Schnelle PIN-Fotodiode High Speed PIN-Photodiode Lead (Pb) Free Product - RoHS Compliant SFH 2701

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1 Schnelle PIN-Fotodiode High Speed PIN-Photodiode Lead (Pb) Free Product - RoHS Compliant SFH 7 Wesentliche Merkmale Speziell geeignet für Anwendungen von 4nm bis 5nm Sehr kurze Schaltzeit im spezifizierten Wellenlängenbereich Sehr kurze Schaltzeiten bei geringer Sperrspannung (<5V) Extrem kurze Abklingzeit ( slow tail ) IEC Standard 36 Chipled Bauform Anwendungen Optische Laufwerke (CD, DVD) Lichtschranken für Gleich- und Wechselbetrieb Industrieelektronik Messen/Steuern/Regeln Features Especially suitable for applications from 4nm to 5nm Fast switching time within the specified wavelength Fast switching time at low reverse voltage (<5V) Ultra short decay time ( slow tail ) IEC Standard 36 Chipled package Applications Optical Disc Drives (CD, DVD) Photointerrupters Industrial electronics For control and drive circuits Typ Type SFH 7 Bestellnummer Ordering Code Q65A

2 SFH 7 Grenzwerte Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Sperrspannung, t < s Reverse voltage Elektrostatische Entladung Electrostatic Discharge Human Body Model according to EOS/ESD Wert Value T op ; T stg C V R 5 V V R V ESD kv Einheit Unit Kennwerte (T A = 5 C) Characteristics Bezeichnung Parameter Spektrale Fotoempfindlichkeit des Chips Spectral sensitivity of the chip λ = 65nm λ = 78nm Fotostrom, V R = 5 V, E e =.5 mw/cm Photocurrent λ = 65nm λ = 78nm Wellenlänge der max. Fotoempfindlichkeit Wavelength of max. sensitivity Spektraler Bereich der Fotoempfindlichkeit Spectral range of sensitivity S = % of S max Abmessung der bestrahlungsempfindlichen Fläche Dimensions of radiant sensitive area Abstand Chipoberfläche zu Gehäuseoberfläche Distance chip front to case surface Halbwinkel Half angle S λ I P Wert Value min typ max Einheit Unit A/W μa λ S max 8 nm λ nm L B.6.6 mm mm L W H.3 mm ϕ ± 6 Grad deg. 8--4

3 SFH 7 Kennwerte (T A = 5 C) Characteristics (cont d) Bezeichnung Parameter Dunkelstrom, V R = 5 V Dark current Anstiegs- und Abfallzeit des Fotostromes Rise and fall time of the photocurrent, % - 9% V R = 5 V, R L = 5 Ω, λ = 65 nm, I p = ma V R = 5 V, R L = 5 Ω, λ = 78 nm, I p = ma Kapazität, f = MHz, E =, V R = V Capacitance min typ max I R.5 5 na t r, t f.8 t r, t f. Wert Value ns ns C 3 5 pf Einheit Unit Temperaturkoeffizient von S λ Temperature coefficient of S λ λ = 65 nm λ = 78 nm Rauschäquivalente Strahlungsleistung ) Noise equivalent power, V R = 5 V, λ = 65 nm TC I NEP %/K %/K W Hz ) NEP = 7,9 5 I R S λ

4 SFH 7 Relative Spectral Sensitivity S rel = f (λ) % S rel OHF85 Capacitance C = f (V R ), E = 4 pf C 3 OHF39 Switching time t r, t f = f (V R ), t r, t f 8 ns 7 6 OHF nm λ V V R V 6 V R Dark Current I R = f (V R ), E =. na I R OHF394 Dark Current I R = f (T A ), E =, V R = 5V I R na , 5 5 V, C 85 V R T A Directional Characteristics S rel = f (ϕ) 4 3 ϕ. OHF

5 SFH 7 Maßzeichnung Package Outlines.65 (.65).35 (.53) Cathode mark (layout may differ).5 (.49).9 (.36) Center of active area 3.35 (.3) 3.5 (.).9 (.35).5 (.).5 (.85).85 (.73) ø.9 (.35) ø.7 (.8).7 (.8).4 (.6) GPLY734 Maße in mm (inch) / Dimensions in mm (inch) Gehäuse / Package Anschlussbelegung Pin configuration PCB mit klarem Epoxid / PCB with clear epoxy Pad = Kathode / cathode Pad = Anode / anode Kathoden Markierung (grün) kann von der in der Zeichung angegeben Form abweichen. Cathode mark (green) can differ from the form shown in drawing

6 SFH 7 Empfohlenes Lötpaddesign Recommended Solderpad Design.5.5 OHF Maße in mm / Dimensions in mm

7 SFH 7 Lötbedingungen Vorbehandlung nach JEDEC Level 3 Soldering Conditions Preconditioning acc. to JEDEC Level 3 Reflow Lötprofil für bleifreies Löten (nach J-STD-C) Reflow Soldering Profile for lead free soldering (acc. to J-STD-C) T 3 C 5 55 C 4 C 7 C Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile s min 3 s max OHLA687 + C 6 C -5 C 45 C ±5 C +5 C 35 C - C 5 s max s max Ramp Down 6 K/s (max) 5 Ramp Up 3 K/s (max) 5 C s 3 t Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse, D-9349 Regensburg All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components, may only be used in life-support devices or systems with the express written approval of OSRAM OS. A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered