Schmitt-Trigger IC im Smart DIL Gehäuse Schmitt-Trigger IC in Smart DIL Package Lead (Pb) Free Product - RoHS Compliant SFH 5440 SFH 5441

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1 Schmitt-Trigger IC im Smart DIL Gehäuse Schmitt-Trigger IC in Smart DIL Package Lead (Pb) Free Product - RoHS Compliant SFH 5440 SFH 544 Wesentliche Merkmale SFH 5440: Ausgang active low SFH 544: Ausgang active high Gegurtet lieferbar Geeignet für Anwendungen im Bereich von 400 nm bis 00 nm Anwendungen Optischer Schalter Pulsformer Zähler Features SFH 5440: Output active low SFH 544: Output active high Available on tape and reel Suitable for applications from 400 nm to 00 nm Applications Optical threshold switch Pulseformer Counter Typ Type Bestellnummer Ordering Code Gehäuse Package SFH 5440 Q650A Smart-DIL Gehäuse, -Kennzeichnung: SFH 544 Q650A64 breiter Anschluß Smart-DIL package, marking: broad lead

2 Grenzwerte (T A = 5 C) Maximum Ratings Betriebs- und Lagertemperatur Operating and storage temperature range Versorgungsspannung Supply voltage Ausgangsspannung Output voltage Ausgangsstrom Output current Verlustleistung Power dissipation T op ; T stg C V V O V I O 50 ma P tot 75 mw Empfohlener Arbeitsbereich Recommended Operating Conditions Versorgungsspannung Supply voltage Ausgangsstrom Output current 4 8 V I O < 6 ma Zur Stabilisierung der Versorgung wird ein Stützkondensator (angeschlossen zwischen und ) von typ. 0. µf empfohlen. A bypass capacitor, 0. µf typical, connected between and is recommended in order to stabilize power supply line. Kennwerte (T A = 5 C, = 5 V) Characteristics Ausgangsspannung high Output voltage high I O = 0 Ausgangsspannung low Output voltage low I O = 6 ma V OH (> 4.0) V V OL 0.5 (< 0.4) V

3 Kennwerte (T A = 5 C, = 5 V) Characteristics (cont d) Stromaufnahme, E = 0 Supply current = 5 V = 8 V Schaltschwelle, λ = 950 nm Threshold ON SFH 5440: H L SFH 544: L H Hysterese Hysteresis Halbwinkel Half angle Anstiegszeit 0% bis 90% Rise time 0% to 90% R L = 80 Ω, E e = 600 µw/cm, λ = 950 nm Abfallzeit 90% bis 0% Fall time 90% to 0% R L = 80 Ω, E e = 600 µw/cm, λ = 950 nm Ausgangsverzögerungszeit Propagation delay time H L R L = 80 Ω, E e = 600 µw/cm, λ = 950 nm Ausgangsverzögerungszeit Propagation delay time L H R L = 80 Ω, E e = 600 µw/cm, λ = 950 nm I CC 3.3 (< 5) 5.0 ma E e, ON 70 (< 30) µw/cm E e, OFF /E e, ON 0.6 ( ) ϕ ± 60 Grad degr. t r 00 ns t f 00 ns t PHL 5 (< 5) µs t PLH 5 (< 5) µs

4 SFH 544 (Active High ) SFH 5440 (Active Low ) Voltage Regulator Voltage Regulator 0 kω 0 kω OHF0058 Figure Block Diagram = 5 V Input SFH 5440 SFH 544 R L = 80 Ω C = 0. µf R = 47 Ω OHF0050 Figure Test Circuit for Switching and Response Time SFH 5440 (Active Low ) SFH 544 (Active High ) Input Input tphl t PLH t PHL t PLH 90% 90% Output Output t f t r 0% t r t f 0% OHF0059 Figure 3 Switching Time Definitions

5 Relative Threshold E e, ON /E e, ON (Vcc = 5 V) = f ( ) Supply Current I CC = f ( ) Total Power Dissipation P tot = f (T A ) E.5 e, ON E e, ON_5 V OHF I ma CC OHF mw P tot OHF V 0 Output Voltage V OL = f (I, ) 3.5 V V OL 3 OHF V 0 Supply Current vs. Ambient Temperature I CC = f (T A, ) 6 ma I CC 5 = 0 V = 5 V OHF C 00 T A V 0 V 5 V 0 V 4 3 = 0 V = 5 V ma 50 I C 00 T A

6 Maßzeichnung Package Outlines Chip position. (0.043).0 (0.039) 0.3 (0.0) 0. (0.008) 4.8 (0.89) 4.4 (0.73) 0. (0.004) 0.0 (0.000) 0.8 (0.03) 0.6 (0.04) Active area 0. (0.005) 0.5 (0.00) 0.3 (0.0). (0.043) 0.9 (0.035). (0.083).9 (0.075) 0.5 (0.006) ±0. (0.004).7 (0.06).5 (0.098) GEOY6990 Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). Empfohlenes Lötpaddesign Recommended Solderpad Design Padgeometrie für verbesserte Wärmeableitung Paddesign for improved heat dissipation OHF

7 Lötbedingungen Vorbehandlung nach JEDEC Level 4 Soldering Conditions Preconditioning acc. to JEDEC Level 4 IR-Reflow Lötprofil für bleifreies Löten (nach J-STD-00B) IR Reflow Soldering Profile for lead free soldering (acc. to J-STD-00B T 300 C C 40 C 7 C Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile 30 s max 0 s min OHLA C 60 C -5 C 45 C ±5 C +5 C 35 C -0 C Ramp Up 3 K/s (max) 5 C 0 s max 00 s max Ramp Down 6 K/s (max) min. condition for IR Reflow Soldering: solder point temperature 35 C for at least 0 sec s 300 t Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse, D Regensburg All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components, may only be used in life-support devices or systems with the express written approval of OSRAM OS. A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered