of ranspor. For packing maerial ha is reurned o us unsored or which we are no obliged o accep, we shall have o invoice you for any coss incurred. Componens used in life-suppor devices or sysems mus be expressly auhorized for such purpose! Criical componens ) page 5 may only be used in life-suppor devices or sysems ) page 5 wih he express wrien approval of OSRM OS

25 LRB GFG Fußnoen: ) Helligkeiswere werden mi einer Sromeinprägedauer von 5 ms und einer Genauigkei von ± % ermiel. ) Die LED kann kurzzeiig in Sperrichung berieben werden. 3) R hj ergib sich bei Monage auf PC-Board FR 4 (Padgröße 6 mm je Pad) 4) Wellenlängen werden mi einer Sromeinprägedauer von 5 ms und einer Genauigkei von ± nm ermiel. 5) Spannungswere werden mi einer Sromeinprägedauer von ms und einer Genauigkei von ±, V ermiel. 6) Wegen der besonderen Prozessbedingungen bei der Hersellung von LED können ypische oder abgeleiee echnische Parameer nur aufgrund saisischer Were wiedergegeben werden. Diese simmen nich nowendigerweise mi den Weren jedes einzelnen Produkes überein, dessen Were sich von ypischen und abgeleieen Weren oder ypischen Kennlinien unerscheiden können. Falls erforderlich, z.b. aufgrund echnischer Verbesserungen, werden diese ypischen Were ohne weiere nkündigung geänder. 7) Im gesrichelen Bereich der Kennlinien muss mi erhöhen Helligkeisunerschieden zwischen Leuchdioden innerhalb einer Verpackungseinhei gerechne werden. Dimmverhälnis im Gleichsrom-Berieb max. 5: für red 8) Maße werden wie folg angegeben: mm (inch) 9) Gehäuse häl W-Löhize aus nach CECC 8 ) ) Ein kriisches Baueil is ein Baueil, das in lebenserhalenden pparaen oder Sysemen eingesez wird und dessen Defek voraussichlich zu einer Fehlfunkion dieses lebenserhalenden pparaes oder Sysems führen wird oder die Sicherhei oder Effekiviä dieses pparaes oder Sysems beeinrächig. Lebenserhalende pparae oder Syseme sind für (a) die Implanierung in den menschlichen Körper oder (b) für die Lebenserhalung besimm. Falls sie versagen, kann davon ausgegangen werden, dass die Gesundhei und das Leben des Paienen in Gefahr is. Remarks: ) Brighness groups are esed a a curren pulse duraion of 5 ms and a olerance of ± %. ) Driving he LED in reverse direcion is suiable for shor erm applicaion. 3) R hj resuls from mouning on PC board FR 4 (pad size 6 mm per pad) 4) Wavelenghs are esed a a curren pulse duraion of 5 ms and a olerance of ± nm. 5) Forward volages are esed a a curren pulse duraion of ms and a olerance of ±. V. 6) 7) 8) Due o he special condiions of he manufacuring processes of LED, he ypical daa or calculaed correlaions of echnical parameers can only reflec saisical figures. hese do no necessarily correspond o he acual parameers of each single produc, which could differ from he ypical daa and calculaed correlaions or he ypical characerisic line. If requesed, e.g. because of echnical improvemens, hese yp. daa will be changed wihou any furher noice. In he range where he line of he graph is broken, you mus expec higher brighness differences beween single LEDs wihin one packing uni. Dimming range for direc curren mode max. 5: for red Dimensions are specified as follows: mm (inch) 9) Package able o wihsand W-soldering hea acc. o CECC 8 ) criical componen is a componen used in a life-suppor device or sysem whose failure can reasonably be expeced o cause he failure of ha life-suppor device or sysem, or o affec is safey or he effeciveness of ha device or sysem. ) Life suppor devices or sysems are inended (a) o be implaned in he human body, or (b) o suppor and/or mainain and susain human life. If hey fail, i is reasonable o assume ha he healh and he life of he user may be endangered. Published by OSRM Opo Semiconducors GmbH Wernerwerksrasse, D-9349 Regensburg ll Righs Reserved