Packaging in the lot Era 16. Packaging for Advanced Microsystems 25

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1 Table of Contents Chapter I: Overview Articles Packaging in the lot Era 16 Herbert Reichl Packaging for Advanced Microsystems 25 Guido Spinola Durante, Mark Fretz, Edith Rutz-Innerhofer, Rony Jose James, Sandra Giudice, Stefan Mohrdiek, Philippe Niedermann, Jörg Pierer, Christian Bosshard Smart Systems Integration - Short Review and Further Development 32 of Smart Systems Thomas Gessner, Martina Vogel, Karla Hiller, Thomas Otto, Steffen Kurth, Jörg Nestler, Thomas Koehler 3D Wafer Level Integration - Status and Requirements 39 M. Jürgen Wolf, The TAO of Packaging DNA - Wirebond, Flip Chip and Wafer Level 45 Packaging William Chen, John Hunt Plastic Encapsulated Devices for High-Rel, Where Hermetics Fail 50 Nihal Sinnadurai Electrostatic Self-Assembly on a Liquid Film for the High-Precision 57 Mounting of MEMS Marcel Tondorf, Yifei Gan, Jürgen Wilde On the Application of the M3-Approach for Optimization of Integrated 64 Antennas and High-Speed System Packages Micha Bierwirth, Brian Curran, Xiaomin Duan, Gerhard Fotheringham,, Uwe Maaß, Ivan Ndip, Christian Tschoban Chapter II: Advanced PCB Packaging Das multi-funktionale Board - Heterogene Systemintegration auf 74 Leiterplattenbasis Jan Kostelnik Aktuelle Anforderungen und neue Lösungsansätze im Microelectronic 79 Packaging Lutz Mattheier, Werner Schneider

2 Glass Based Electro-Optical PCB Technology with Gradient-Index 84 Multimode Waveguides Henning Schröder, Lars Brusberg Fan-out Panel Level Packing for System Integration 88 Tanja Braun, Karl-Friedrich Becker, Steve Voges, Jörg Bauer, Rüben Kahle, Volker Bader, Tina Thomas, Rolf Aschenbrenner, Lead-free Solder Alloy Optimization for Improved Reliability - Interface 97 Characterization Hans-Jürgen Albrecht Die Industrialisierung der Chipembeddingtechnologie 108 Hannes Stahr Quo vadis deutsche Leiterplatten-Industrie? 116 Udo Bechtloff Chapter Iii: Material & Process Development Neue Materialien für das thermische Management elektronischer 120 Baugruppen Mathias Nowottnick, Andrej Novikov, Felix Bremerkamp, Daniel Lexow Untersuchungen zur Tragkraft des Lotes 125 Hans Bell, Sebastian Stegmaier Assembly Materials for High Temperature Application 131 Jörg Trödler Aufbau- und Verbindungstechnik für Hochtemperatursensorik 137 Peter Sättler, Katharina Schulz, Klaus-Jürgen Wolter, Uwe Partsch Investigation of Local Materials Properties of Thermal Cyded 143 Cu Plated-Through-Holes (PTHs) Hans Walter, Marian Broll, Saskia Huber, Astrid Gollhardt, Olaf Wittler Development of Organic Field-Effect Transistors Based on Semiconducting Liquid-Crystal Polymers Kornelius Tetzner, Karlheinz Bock 149

3 Chapter IV: Power Electronics Interconnection Technologies for Highly Reliable Power Modules with 158 High Current Carrying Capability and Excellent Thermal Properties Martin Becker, Ronald Eisele, Frank Osterwald, Jacek Rudzki Smart Power Module Molding for High Temperatures 162 Tina Thomas, Karl-Friedrich Becker, Marius van Dijk, Olaf Wittler, Tanja Braun, Jörg Bauer, Smart Power Mechanics - Die Zukunft elektrischer 172 Anschlusstechnologien Thomas Schreier-Alt, Frank Ansorge, Christian Baar, Tony Amende Packages for Fast Switching HV GaN Power Devices 178 Kirill Klein, Eckart Hoene, Drahtbonds jenseits der Mikroelektronik: das Gegenteil 185 von Miniaturisierung Farhad Farassat, Uwe Nacke, Josef Sedlmair Al-Clad Cu Wire Bonds Multiply Power Cyding Lifetime of 188 Advanced Power Modules Ralf Schmidt, Uwe Scheuermann, Eugen Milke Verbindungstechnologien für erhöhte Einsatztemperaturen 194 mikroelektronischer Anwendungen Christian Ehrhardt, Matthias Hutter, Constanze Weber, Lena Goullon, Hermann Oppermann Embedding Technology for the Realization of Power Modules 200 Lars Böttcher, Andreas Ostmann, Stefan Karaszkiewicz, Dionysios Manessis, Chapter V: Wafer Level System Integration Assembly and Packaging Makes the Difference - The ewlb Technology 210 Klaus Pressel, Gottfried Beer, Bernd Römer Coming Challenges for Silicon Interposers 216 Gilles Poupon, Charles Fort Challenges in 3D Integration, Assembly and Test Technologies 220 Juergen Gräfe, Catharina Rudolph, Irene Bartusseck, Stephan Dobritz, Wieland Wahrmund, Alexander Wollanke, Kevin Wagenitz, Mario Schima, Steffen Mimietz, Michael Lorenz, Robert Wendling, Holger Wachmuth

4 Heterogeneous 3D Wafer Level Integration Based on TSV Silicon 227 Interposer Technology Kai Zoschke, Charles-Alix Manier, Martin Wilke Application of Thin Film Polymers for Packaging Electronic Systems 234 Michael Töpper, Thorsten Fischer, Robert Gernhardt, Karin Hauck, Christina Lopper, Martin Wilke, Markus Wöhrmann Wafer-Level Integration of InP DHBT and Si BiCMOS for 237 High-Performance mm-wave Electronic Circuits Nils Weimann, Viktor Krozer, Wolfgang Heinrich, Günther Tränkle, Marco Lisker, Chafik Meliani, Bernd Tillack Thin Chip Assembly for Hybrid Pixel Detectors 245 Thomas Fritzsch, Kai Zoschke, Markus Woehrmann, Mario Rothermund, Fabian Huegging, Oswin Ehrmann, Hermann Oppermann Vacuum Packaging at Wafer Level for MEMS Using Gold-Tin Metallurgy 251 Charles-Alix Manier, Kai Zoschke, Hermann Oppermann, David Ruffieux, Silvio Dalla Piazza, Tommi Suni, James Dekker, Giorgio Allegato Chapter VI: Reliability, Quality, Test & Condition Monitoring Multi-Scale Characterization of Copper TSV Structures in 3D IC Stacks 262 Ehrenfried Zschech, Martin Gall, Sven Niese, Markus Löffler Innovative Material Diagnostics Methods for Through Silicon Via 266 Technologies Frank Altmann, Sebastian Brand, Thomas Höche, Michael Krause, Matthias Petzold Advanced Mechanical Stress Measurement for BEoL Stacks 272 and 3D IC Integration Dietmar Vogel, Ellen Auerswald, Bernd Michel, Sven Rzepka Advanced Approach of Calculating Wire Bond Pull Test Correction 277 Factors Stefan Schmitz, Johannes Kripfgans, Martin Schneider-Ramelow, Wolfgang H. Müller, Reliability Improvements in Electronic Systems by Combining Condition 284 Monitoring Approaches Kathleen Jerchel, Michael Krüger, Andreas Middendorf, Nils F. Nissen,

5 Cloud-Based Sensor-Networks for Wireless Condition Monitoring Michael Niedermayer, Carsten Hoherz, Denis Reinhardt, Hendrik Scholtz, Stephan Benecke, Andreas Middendorf 291 Fraunhofer-Innovationsduster: Maintenance, Repair and Overhaul 295 Eckart Uhlmann, Martin Bilz Chapter VII: Modeling & Simulation Approaches for System Reliability in Consideration of Application 300 Oriented Loads as well as Physics-Of-Failure Stefan Straube, Daniel Hahn, Kathleen Jerchel, Andreas Middendorf, Variation of Plastic Materials Data of Copper and its Impact on the 305 Durability of Cu-Via Interconnects B. Emek Abali, Paul Lofink, Wolfgang H. Müller Erhöhung der Zuverlässigkeit von Mikro- und Nanokomponenten 309 und Systemen durch moderne Rissvermeidungsstrategien Bernd Michel, Thomas Winkler, Mohamad Abo Ras Double-Sided Cooling and Transient Thermo-Electrical Management of 313 Silicon on DCB Substrates for Power Converters: Design, Technology and Test Bernhard Wunderle, Martin Springborn, Daniel May, Charles-Alix Manier, Mohamad Abo Ras, Raul Mrossko, Hermann Oppermann, Tobias Xhonneux, Tristan Caroff, Wilhelm Maurer, Radoslava Mitova Parametrisches transientes thermo-elektrisches PSPICE Modell 325 für ein Stromkabel Ralph Schacht Optimization of Life Cyde Cost and Selection of Laminate Material 332 for Optimum Thermal Cyding Resistance Viktor Tiederle Finite Element Simulations - A Well-Suited Tool For The Development 337 of Advanced Power Electronic Systems Johann-Peter Sommer, Rainer Dudek, Ralf Döring Modelling the Lifetime of Aluminum Heavy Wire Bond Joints with a 342 Crack Propagation Law Arian Grams, Tobias Prewitz, Olaf Wittler, Stefan Schmitz, Andreas Middendorf,

6 Raffungsmodelle für die Qualifikation von Einpresskontakten für 349 Leiterplatten Thomas Schreier-Alt, Daniel Heimerle, Karl Ring, Angelika Möhler, Christian Baar, Frank Ansorge, Michael Schwab Chapter VIII: Selected Application Highlights Approaches for System Reliability in Consideration of Application 360 Oriented Loads as well as Physics-Of-Failure Stefan Straube, Daniel Hahn, Kathleen Jerchel, Andreas Middendorf, Implantable Micro and Nanodevices: Opportunities and Challenges 369 in Revolutionizing Health Care Florian Solzbacher Innovative Medical Engineering - Challenges for Electronics Packaging 373 David Wagner, Bertram Schmidt, Markus Detert AEMtec - ein EMS, jetzt auch für Implantate Ingolf Schlosser Lensless Microscopy of Cell Cultures - Holographie Live Cell Imaging 377 in New Dimensions Moritz Hubl, Martin Blechert, Maik Engelhardt, Aneta Ziolkowska, Erik Jung, Leopold Georgi Future High Security ID Documents Based on Innovative Microsystem 381 Technologies Joachim Kloeser et al. Advanced Liquid-Free, Piezoresistive, SOI-Based Pressure Sensor 387 Concepts for Measurements in Harsh Environments Ha-Duong Ngo, Biswaijit Mukhopadhyay, Oswin Ehrmann, Development of Integrated Lithium Ion Micro Batteries 392 Robert Hahn, Katrin Höppner, Marc Ferch, Krystan Marquardt, Large Area Sensor Integration in Textiles 400 Christine Kailmayer, Erik Simon SOPRO - Selbstorganisierende Produktion Eckart Uhlmann, Eckhard Hohwieler, Manfred Kraft 406