Hyper SIDELED Hyper-Bright LED LS A676, LA A676, LO A676, LY A676

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1 Hyper SIDELED Hyper-Brigh LED LS A676, LA A676, LO A676, LY A676 Non-RoHS complian version of produc will be disconinued acc. o OS-PD-2-. he produc iself will remain wihin RoHS complian version. Besondere Merkmale Gehäuseyp: weißes SM Gehäuse, farbloser klarer Verguss Besonderhei des Baueils: Absrahlung parallel zur Plaine, deshalb ideal zur Einkopplung in Lichleier Wellenlänge: 633 nm (super-ro), 61 nm (amber), 66 nm (orange), 87 nm (gelb) Absrahlwinkel: Lamberscher Srahler (12 ) echnologie: InGaAlP opischer Wirkungsgrad: 11 lm/w (gelb, orange, amber), 7 lm/w (super-ro) Gruppierungsparameer: Lichsärke, Wellenlänge Verarbeiungsmehode: für alle SM-Besückechniken geeigne Lömehode: IR Reflow Löen und Wellenlöen (W) Vorbehandlung: nach JEDEC Level 2 Gurung: 12-mm Gur mi 2/Rolle, ø33 mm ESD-Fesigkei: ESD-sicher bis 2 kv nach JESD22-A114-B Anwendungen opischer Indikaor Einkopplung in Lichleier Hinerleuchung (LCD, Schaler, asen, Displays, Werbebeleuchung, Allgemeinbeleuchung) Innenbeleuchung im Auomobilbereich (z.b. Insrumenenbeleuchung, u.ä.) Markierungsbeleuchung (z.b. Sufen, Fluchwege, u.ä.) Signal- und Symbolleuchen Feaures package: whie SM package, colorless clear resin feaure of he device: radiaion direcion parallel o PCB, so an ideal LED for coupling in ligh guides wavelengh: 633 nm (super-red), 61 nm (amber), 66 nm (orange), 87 nm (yellow) viewing angle: Lamberian Emier (12 ) echnology: InGaAlP opical efficiency: 11 lm/w (yellow, orange, amber), 7 lm/w (super-red) grouping parameer: luminous inensiy, wavelengh assembly mehods: suiable for all SM assembly mehods soldering mehods: IR reflow soldering and W soldering precondiioning: acc. o JEDEC Level 2 aping: 12 mm ape wih 2/reel, ø33 mm ESD-wihsand volage: up o 2 kv acc. o JESD22-A114-B Applicaions opical indicaors coupling ino ligh guides backlighing (LCD, swiches, keys, displays, illuminaed adverising, general lighing) inerior auomoive lighing. (e.g. dashboard backlighing, ec.) marker lighs (e.g. seps, exi ways, ec.) signal and symbol luminaire

2 Besellinformaion Ordering Informaion yp Emissionsfarbe 1) Seie 1 Lichsärke 2) Seie 1 Lichsrom Besellnummer ype Color of Emission Luminous 1) page 1 Inensiy Luminous 2) page 1 Flux Ordering Code = 2 ma I V (mcd) = 2 ma Φ V (mlm) LS A676-Q1R2-1 LS A676-R1S1-1 LS A676-P2S1-1 super-red (yp.) 47 (yp.) 4 (yp.) Q61A137 Q61A1376 Q61A1374 LA A676-R1S2-1 LA A676-S11-1 LA A676-Q21-1 amber (yp.) 7 (yp.) 63 (yp.) Q6273Q4973 Q61A1322 Q61A132 LO A676-R1S2-24 LO A676-S11-24 LO A676-Q21-24 orange (yp.) 7 (yp.) 63 (yp.) Q6273Q33 Q61A1346 Q61A1344 LY A676-R1S2-26 LY A676-S11-26 LY A676-Q21-26 yellow (yp.) 7 (yp.) 63 (yp.) Q61A147 Q61A148 Q61A146 Anm.: - 1 Gesamer Farbbereich (siehe Seie 4) -24 Gesamer Farbbereich, Lieferung in Einzelgruppen (siehe Seie ) -26 Gesamer Farbbereich, Lieferung in Einzelgruppen (siehe Seie ) Noe: - 1 oal color olerance range (see page 4) -24 oal color olerance range, delivery in single groups (see page ) -26 oal color olerance range, delivery in single groups (see page )

3 Grenzwere Maximum Raings Bezeichnung Parameer Beriebsemperaur Operaing emperaure range Lageremperaur Sorage emperaure range Sperrschichemperaur Juncion emperaure Durchlasssrom Forward curren ( A =2 C) Soßsrom Surge curren µs, D =., A =2 C 3) Seie 1 Sperrspannung 3) page 1 Reverse volage ( A =2 C) Leisungsaufnahme Power consumpion ( A =2 C) Wärmewidersand hermal resisance Sperrschich/Umgebung 4) page 1 Juncion/ambien Sperrschich/Löpad Juncion/solder poin 4) Seie 1 Symbol Symbol LS, LO, LA Were Values LY op 4 + C sg 4 + C j + 12 C 3 ma M 1.2 A V R 12 V Einhei Uni P o 8 mw R h JA R h JS 3 3 K/W K/W

4 Kennwere Characerisics ( A = 2 C) Bezeichnung Parameer Wellenlänge des emiieren Liches Wavelengh a peak emission = 2 ma ) Seie 1 Dominanwellenlänge ) page 1 Dominan wavelengh = 2 ma Spekrale Bandbreie bei % I rel max Specral bandwidh a % I rel max = 2 ma (yp.) (yp.) Symbol Symbol Were Values LS LA LO LY λ peak nm λ dom 633 ± 6 61 ± 6 66* 6/+3 87* 7/+8 Einhei Uni nm λ nm Absrahlwinkel bei % I V (Vollwinkel) (yp.) 2ϕ Grad Viewing angle a % I V deg. 6) Seie 1 Durchlassspannung (min.) 6) page 1 Forward volage (yp.) = 2 ma (max.) Sperrsrom (yp.) Reverse curren (max.) V R = 12 V emperaurkoeffizien von λ peak emperaure coefficien of λ peak = 2 ma; C C emperaurkoeffizien von λ dom emperaure coefficien of λ dom = 2 ma; C C emperaurkoeffizien von V F emperaure coefficien of V F = 2 ma; C C Opischer Wirkungsgrad Opical efficiency = 2 ma * Einzelgruppen siehe Seie Individual groups on page (yp.) (yp.) (yp.) (yp.) V F V F V F I R.1 I R V V V µa µa C λpeak nm/k C λdom nm/k C V mv/k η op lm/w

5 ) Seie 1 Wellenlängengruppen (Dominanwellenlänge) ) page 1 Wavelengh Groups (Dominan Wavelengh) Gruppe Group yellow orange Einhei min. max. min. max. Uni nm nm nm nm nm Helligkeis-Gruppierungsschema Brighness Groups Helligkeishalbgruppe Brighness Half Group P2 Q1 Q2 R1 R2 S1 S2 1 1) Seie 1 Lichsärke Luminous Inensiy I V (mcd) ) page 1 2) Seie 1 Lichsrom Luminous Flux Φ V (mlm) 18 (yp.) 23 (yp.) 29 (yp.) 36 (yp.) 4 (yp.) 7 (yp.) 7 (yp.) 89 (yp.) 2) page 1 Anm.: Die Sandardlieferform von Serienypen beinhale enweder eine unere Familiengruppe, eine obere Familiengruppe oder eine Sammelgruppe, die aus nur 3 bzw. 4 bzw. 6 Helligkeishalbgruppen besehen. Einzelne Helligkeishalbgruppen können nich besell werden. Noe: he sandard shipping forma for serial ypes includes eiher a lower familiy group, an upper family group or a grouping of all individual groups of 3 or 4 or 6 individual brighness half groups. Individual brighness half groups canno be ordered. Gruppenbezeichnung auf Eike Group Name on Label Beispiel: R1-4 Example: R1-4 Helligkeishalbgruppe Brighness Half Group R1 4 Wellenlänge Wavelengh Anm.: In einer Verpackungseinhei / Gur is immer nur eine Gruppe für jede Selekion enhalen. Noe: No packing uni / ape ever conains more han one group for each selecion. 2-4-

6 2) Seie 1 Relaive spekrale Emission 2) page 1 Relaive Specral Emission V(λ) = spekrale Augenempfindlichkei / Sandard eye response curve I rel = f (λ); A = 2 C; = 2 ma OHL23 I rel % 8 V λ 6 4 yellow orange amber super-red 2 4 2) Seie 1 Absrahlcharakerisik Radiaion Characerisic I rel = f (ϕ); A = 2 C nm 7 λ 2) page OHL166 ϕ

7 2) Seie 1 Durchlasssrom 2) page 1 Forward Curren = f (V F ); A = 2 C 2 ma OHL232 2) 7) Seie 1 Relaive Lichsärke Relaive Luminous Inensiy I V /I V(2 ma) = f ( ); A = 2 C I V 1 I V (2 ma) 2) 7) page 1 OHL super-red yellow orange/amber V 3.4 V F Maximal zulässiger Durchlasssrom Max. Permissible Forward Curren = f () 3 ma OHL31 A S -2 1 ma 2 2) Seie 1 Relaive Lichsärke 2) page 1 Relaive Luminous Inensiy I V /I V(2 C) = f ( j ); = 2 ma I 2. V I V (2 C) orange yellow amber super-red OHL A emp. ambien S emp. solder poin.4 orange yellow amber super-red C C j

8 Zulässige Impulsbelasbarkei = f ( p ) Permissible Pulse Handling Capabiliy Duy cycle D = parameer, A = 2 C LS, LA, LO Zulässige Impulsbelasbarkei = f ( p ) Permissible Pulse Handling Capabiliy Duy cycle D = parameer, A = 2 C LY A -1 D = OHL318 A -1 D = P P D = OHL316 P D = P s 2 p Zulässige Impulsbelasbarkei = f ( p ) Permissible Pulse Handling Capabiliy Duy cycle D = parameer, A = 8 C LS, LA, LO A D = P P OHL s 2 p Zulässige Impulsbelasbarkei = f ( p ) Permissible Pulse Handling Capabiliy Duy cycle D = parameer, A = 8 C LY A D = P P OHL D = D = s 2 p s 2 p

9 8) Seie 1 Maßzeichnung 8) page 1 Package Oulines (2.4 (.94)) 2.8 (.1) Cahode 2.4 (.94) 2.4 (.) spacing 4.2 (.16) 3.8 (.1) 1.1 (.43).9 (.3) Anode.7 (.28) (2.8 (.112)) Cahode marking (1.4 (.)) (2.9 (.114)) (R1) (.3 (.12)) 3.8 (.1) 3.4 (.134) C A 4.2 (.16) 3.8 (.1) GPLY688 Kahodenkennung: Cahode mark: Gewich / Approx. weigh: abgeschräge Ecke bevelled edge 4 mg 8) Seie 1 Gurung / Polariä und Lage Verpackungseinhei Mehod of aping / Polariy and Orienaion 8) page 1 Packing 2/Rolle, ø33 mm uni 2/reel, ø33 mm 1. (.9) 4 (.17) 2 (.79) Cahode/Collecor Marking 4.2 (.167) 8 (.31) 3.9 (.16). (.217) 1.7 (.69) 12 (.472) OHAY

10 8) Seie 1 Empfohlenes Löpaddesign Wellenlöen 8) page 1 Recommended Solder Pad W (W) Soldering 4.2 (.16) 4. (.177) 1.7 (.67) Padgeomerie für verbessere Wärmeableiung Paddesign for improved hea dissipaion Pick up Area Lösopplack Solder resis Cu Fläche > 16 mm 2 per pad Cu-area OHPY132 8) Seie 1 Empfohlenes Löpaddesign IR 8) page 1 Recommended Solder Pad IR Reflow Löen Reflow Soldering 3.7 (.146) 3. (.118) 1.2 (.47) Padgeomerie für verbessere Wärmeableiung Paddesign for improved hea dissipaion 2 Cu-Fläche > 16 mm 2 Cu-area > 16 mm Lösopplack Solder resis OHLPY

11 Löbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Condiions Precondiioning acc. o JEDEC Level 2 IR-Reflow Löprofil (nach IPC 91) IR Reflow Soldering Profile (acc. o IPC 91) 3 C OHLY C -4 s o 18 s 183 C ramp-down rae up o 6 K/s ramp-up rae up o 6 K/s defined for Precondiioning: 2-3 K/s defined for Precondiioning: up o 6 K/s 1 2 s 2 Wellenlöen (W) (nach CECC 82) W Soldering (acc. o CECC 82) 3 C C C 1. Welle 1. wave s 2. Welle 2. wave Normalkurve sandard curve Grenzkurven limi curves OHLY98 1 ca 2 K/s K/s 2 K/s C C 2 K/s Zwangskühlung forced cooling 1 2 s

12 Barcode-Produk-Eike (BPL) Barcode-Produc-Label (BPL) OSRAM Opo Semiconducors (6P) BACH NO: Bach Number Bar Code (1) LO NO: Lo Number Bar Code (X) PROD NO: Produc Code (9D) D/C: Dae Code (Q)QY: Produc Quaniy per Reel Lx xxxx Produc Name (G) GROUP: X - X - X Forward Volage Rank Wavelengh Rank Brighness Rank Sample Bar Code Bin1: Bin Informaion Color 1 Bin2: Bin3: ML emp S 2 24 C R 2 26 C Addiional EX R77 DEMY PACKVAR: Packing ype OHA243 Gurverpackung ape and Reel W 1 D P P 2 F E W A N 13. ±.2 P 1 Label Direcion of unreeling W 2 Gurvorlauf: Leader: Gurende: railer: 4 mm 4 mm 16 mm 16 mm Direcion of unreeling OHAY324 ape dimensions in mm (inch) W P P 1 P 2 D E F ±.1 8 ±.1 (.17 ±.4) (.31 ±.4) 2 ±. (.79 ±.2) ±.1 (.9 +.4) (.69 ±.4). ±. (.217 ±.2) Reel dimensions in mm (inch) A W N min W 1 W 2 max 33 (13) 12 (.472) 6 (2.362) ( ) 18.4 (.724)

13 _< % RH. C). LEVEL If blank, see bar code label _< _< % RH. (6P) BACH NO: C). (1) LO NO: 11 LEVEL 2 (9D) D/C: If blank, see bar code label 144 _< LSY 676 Bin1: P-1-2 Bin2: Q-1-2 Bin3: ML emp S 2 22 C R 2a 24 C R 3 26 C R Addiional EX R77 PACKVAR: (1) LO NO: WE Please check he HIC immidiaely afer bag opening. Discard if circles overrun. Avoid meal conac. Do no ea. LS A676, LA A676, LO A676, LY A676 rockenverpackung und Maerialien Dry Packing Process and Maerials OSRAM Moisure-sensiive label or prin Barcode label Humidiy indicaor Barcode label 1% % Comparaor check do % If we, pars sill adequaely dry. change desiccan If we, examine unis, if necessary bake unis If we, examine unis, if necessary bake unis (G) GROUP: 1 2 DEMY R18 (9D) D/C: 144 LSY 676 P-1+Q-1 Bin1: P-1-2 Bin2: Q-1-2 Bin3: ML emp S 2 22 C R 2a 24 C R 3 26 C R DEMY (G) GROUP: Addiional EX R77 PACKVAR: R18 P-1+Q-1 CAUION his bag conains MOISURE SENSIIVE OPO SEMICONDUCORS 3 C/6% RH. Moisure Level 4 Moisure Level Floor ime 72 Hours Floor ime 48 Hours Floor ime 24 Hours 1. Shelf life in sealed bag: 24 monhs a < 4 C and < 9% relaive humidiy (RH). 2. Afer his bag is opened, devices ha will be subjeced o infrared reflow, vapor-phase reflow, or equivalen processing (peak package body emp. If blank, see bar code label a) Mouned wihin a facory condiions of Floor ime see below b) Sored a 3. Devices require baking, before mouning, if: a) Humidiy Indicaor Card is > % when read a 23 C ± C, or b) 2a or 2b is no me. 4. If baking is required, reference IPC/JEDEC J-SD-33 for bake procedure. Bag seal dae (if blank, seal dae is idenical wih dae code). Dae and ime opened: Moisure Level 1 Floor ime > 1 Year Moisure Level 2 Floor ime 1 Year Moisure Level 2a Floor ime 4 Weeks Moisure Level a Moisure Level 3 Floor ime 168 Hours Moisure Level 6 Floor ime 6 Hours Desiccan Humidiy Indicaor MIL-I-883 OSRAM OHA39 Anm.: Feucheempfindliche Produke sind verpack in einem rockenbeuel zusammen mi einem rockenmiel und einer Feucheindikaorkare Bezüglich rockenverpackung finden Sie weiere Hinweise im Inerne und in unserem Shor Form Caalog im Kapiel Gurung und Verpackung uner dem Punk rockenverpackung. Hier sind Normenbezüge, uner anderem ein Auszug der JEDEC-Norm, enhalen. Noe: Moisure-senisive produc is packed in a dry bag conaining desiccan and a humidiy card. Regarding dry pack you will find furher informaion in he inerne and in he Shor Form Caalog in chaper ape and Reel under he opic Dry Pack. Here you will also find he normaive references like JEDEC. Karonverpackung und Maerialien ransporaion Packing and Maerials Barcode label CAUION his bag conains MOISURE SENSIIVE OPO SEMICONDUCORS 1. Shelf life in sealed bag: 24 monhs a < 4 C and < 9% relaive humidiy (RH). 2. Afer his bag is opened, devices ha will be subjeced o infrared reflow, vapor-phase reflow, or equivalen processing (peak package body emp. a) Mouned wihin a facory condiions of b) Sored a 3. Devices require baking, before mouning, if: a) Humidiy Indicaor Card is > % when read a 23 C ± C, or b) 2a or 2b is no me. 4. If baking is required, reference IPC/JEDEC J-SD-33 for bake procedure. Bag seal dae (if blank, seal dae is idenical wih dae code). Dae and ime opened: Moisure Level 1 Moisure Level 2 Moisure Level 2a Moisure Level a Moisure Level 3 Floor ime 168 Hours Moisure Level 6 Floor ime 6 Hours If blank, see bar code label Floor ime see below Floor ime > 1 Year Floor ime 1 Year Floor ime 4 Weeks 3 C/6% RH. OSRAM Opo Moisure Level 4 Floor ime 72 Hours Moisure Level Floor ime 48 Hours Floor ime 24 Hours Semiconducors (6P) BACH NO: GH1234 Muser (X) PROD NO: 1 Muli OPLED 4 (Q)QY: 2 Barcode label OSRAM Opo Semiconducors GH1234 Muser (X) PROD NO: 1 4 (Q)QY: 2 Muli OPLED OSRAM Packing Sealing label OHA

14 Revision Hisory: 2-4- Previous Version: Page Subjecs (major changes since las revision) Dae of change 1 ESD norm ambien emperaure , Changes according o Informaion Noe OS-IN all new emplae all Disconinuaion of non-rohs complian produc versions 2-4- Aenion please! he informaion describes he ype of componen and shall no be considered as assured characerisics. erms of delivery and righs o change design reserved. Due o echnical requiremens componens may conain dangerous subsances. For informaion on he ypes in quesion please conac our Sales Organizaion. If prined or downloaded, please find he laes version in he Inerne. Packing Please use he recycling operaors known o you. We can also help you ge in ouch wih your neares sales office. By agreemen we will ake packing maerial back, if i is sored. You mus bear he coss of ranspor. For packing maerial ha is reurned o us unsored or which we are no obliged o accep, we shall have o invoice you for any coss incurred. Componens used in life-suppor devices or sysems mus be expressly auhorized for such purpose! Criical componens 9) page 1 may only be used in life-suppor devices or sysems ) page 1 wih he express wrien approval of OSRAM OS

15 Fußnoen: 1) Helligkeiswere werden mi einer Sromeinprägedauer von 2 ms und einer Genauigkei von ± 11% ermiel. 2) Wegen der besonderen Prozessbedingungen bei der Hersellung von LED können ypische oder abgeleiee echnische Parameer nur aufgrund saisischer Were wiedergegeben werden. Diese simmen nich nowendigerweise mi den Weren jedes einzelnen Produkes überein, dessen Were sich von ypischen und abgeleieen Weren oder ypischen Kennlinien unerscheiden können. Falls erforderlich, z.b. aufgrund echnischer Verbesserungen, werden diese ypischen Were ohne weiere Ankündigung geänder. 3) Die LED kann kurzzeiig in Sperrichung berieben werden. 4) R hja ergib sich bei Monage auf PC-Board FR 4 (Padgröße 16 mm 2 je Pad) ) Wellenlängen werden mi einer Sromeinprägedauer von 2 ms und einer Genauigkei von ±1 nm ermiel. 6) Spannungswere werden mi einer Sromeinprägedauer von 1 ms und einer Genauigkei von ±,1 V ermiel. 7) Im gesrichelen Bereich der Kennlinien muss mi erhöhen Helligkeisunerschieden zwischen Leuchdioden innerhalb einer Verpackungseinhei gerechne werden 8) 9) Maße werden wie folg angegeben: mm (inch) Ein kriisches Baueil is ein Baueil, das in lebenserhalenden Apparaen oder Sysemen eingesez wird und dessen Defek voraussichlich zu einer Fehlfunkion dieses lebenserhalenden Apparaes oder Sysems führen wird oder die Sicherhei oder Effekiviä dieses Apparaes oder Sysems beeinrächig. ) Lebenserhalende Apparae oder Syseme sind für (a) die Implanierung in den menschlichen Körper oder (b) für die Lebenserhalung besimm. Falls sie versagen, kann davon ausgegangen werden, dass die Gesundhei und das Leben des Paienen in Gefahr is. Remarks: 1) Brighness groups are esed a a curren pulse duraion of 2 ms and a olerance of ± 11%. 2) Due o he special condiions of he manufacuring processes of LED, he ypical daa or calculaed correlaions of echnical parameers can only reflec saisical figures. hese do no necessarily correspond o he acual parameers of each single produc, which could differ from he ypical daa and calculaed correlaions or he ypical characerisic line. If requesed, e.g. because of echnical improvemens, hese yp. daa will be changed wihou any furher noice. 3) Driving he LED in reverse direcion is suiable for shor erm applicaion. 4) R hja resuls from mouning on PC board FR 4 (pad size 16 mm 2 per pad) ) Wavelenghs are esed a a curren pulse duraion of 2 ms and a olerance of ±1 nm. 6) Forward volages are esed a a curren pulse duraion of 1 ms and a olerance of ±.1 V. 7) In he range where he line of he graph is broken, you mus expec higher brighness differences beween single LEDs wihin one packing uni. 8) Dimensions are specified as follows: mm (inch) 9) A criical componen is a componen used in a life-suppor device or sysem whose failure can reasonably be expeced o cause he failure of ha life-suppor device or sysem, or o affec is safey or he effeciveness of ha device or sysem. ) Life suppor devices or sysems are inended (a) o be implaned in he human body, or (b) o suppor and/or mainain and susain human life. If hey fail, i is reasonable o assume ha he healh and he life of he user may be endangered. Published by OSRAM Opo Semiconducors GmbH Wernerwerksrasse 2, D-9349 Regensburg All Righs Reserved