Reflexlichtschranke mit Schmitt-Trigger Reflective Interrupter with Schmitt-Trigger Lead (Pb) Free Product - RoHS Compliant SFH 9245

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1 Reflexlichtschranke mit Schmitt-Trigger Reflective Interrupter with Schmitt-Trigger Lead (Pb) Free Product - RoHS Compliant SFH 9245 DRAFT - This design is for reference only. Subject to change without notice. Wesentliche Merkmale IR-GaAs-Lumineszenzdiode in Kombination mit einem Schmitt-Trigger IC SFH 9245: Output active low Tageslichtsperrfilter Einschaltstrom: typ. ma Sender und Empfänger galvanisch getrennt Vorbehandlung nach JEDEC Level 4 Anwendungen Optischer Schalter Pulsformer Zähler Features IR-GaAs-emitter in combination with a Schmitt-Trigger IC SFH 9245: Output active low Daylight cut-off filter Threshold current: typ. ma Emitter and detector electrically isolated Preconditioning acc. to JEDEC Level 4 Applications Optical threshold switch Pulseformer Counter Typ Type Bestellnummer Ordering Code SFH 9245 Q65A374 (< 5) I F,ON [ma] (V CC = 5 V,d= mm Kodak neutral white test card with 90% reflection)

2 Grenzwerte (T A = 25 C) Maximum Ratings Bezeichnung Parameter Sender (GaAs-Diode) Emitter (GaAs diode) Sperrspannung Reverse voltage Vorwärtsgleichstrom Forward current Stoßstrom (t P 0 s) Surge current (t P 0 s) Verlustleistung Power dissipation Empfänger (Schmitt-Trigger IC) Detector (Schmitt-Trigger IC) Versorgungsspannung Supply voltage Ausgangsspannung Output voltage Ausgangsstrom Output current (T A = 25 C) Verlustleistung Power dissipation Reflexlichtschranke Light Reflection Switch Betriebs- und Lagertemperatur Operating and storage temperature range Verlustleistung Power dissipation Symbol Symbol Wert Value V R 5 V I F 50 ma I FSM 0.7 A Einheit Unit P tot 00 mw V CC V V O V I O 50 ma P tot 75 mw T op, T stg C P tot 50 mw

3 Kennwerte (T A = 25 C) Characteristics Bezeichnung Parameter Sender (GaAs-Diode) Emitter (GaAs diode) Durchlassspannung Forward voltage I F = 50 ma Sperrstrom Reverse current V R = 5 V Wärmewiderstand (Montage auf PC-Board mit > 5 mm 2 Padgröße) Thermal resistance (mounting on pcb with > 5 mm 2 pad size) Symbol Symbol Wert Value V F.55 (.95) V I R Einheit Unit not designed A for reverse operation R thja 300 K/W Empfänger (Schmitt-Trigger IC) (wenn nicht anders angegeben, V CC = 5 V) Detector (Schmitt-Trigger IC) (unless otherwise specified, V CC = 5 V) Ausgangsspannung high Output voltage high I O = 0 Ausgangsspannung low Output voltage low I O = 6 ma Stromaufnahme Supply current V CC = 5 V V CC = 8 V Anstiegszeit 0% bis 90% Rise time 0% to 90% R L = 280, I F = 20 ma Abfallzeit 90% bis 0% Fall time 90% to 0% R L = 280, I F = 20 ma Ausgangsverzögerungszeit Propagation delay time ON R L = 280, I F = 20 ma V OH V CC (> 4.0) V V OL 0.5 (< 0.4) V I CC 3.3 (< 5) 5.0 ma t r 20 ns t f 0 ns t ON s

4 Kennwerte (T A = 25 C) Characteristics (cont d) Bezeichnung Parameter Ausgangsverzögerungszeit Propagation delay time OFF R L = 280, I F = 20 ma Reflexlichtschranke Light Reflection Switch Schaltschwelle Threshold current, Kodak neutral white test card with 90% reflection V CC = 5 V,d= mm Hysterese Hysteresis Symbol Symbol t OFF 2 s I F, ON (< 5) ma I F, OFF / I F, ON Wert Value 0.6 ( ) Einheit Unit d Reflector with 90% reflexion (Kodak neutral white test card) OHM02257 Zulässiger Arbeitsbereich Operating Conditions Bezeichnung Parameter Versorgungsspannung Supply voltage Ausgangsstrom Output current Symbol Symbol Wert Value V CC 4 8 V I O < 6 ma Einheit Unit Zur Stabilisierung der Versorgung wird ein Stützkondensator (angeschlossen zwischen V CC und GND) von typ. 0. F empfohlen. A bypass capacitor, 0. F typical, connected between V CC and GND is recommended in order to stabilize power supply line

5 Active "Low" Anode Voltage Regulator V CC 0 kω OUT + - Cathode GND Figure Block Diagram OHF03902 V CC V CC = 5 V Input SFH 9245 OUT R L = 280 Ω OUT C = 0. μf R = 47 Ω GND GND OHF00520 Figure 2 Test Circuit for Switching and Response Time Input 50% tphl t PLH Output 90% 50% 0% t f t r OHF03903 Figure 3 Switching Time Definitions

6 Threshold Current vs. Distance I F = f (d) 2 ma IF, ON IF, OFF Relative Threshold E e, ON /E e, ON VCC = 5 V = f (V CC ) E.5 e, ON E e, ON_5 V OHF00507 Supply Current I CC = f (V CC ) 6 I ma CC OHF I F mm d Output Voltage V OL = f (I OUT, V CC ) 3.5 V V OL 3 OHF V 20 V CC Supply Current vs. Ambient Temperature I CC = f (T A, V CC ) 6 ma I CC 5 V CC = 20 V V CC = 5 V OHF V 20 V CC V 0 V 5 V 20 V 4 3 V CC = 0 V V CC = 5 V ma 50 I OUT Perm. Pulse Handling Capability I F = f (t p ), Duty cycle D = parameter, T A = 25 C C 00 T A Perm. Pulse Handling Capability I F = f (t p ), Duty cycle D = parameter, T A = 85 C TBD TBD

7 Maßzeichnung Package Outlines Type SFH 9245 Anode OUT Vcc - GND Cathode Maße in mm / Dimensions in mm

8 Empfohlenes Lötpaddesign Recommended Solder Pad Reflow Löten Reflow Soldering.27 (0.050) 0.6 (0.024).2 (0.047).27 (0.050) Padgeometrie für verbesserte Wärmeableitung Paddesign for improved Heat dissipation Cu-Fläche >5 mm 2 Cu-area >5 mm 2 Lötstopplack Solder resist 3.9 (0.54) OHPY0030 Maße in mm (inch) / Dimensions in mm (inch)

9 Lötbedingungen Soldering Conditions Reflow Lötprofil für bleifreies Löten Reflow Soldering Profile for lead free soldering Vorbehandlung nach JEDEC Level 4 Preconditioning acc. to JEDEC Level 4 (nach J-STD-020D.0) (acc. to J-STD-020D.0) 300 C T C 27 C t P t L T p OHA C 50 t S C s 300 t Profileigenschaften Profile Feature Aufheizrate zum Vorwärmen* ) / Ramp-up rate to preheat* ) 25 C to 50 C Zeit t s von T Smin bis T Smax / Time t s from T Smin to T Smax 50 C to 200 C Bleifreier Aufbau / Pb-Free Assembly (SnAgCu) Empfehlung / Recommendation 2 K / s 3 K / s Grenzwerte / Max. Ratings 00 s min. 60 s max. 20 s Aufheizrate zur Spitzentemperatur* ) / 2 K / s 3 K / s Ramp-up rate to peak* ) 80 C to T P Liquidustemperatur T L / 27 C Liquidus temperature T L Zeit t L über T L / Time t L above T L 80 s max. 00 s Spitzentemperatur T P / Peak temperature T P 245 C max. 260 C Verweilzeit t P innerhalb des spezifizierten Spitzentemperaturbereichs T P - 5 K / Time t P within the specified peak temperature range T P - 5 K 20 s min. 0 s max. 30 s Abkühlrate* ) / Ramp-down rate* ) T P to 00 C 3 K / s 6 K / s maximum Zeitspanne von 25 C bis zur Spitzentemperatur / Time from 25 C to peak temperature max. 8 min. Alle Temperaturen beziehen sich auf die Bauteilmitte, jeweils auf der Bauteiloberseite gemessen / All temperatures refer to the center of the package, measured on the top of the package * Steigungsberechnung T/t: t max. 5 s; erfüllt über den gesamten Temperaturbereich / slope calculation T/t: t max. 5 s; fulfillment for the whole T-range

10 Gurtung / Polarität und Lage siehe Dokument: Short Form Katalog: Gurtung und Verpackung - SMT-Bauelemente - Gehäuse:SMT RLS Methode of Taping / Polarity and Orientation see document: Short Form Catalog: Tape and Reel - SMT-Components - Package: SMT-RLS Published by OSRAM Opto Semiconductors GmbH Leibnizstrasse 4, D Regensburg All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components, may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. Disclaimer OSRAM OS assumes no liability whatsoever for any use of this document or its content by recipient including but not limited to, for any design-in activities based on this preliminary draft version. OSRAM OS may e.g. decide at its sole discretion to stop developing and/or finalising the underlying design at any time