Infrarot-LED Infrared-LED Lead (Pb) Free Product - RoHS Compliant SFH 4281

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1 Infrarot-LED Infrared-LED Lead (Pb) Free Product - RoHS Compliant SFH 4281 Wesentliche Merkmale Emissionswellenlänge 88 nm Homogene Abstrahlcharakteristik Anwendungen Miniaturlichtschranken für Gleich- und Wechsellichtbetrieb Industrieelektronik Messen/Steuern/Regeln Automobiltechnik Sensorik Alarm- und Sicherungssysteme Features Typical peak wavelength 88 nm Homogeneous Radiation Pattern Applications Miniature photointerrupters Industrial electronics For drive and control circuits Automotive technology Sensor technology Alarm and safety equipment Typ Type Bestellnummer Ordering Code Strahlstärkegruppierung 1) (I F = ma, t p = 2 ms) Radiant Intensity Grouping 1) I e (mw/sr) -P -Q SFH 4281 Q651A ) gemessen bei einem Raumwinkel Ω =.1 sr / measured at a solid angle of Ω =.1 sr

2 Grenzwerte (T A = 25 C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Durchlassstrom Forward current Stoßstrom, τ = µs, D = Surge current Verlustleistung Power dissipation Wärmewiderstand Sperrschicht - Umgebung bei Montage auf FR4 Platine, Padgröße je 16 mm 2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm 2 each Wärmewiderstand Sperrschicht - Lötstelle bei Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block Wert Value T op ; T stg 4 + C V R 5 V I F ma I FSM 2.5 A Einheit Unit P tot 18 mw R thja R thjc 45 2 K/W K/W Kennwerte (T A = 25 C) Characteristics Bezeichnung Parameter Wellenlänge der Strahlung Wavelength at peak emission I F = ma, t p = 2 ms Spektrale Bandbreite bei 5% von I max Spectral bandwidth at 5% of I max I F = ma Abstrahlwinkel Half angle Aktive Chipfläche Active chip area Abmessungen der aktiven Chipfläche Dimension of the active chip area Wert Value λ peak 88 nm λ 8 nm Einheit Unit ϕ ± 6 Grad deg. A.9 mm 2 L B L W.3.3 mm

3 Kennwerte (T A = 25 C) Characteristics (cont d) Bezeichnung Parameter Schaltzeiten, I e von % auf 9% und von 9% auf %, bei I F = ma, R L = 5 Ω Switching times, Ι e from % to 9% and from 9% to %, I F = ma, R L = 5 Ω Kapazität Capacitance V R = V, f = 1 MHz Durchlassspannung Forward voltage I F = ma, t p = 2 ms I F = 1 A, t p = µs Sperrstrom Reverse current V R = 5 V Gesamtstrahlungsfluss Total radiant flux I F = ma, t p = 2 ms Temperaturkoeffizient von I e bzw. Φ e, I F = ma Temperature coefficient of I e or Φ e, I F = ma Temperaturkoeffizient von V F, I F = ma Temperature coefficient of V F, I F = ma Temperaturkoeffizient von λ, I F = ma Temperature coefficient of λ, I F = ma Wert Value t r, t f.5 µs C o 15 pf V F 1.5 ( 1.8) V F 3. ( 3.8) V V I R.1 ( 1) µa Einheit Unit Φ e 23 mw TC I.5 %/K TC V 2 mv/k TC λ +.25 nm/k

4 Strahlstärke I e in Achsrichtung gemessen bei einem Raumwinkel Ω =.1 sr Radiant Intensity I e in Axial Direction at a solid angle of Ω =.1 sr Bezeichnung Parameter Strahlstärke Radiant intensity I F = ma, t p = 2 ms I e min 4 I e max 8 Werte Values -P -Q Einheit Unit mw/sr mw/sr Strahlstärke Radiant intensity I F = 1 A, t p = µs I e typ. 5 6 mw/sr

5 Relative Spectral Emission I rel = f (λ) Ι rel % 8 OHR877 Ι Radiant Intensity e Ι e ma = f (I F ) Single pulse, t p = 2 µs 2 Ι e Ι e (ma) 1 OHR878 Max. Permissible Forward Current I F = f (T A ) 12 ma OHR R thja = 45 K/W nm λ Forward Current I F = f (V F ), single pulse, t p = 2 µs 1 A OHR ma 4 Permissible Pulse Handling Capability I F = f (t p ), T A = 25 C duty cycle D = Parameter 4 ma D = OHR C 12 T A V 8 V F Radiation Characteristics S rel = f (ϕ) OHL166 ϕ 1. 2 DC t p D = T t p T s 2 t p

6 Maßzeichnung Package Outlines 3.4 (.134) 3. (.118) 3. (.118) 2.6 (.2) 2.3 (.91) 2.1 (.83) (2.4 (.94)).3 (.12) max 2.1 (.83) 1.7 (.67) 1. (.39).9 (.35).3 (.12) min 5.4 (.213) 5. (.197) A 4 ±1...1 (.4) C Cathode marking.6 (.24).4 (.16) GPLY6899 Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch)

7 Empfohlenes Lötpaddesign Recommended Solder Pad IR-Reflow Löten IR Reflow Soldering 6 (.236) 1.2 (.47) 2.6 (.2) Padgeometrie für verbesserte Wärmeableitung Paddesign for improved heat dissipation 6 (.236) 1.2 (.47) 2.6 (.2) Cu-Fläche > 16 mm Cu-area > 16 mm (.1) 2.4 (.94) Hole on PCB Lötstopplack Solder resist OHLPY977 Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch)

8 Lötbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Conditions Preconditioning acc. to JEDEC Level 2 IR-Reflow Lötprofil für bleifreies Löten (nach J-STD-2B) IR Reflow Soldering Profile for lead free soldering (acc. to J-STD-2B) T 3 C C 24 C 217 C Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile 3 s max s min OHLA687 + C 26 C -5 C 245 C ±5 C +5 C 235 C - C s max s max Ramp Down 6 K/s (max) 5 Ramp Up 3 K/s (max) 25 C Wellenlöten (TTW) (nach CECC 82) TTW Soldering (acc. to CECC 82) min. condition for IR Reflow Soldering: solder point temperature 235 C for at least sec s 3 t T 3 C C C 1. Welle 1. wave s 2. Welle 2. wave Normalkurve standard curve Grenzkurven limit curves OHLY C C ca 2 K/s 5 K/s 2 K/s 5 2 K/s Zwangskühlung forced cooling s 25 t

9 Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-9349 Regensburg All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1, may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered