Reflexlichtschranke mit Schmitt-Trigger Reflective Interrupter with Schmitt-Trigger Lead (Pb) Free Product - RoHS Compliant SFH 9240

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1 Reflexlichtschranke mit Schmitt-Trigger Reflective Interrupter with Schmitt-Trigger Lead (Pb) Free Product - RoHS Compliant SFH 9240 Wesentliche Merkmale IR-GaAs-Lumineszenzdiode in Kombination mit einem Schmitt-Trigger IC SFH 9240: Output active low Tageslichtsperrfilter Einschaltstrom: typ. 3 ma Sender und Empfänger galvanisch getrennt Vorbehandlung nach JEDEC Level 4 Anwendungen Optischer Schalter Pulsformer Zähler Features IR-GaAs-emitter in combination with a Schmitt-Trigger IC SFH 9240: Output active low Daylight cut-off filter Threshold current: typ. 3 ma Emitter and detector electrically isolated Preconditioning acc. to JEDEC Level 4 Applications Optical threshold switch Pulseformer Counter Typ Type Bestellnummer Ordering Code SFH 9240 Q650A274 3 (< 0) I F,ON [ma] (V CC = 5 V, d = mm Kodak neutral white test card with 90% reflection)

2 Grenzwerte (T A = 25 C) Maximum Ratings Bezeichnung Parameter Wert Value Einheit Unit Sender (GaAs-Diode) Emitter (GaAs diode) Sperrspannung Reverse voltage Vorwärtsgleichstrom Forward current Stoßstrom (t P 0 μs) Surge current (t P 0 μs) Verlustleistung Power dissipation V R 5 V I F 50 ma I FSM.5 A P tot 80 mw Empfänger (Schmitt-Trigger IC) Detector (Schmitt-Trigger IC) Versorgungsspannung Supply voltage Ausgangsspannung Output voltage Ausgangsstrom Output current (T A = 25 C) Verlustleistung Power dissipation V CC V V O V I O 50 ma P tot 75 mw Reflexlichtschranke Light Reflection Switch Betriebs- und Lagertemperatur Operating and storage temperature range Verlustleistung Power dissipation T op, T stg C P tot 50 mw

3 Kennwerte (T A = 25 C) Characteristics Bezeichnung Parameter Wert Value Einheit Unit Sender (GaAs-Diode) Emitter (GaAs diode) Durchlassspannung Forward voltage I F = 50 ma Sperrstrom Reverse current V R = 5 V Kapazität Capacitance V R = 0 V, f = MHz Wärmewiderstand (Montage auf PC-Board mit > 5 mm 2 Padgröße) Thermal resistance (mounting on pcb with > 5 mm 2 pad size) V F.25 (.65) V I R 0.0 ( ) μa C O 25 pf R thja 270 K/W Empfänger (Schmitt-Trigger IC) (wenn nicht anders angegeben, V CC = 5 V) Detector (Schmitt-Trigger IC) (unless otherwise specified, V CC = 5 V) Ausgangsspannung high Output voltage high I O = 0 Ausgangsspannung low Output voltage low I O = 6 ma Stromaufnahme Supply current V CC = 5 V V CC = 8 V Anstiegszeit 0% bis 90% Rise time 0% to 90% R L = 280 Ω, I F = 20 ma Abfallzeit 90% bis 0% Fall time 90% to 0% R L = 280 Ω, I F = 20 ma V OH V CC (> 4.0) V V OL 0.5 (< 0.4) V I CC t r 20 t f (< 5) 5.0 ma ns ns

4 Kennwerte (T A = 25 C) Characteristics (cont d) Bezeichnung Parameter Ausgangsverzögerungszeit Propagation delay time ON R L = 280 Ω, I F = 20 ma Ausgangsverzögerungszeit Propagation delay time OFF R L = 280 Ω, I F = 20 ma Wert Value t ON μs t OFF 2 μs Einheit Unit Reflexlichtschranke Light Reflection Switch Schaltschwelle Threshold current, Kodak neutral white test card with 90% reflection V CC = 5 V, d = mm Hysterese Hysteresis I F, ON 3 (< 0) ma I F, OFF / I F, ON 0.6 ( ) d Reflector with 90% reflexion (Kodak neutral white test card) OHM02257 Zulässiger Arbeitsbereich Operating Conditions Bezeichnung Parameter Versorgungsspannung Supply voltage Ausgangsstrom Output current Wert Value V CC 4 8 V I O < 6 ma Einheit Unit Zur Stabilisierung der Versorgung wird ein Stützkondensator (angeschlossen zwischen V CC und GND) von typ. 0. μf empfohlen. A bypass capacitor, 0. μf typical, connected between V CC and GND is recommended in order to stabilize power supply line

5 Active "Low" Anode Voltage Regulator V CC 0 kω OUT + - Cathode GND Figure Block Diagram OHF03902 V CC V CC = 5 V Input SFH 9240 OUT R L = 280 Ω OUT C = 0. μf R = 47 Ω GND GND OHF00520 Figure 2 Test Circuit for Switching and Response Time SFH 9240 (Active "Low") Input 50% tphl t PLH Output 90% 50% 0% t f t r Figure 3 Switching Time Definitions OHF

6 Threshold Current vs. Distance I F = f (d) Ι F 60 ma 50 OHF00684 Ι F, ON (SFH 9240 H L; SFH 924 L H) Ι F, OFF (SFH 9240 L H; SFH 924 H L) Relative Threshold E e, ON /E e, ON VCC = 5 V = f (V CC ) E.5 e, ON E e, ON_5 V.3 OHF00507 Supply Current I CC = f (V CC ) 6 I ma CC OHF Output Voltage V OL = f (I OUT, V CC ) 3.5 V V OL mm 9 d OHF V 20 V CC Supply Current vs. Ambient Temperature I CC = f (T A, V CC ) 6 ma I CC 5 V CC = 20 V V CC = 5 V OHF V 20 V CC V 0 V 5 V 20 V 4 3 V CC = 0 V V CC = 5 V ma 50 I OUT Perm. Pulse Handling Capability I F = f (t p ), Duty cycle D = parameter, T A = 25 C IF 0 4 ma tp D = T t P T OHF02623 I F C 00 T A Perm. Pulse Handling Capability I F = f (t p ), Duty cycle D = parameter, T A = 85 C IF 0 4 ma tp D = T t P T OHF02622 I F D = D = s 0 t p s 0 t p

7 Maßzeichnung Package Outlines 0.2 M A 0.5 (0.006) 0.3 (0.005) 0.5 (0.020) 0.3 (0.02) 6.2 (0.244) 5.8 (0.228) 3.4 (0.34) 3.0 (0.8) (5 ) (.2 (0.047) typ.) Sender/Emitter (0.4 (0.06) typ.) A (0. (0.004) typ.) ( ).27 (0.050) Raster (spacing) 2.54 (0.00) Raster (spacing) 4.2 (0.65) 3.8 (0.50) (0.05 (0.002) typ.) B 2. (0.083).7 (0.067) Chip Positionen 0. M B Empfänger/Receiver GPLY0504 Type SFH 9240 Anode OUT Vcc - GND Cathode Maße in mm (inch) / Dimensions in mm (inch)

8 Empfohlenes Lötpaddesign Recommended Solder Pad Reflow Löten Reflow Soldering.27 (0.050) 0.6 (0.024).2 (0.047).27 (0.050) Padgeometrie für verbesserte Wärmeableitung Paddesign for improved Heat dissipation Cu-Fläche >5 mm 2 Cu-area >5 mm 2 Lötstopplack Solder resist 3.9 (0.54) OHPY0030 Maße in mm (inch) / Dimensions in mm (inch)

9 Lötbedingungen Soldering Conditions Bauform Type Drypack Level acc. to JEDEC A2-A Tauch-, Schwalllötung Dip, Wave Soldering Peak Temp. (solderbath) Max. Time in Peak Zone Reflowlötung Reflow Soldering Peak Temp. (package temp.) Max. Time in Peak Zone SFH n. a. 260 C 20 sec. n.a. Kolbenlötung Iron Soldering (Iron temp.) Lötbedingungen Vorbehandlung nach JEDEC Level 4 Soldering Conditions Preconditioning acc. to JEDEC Level 4 Reflow Lötprofil für bleifreies Löten (nach J-STD-020C) Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C) T 300 C C 240 C 27 C Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile 0 s min 30 s max OHLA C 260 C -5 C 245 C ±5 C +5 C 235 C -0 C s max 00 s max Ramp Down 6 K/s (max) Ramp Up 3 K/s (max) 25 C s 300 t

10 Gurtung / Polarität und Lage siehe Dokument: Short Form Katalog: Gurtung und Verpackung - SMT-Bauelemente - Gehäuse:SMT RLS Methode of Taping / Polarity and Orientation see document: Short Form Catalog: Tape and Reel - SMT-Components - Package: SMT-RLS Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D Regensburg All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components, may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered