TOPLED Black Surface Datasheet Version 1.1 LW TWTG.BB
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- Günter Kästner
- vor 6 Jahren
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1 TOPLED Black Surface Datasheet Version 1.1 TOPLED, SMT LED with integrated reflector. With our great experience in SMT LED we are able to offer a high quality product for all kind of applications. TOPLED, SMT-LED mit integriertem Reflektor. Mit unserer großen Erfahrung in SMT LED sind wir in der Lage, ein qualitativ hochwertiges Produkt für alle Arten von Anwendungen anzubieten. Features: Package: white PLCC-2 package, black surface, colored diffused silicone resin Technology: ThinGaN (UX:3) Besondere Merkmale: Gehäusetyp: weisses PLCC-2 Gehäuse, schwarze Oberfläche, farbiger diffuser Silikon-Verguss Technologie: ThinGaN (UX:3) Viewing angle at 50 % I V : 110 Abstrahlwinkel bei 50 % I V : 110 Color: Cx = 0.32, Cy = 0.33 acc. to CIE 1931 Farbe: Cx = 0.32, Cy = 0.33 nach CIE 1931 (weiß) (white) ESD - withstand voltage: 8 kv acc. to ESD - Festigkeit: 8 kv nach ANSI/ESDA/JEDEC ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) JS-001 (HBM, Klasse 3B) Applications Variable Message Signs (VMS) Information Displays Backlighting Industrial illumination Anwendungen Wechselanzeigen (VMS) Informationsanzeigen Hinterleuchtung Industrie-Beleuchtung
2 Ordering Information Bestellinformation Type: Luminous Intensity 1) page 22 Ordering Code Typ: Lichtstärke 1) Seite 22 Bestellnummer I F = 20 ma I V [mcd] -BXCX-2B2C Q65111A6973 -BXBY-2C Q65112A1001 -BXBY-2B2C-Z Q65112A1000 -BXBY-2B-Z Q65112A0999 Note: Anm.: The above Type Numbers represent the order groups which include only a few brightness groups (see page 5). Only one group will be shipped on each packing unit (there will be no mixing of two groups on each packing unit). E. g. -BXBY-2C-1 means that only one group BX, BY will be shippable for any packing unit. In a similar manner for colors where color chromaticity coordinate groups are measured and binned, single groups will be shipped on any one packing unit. -BXBY-2C-1 means that the device will be shipped within the specified limits. In a similar manner for colors where forward voltage groups are measured and binned, single forward voltage groups will be shipped on any packing unit. E. g. -BXBY-2C-1 means that only one forward voltage group 44,86,Z4 will be shippable. Die oben genannten Typbezeichnungen umfassen die bestellbaren Selektionen. Diese bestehen aus wenigen Helligkeitsgruppen (siehe Seite 5). Es wird nur eine einzige Helligkeitsgruppe pro Verpackungseinheit geliefert. Z. B. -BXBY-2C-1 bedeutet, dass in einer Verpackungseinheit nur eine der Helligkeitsgruppen BX, BY enhalten ist. Gleiches gilt für die Farben, bei denen Farbortgruppen gemessen und gruppiert werden. Pro Verpackungseinheit wird nur eine Farbortgruppe geliefert. Z.B. -BXBY-2C-1 bedeutet, dass in einer Verpackungseinheit nur eine der Farbortgruppen enthalten ist. -BXBY-2C-1 bedeutet, dass das Bauteil innerhalb der spezifizierten Grenzen geliefert wird. Gleiches gilt für die LEDs, bei denen die Durchlassspannungsgruppen gemessen und gruppiert werden. Pro Verpackungseinheit wird nur eine Durchlassspannungsgruppe geliefert. Z. B. -BXBY-2C-1 bedeutet, dass nach Durchlassspannungsgruppen gruppiert wird. In einer Verpackungseinheit ist nur eine der Durchlassspannungsgruppen 44,86,Z4 enthalten (siehe Seite 5)
3 Maximum Ratings Grenzwerte Parameter Symbol Values Unit Bezeichnung Symbol Werte Einheit Operating temperature range Betriebstemperatur Storage temperature range Lagertemperatur Junction temperature Sperrschichttemperatur Forward current Durchlassstrom (T S = 25 C) Forward current pulsed Durchlassstrom gepulst (t 5 ms; D = 0.5; T S = 25 C) Surge current Stoßstrom (t 10 µs; D = 0.005; T S = 25 C) 2) page 22 T op C T stg C T j 110 C I F 30 ma I F pulse 100 ma I FM 100 ma Reverse current I R 50 ma Sperrstrom 2) Seite 22 ESD withstand voltage ESD Festigkeit (acc. to ANSI/ESDA/JEDEC JS HBM, Class 3B) V ESD 8 kv
4 Characteristics (T S = 25 C; I F = 20 ma) Kennwerte Parameter Symbol Values Unit Bezeichnung Symbol Werte Einheit Chromaticity coordinates acc. to CIE 1931 (typ.) 3) Seite 22 Farbkoordinaten nach CIE ) page 22 (typ.) Cx Cy Viewing angle at 50 % I V (typ.) 2ϕ 110 Abstrahlwinkel bei 50 % I V 4) page 22 Forward voltage Durchlassspannung Reverse voltage Sperrspannung (I R = 5 ma) 2) page 22 2) Seite 22 4) Seite 22 (min.) Reverse voltage (ESD device) Sperrspannung (ESD Diode) (I R ESD = 5 ma) Real thermal resistance junction / ambient 6) page 22 5) page 22, Realer Wärmewiderstand Sperrschicht / Umgebung 5) Seite 22, 6) Seite 22 (typ.) (max.) V F V F V F (max.) V R 7.3 V (min.) V R ESD 5.3 V (max.) R th JA real 230 K/W - - V V V Real thermal resistance junction / solder point 6) page 22 Realer Wärmewiderstand Sperrschicht / Lötpad 6) Seite 22 (max.) R th JS real 78 K/W Note: Anm.: Individual forward voltage groups see next page Durchlassspannungsgruppen siehe nächste Seite
5 Brightness Groups Helligkeitsgruppen Group Luminous Intensity 1) page 22 Luminous Intensity 1) page 22 Luminous Flux Gruppe Lichtstärke 1) Seite 22 Lichtstärke 1) Seite 22 Lichtstrom (min.) I v [mcd] (max.) I v [mcd] (typ.) Φ V [mlm] BX BY BZ CX ) page 22 Forward Voltage Groups Durchlassspannungsgruppen Group 4) Seite 22 Gruppe (min.) V F [V] (max.) V F [V] Z ) Seite 22 7) page
6 Chromaticity Coordinate Groups 3) Seite 22 Farbortgruppen 3) page 22 0,900 Cy 0, ,370 Cy 0, ,350 0, C 0, ,330 0,400 0, C 2B ,310 2B 0, , , ,200-0,100 0,000 0,100 0,200 0,300 0,400 0,500 0,600 0,700 0,800 0,900 1,000 Cx 0,290 0,270 0,245 0,265 0,285 0,305 0,325 0,345 0,365 0,385 Cx Color Chromaticity Groups 3) Seite 22 Farbortgruppen Group Gruppe 3) page 22 Cx Cy Group Gruppe 2B C Cx Cy
7 Group Name on Label Gruppenbezeichnung auf Etikett Example: BX-2C-44 Beispiel: BX-2C-44 Brightness Helligkeit Chromaticity Coordinate Farbort BX 2C 44 Forward Voltage Durchlassspannung Note: Anm.: No packing unit / tape ever contains more than one group for each selection. In einer Verpackungseinheit / Gurt ist immer nur eine Gruppe für jede Selektion enthalten
8 Relative Spectral Emission - V(λ) = Standard eye response curve Relative spektrale Emission - V(λ) = spektrale Augenempfindlichkeit I rel = f (λ); T S = 25 C; I F = 20 ma 7) page 22 7) Seite 22 1,0 Φ rel : V λ : white 0,8 0,6 0,4 0,2 0, λ [nm] Radiation Characteristics Abstrahlcharakteristik I rel = f (ϕ); T S = 25 C 7) page 22 7) Seite ϕ [ ] ,0 Irel 0, ,6-70 0,4-80 0,2-90 0,
9 Forward Current Durchlassstrom I F = f (V F ); T S = 25 C I F [ma] 7) page 22, 8) page 22 7) Seite 22, 8) Seite Relative Luminous Intensity Relative Lichtstärke I V /I V (20 ma) = f(i F ); T S = 25 C I V I V (20mA) 1.4 7) Seite 22, 8) Seite 22 7) page 22, 8) page V F [V] I F [ma] Chromaticity Coordinate Shift 7) Seite 22 Farbortverschiebung ΔCx, ΔCy = f(i F ); T S = 25 C 7) page 22 Cx Cy : Cx : Cy I F [ma]
10 7) page 22 Relative Forward Voltage 7) Seite 22 Relative Vorwärtsspannung ΔV F = V F - V F (25 C) = f(t j ); I F = 20 ma Relative Luminous Intensity 7) Seite 22 Relative Lichtstärke I V /I V (25) C = f(t j ); I F = 20 ma 7) page 22 V F [V] 0.3 I v I v (25 C) T j [ C] T j [ C] Chromaticity Coordinate Shift 7) Seite 22 Farbortverschiebung ΔCx, ΔCy = f(tj); I F = 20 ma 7) page 22 Cx Cy : Cx : Cy T j [ C]
11 Max. Permissible Forward Current Max. zulässiger Durchlassstrom I F = f (T) I F [ma] : T a : T s T [ C] Permissible Pulse Handling Capability Zulässige Impulsbelastbarkeit I F = f(t p ) D: Duty cycle I F [ma] 100 T S = 0 C C Permissible Pulse Handling Capability Zulässige Impulsbelastbarkeit I F = f(t p ) D: Duty cycle I F [ma] 100 T S = 100 C : D = 1.0 : D = 0.5 : D = 0.2 : D = 0.1 : D = 0.05 : D = 0.02 : D = 0.01 : D = : D = 1.0 : D = 0.5 : D = 0.2 : D = 0.1 : D = 0.05 : D = 0.02 : D = 0.01 : D = ,01 0, Pulse time [s] ,01 0, Pulse time [s]
12 Package Outline Maßzeichnung 9) page 22 9) Seite 22 Approximate Weight: Gewicht: Mark: Markierung: ESD information: ESD Information: 33 mg 33 mg Anode Anode LED is protected by ESD device which is connected in parallel to LED-Chip. Die LED enthält ein ESD-Bauteil, das parallel zum Chip geschaltet ist
13 9) page 22 Recommended Solder Pad Reflow 9) Seite 22 Empfohlenes Lötpaddesign Reflow-Löten soldering 2.6 (0.102) 1.5 (0.059) 4.5 (0.177) 2.6 (0.102) 1.5 (0.059) 4.5 (0.177) Padgeometrie für verbesserte Wärmeableitung Paddesign for improved heat dissipation 9) page 22 Recommended Solder Pad Reflow 9) Seite 22 Empfohlenes Lötpaddesign Reflow-Löten Lötstopplack Solder resist soldering 2 Cu-Fläche > 16 mm Cu-area > 16 mm 2 OHLPY970 Padgeometrie für verbesserte Wärmeableitung Paddesign for improved heat dissipation Anode 3.3 (0.130) Fläche darf bei Verwendung von TOPLED elektrisch nicht beschaltet werden. For TOPLED assembly do not use this area for electrical contact 3.3 (0.130) 2.3 (0.091) 0.8 (0.031) 3.7 (0.146) 1.1 (0.043) 1.5 (0.059) 11.1 (0.437) 0.7 (0.028) Kathode/ Cathode Fläche darf bei Verwendung von TOPLED elektrisch nicht beschaltet werden. For TOPLED assembly do not use this area for electrical contact Cu Fläche / 16 mm 2 per pad Cu-area < _ Lötstoplack Solder resist OHLPY
14 Note: Anm.: For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. Das Gehäuse ist für Ultraschallreinigung nicht geeignet
15 Reflow Soldering Profile Reflow-Lötprofil Product complies to MSL Level 2 acc. to JEDEC J-STD-020D C T C 217 C t P t L T p OHA C 150 t S C s 300 t Profile Feature Profil-Charakteristik Ramp-up rate to preheat* ) 25 C to 150 C Time t S T Smin to T Smax Ramp-up rate to peak* ) T Smax to T P Liquidus temperature Time above liquidus temperature Symbol Symbol t S T L t L Minimum 60 Pb-Free (SnAgCu) Assembly Recommendation 2 3 K/s Maximum OHA04612 Unit Einheit s K/s C s Peak temperature Time within 5 C of the specified peak temperature T P - 5 K Ramp-down rate* T P to 100 C Time 25 C to T P T P t P All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range C s K/s s
16 Taping Gurtung 9) page 22 9) Seite
17 Tape and Reel Gurtverpackung 8 mm tape with 8000 pcs. on 330 mm reel W 1 D 0 P 0 P 2 F E W A N 13.0 ±0.25 P 1 Label Direction of unreeling W 2 Direction of unreeling Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC ; EIA 481-D OHAY0324 Tape dimensions [mm] Gurtmaße [mm] Tape dimensions in mm W P 0 P 1 P 2 D 0 E F / ± ± 0.05 or 4 ± ± ± ± ± 0.05 Reel dimensions [mm] Rollenmaße [mm] Reel dimensions in mm A W N min W 1 W 2max
18 _< C). _< WET Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Version 1.1 Barcode-Product-Label (BPL) Barcode-Produkt-Etikett (BPL) EX XAM AMP MPL LE OSRAM Opto Semiconductors ors (6P) BATCH ENO: E234 (1T) LOT NO: (9D) D/M: D/C: 1234 (X) PROD NO: AMD) AMD/ D (Q)QTY: 9999 (G) GROUP: LX XXXX RoHS Compliant Pack: RXX DEMY BIN1: XX-XX-X-XXX-X ML Temp ST X XXX C X XXX X_X123_ _ X XX-XX-X-X X-X-X OHA04563 Dry Packing Process and Materials Trockenverpackung und Materialien OSRAM Moisture-sensitive label or print Barcode label Humidity indicator Barcode label Comparator check dot 5% 10% 15% If wet, parts still adequately dry. change desiccant If wet, examine units, if necessary bake units If wet, examine units, if necessary bake units CAUTION This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS LEVEL If blank, see bar code label 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours Desiccant Humidity Indicator MIL-I-8835 OSRAM OHA00539 Note: Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card. Regarding dry pack you will find further information in the internet and in the Short Form Catalog in chapter Tape and Reel under the topic Dry Pack. Here you will also find the normative references like JEDEC. Anm.: Feuchteempfindliche Produkte sind verpackt in einem Trockenbeutel zusammen mit einem Trockenmittel und einer Feuchteindikatorkarte. Bezüglich Trockenverpackung finden Sie weitere Hinweise im Internet und in unserem Short Form Catalog im Kapitel Gurtung und Verpackung unter dem Punkt Trockenverpackung. Hier sind Normenbezüge, unter anderem ein Auszug der JEDEC-Norm, enthalten
19 _< C). _< Bin2: Q-1-20 Bin3: ML 2 2a 220 C R 11 0 (9D) D/C: 0144 Bin2: Q-1-20 Bin3: ML Temp ST C R 2a Version 1.1 Transportation Packing and Materials Kartonverpackung und Materialien Barcode label Barcode label CAUTION This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS LEVEL If blank, see bar code label 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours OSRAM Opto Semiconductors (6P) BATCH NO: (1T) LOT NO: 123GH1234 Muster (X) PROD NO: 1 (9D) D/C: (Q)QTY: 2000 LSY T676 Bin1: P-1-20 Multi TOPLED Temp ST 240 C R C RT Additional TEXT R077 DEMY PACKVAR: R18 (G) GROUP: P-1+Q-1 OSRAM Opto Semiconductors (6P) BATCH NO: (1T) LOT NO: 123GH1234 Muster (X) PROD NO: (Q)QTY: 2000 LSY T676 Bin1: P-1-20 Multi TOPLED 240 C R C RT Additional TEXT R077 DEMY PACKVAR: R18 (G) GROUP: P-1+Q-1 OSRAM Packing Sealing label OHA02044 Dimensions of transportation box in mm Width Length Height Breite Länge Höhe 352 ± ± 5 33 ±
20 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2008 ("photobiological safety of lamps and lamp systems"). Within the risk grouping system of this CIE standard, the LED specified in this data sheet fall into the class Exempt group (exposure time s). Under real circumstances (for exposure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. As is also true when viewing other bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this LED are silverplated. Silver is discoloring when being exposed to environments containing high concentrations of aggressive substances. Corroded silver may lead to a worsening of the optical performance of the LED and can in the worst case lead to a failure of the LED. Do not expose this LED to aggressive atmospheres. Note, that corrosive gases may as well be emitted from materials close to the LED in the final product. For further application related informations please visit Hinweise Die Bewertung der Augensicherheit erfolgt nach dem Standard IEC 62471:2008 ("photobiological safety of lamps and lamp systems"). Im Risikogruppensystem dieser CIE- Norm erfüllen die in diesem Datenblatt angegebenen LEDs folgende Gruppenanforderung - Exempt group (Expositionsdauer s). Unter realen Umständen (für Expositionsdauer, Augenpupille, Betrachtungsabstand) geht damit von diesen Bauelementen keinerlei Augengefährdung aus. Grundsätzlich sollte jedoch erwähnt werden, dass intensive Lichtquellen durch ihre Blendwirkung ein hohes sekundäres Gefahrenpotenzial besitzen. Nach einem Blick in eine helle Lichtquelle (z.b. Autoscheinwerfer), kann ein temporär eingeschränktes Sehvermögen oder auch Nachbilder zu Irritationen, Belästigungen, Beeinträchtigungen oder sogar Unfällen führen. Einzelkomponenten dieser LED sind silberbeschichtet. Silberoberflächen werden durch korrosive Substanzen verändert. Korrodiertes Silber kann zu einer Verschlechterung der optischen Eigenschaften und im schlimmsten Fall zum Ausfall der LED führen. Diese LED darf aggressiven Bedingungen nicht ausgesetzt werden. Es ist zu beachten, dass korrosive Gase auch von Materialien emittiert werden können, die sich im Endprodukt in unmittelbarer Umgebung der LED befinden. Für weitere applikationsspezifische Informationen besuchen Sie bitte
21 Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. Disclaimer Bei abweichenden Angaben im zweisprachigen Wortlaut haben die Angaben in englischer Sprache Vorrang. Bitte beachten! Lieferbedingungen und Änderungen im Design vorbehalten. Aufgrund technischer Anforderungen können die Bauteile Gefahrstoffe enthalten. Für weitere Informationen zu gewünschten Bauteilen, wenden Sie sich bitte an unseren Vertrieb. Falls Sie dieses Datenblatt ausgedruckt oder heruntergeladen haben, finden Sie die aktuellste Version im Internet. Verpackung Benutzen Sie bitte die Ihnen bekannten Recyclingwege. Wenn diese nicht bekannt sein sollten, wenden Sie sich bitte an das nächstgelegene Vertriebsbüro. Wir nehmen das Verpackungsmaterial zurück, falls dies vereinbart wurde und das Material sortiert ist. Sie tragen die Transportkosten. Für Verpackungsmaterial, das unsortiert an uns zurückgeschickt wird oder das wir nicht annehmen müssen, stellen wir Ihnen die anfallenden Kosten in Rechnung. Bauteile, die in lebenserhaltenden Apparaten und Systemen eingesetzt werden, müssen für diese Zwecke ausdrücklich zugelassen sein! Kritische Bauteile* dürfen in lebenserhaltenden Apparaten und Systemen** nur dann eingesetzt werden, wenn ein schriftliches Einverständnis von OSRAM OS vorliegt. *) Ein kritisches Bauteil ist ein Bauteil, das in lebenserhaltenden Apparaten oder Systemen eingesetzt wird und dessen Defekt voraussichtlich zu einer Fehlfunktion dieses lebenserhaltenden Apparates oder Systems führen wird oder die Sicherheit oder Effektivität dieses Apparates oder Systems beeinträchtigt. **) Lebenserhaltende Apparate oder Systeme sind für (a) die Implantierung in den menschlichen Körper oder (b) für die Lebenserhaltung bestimmt. Falls Sie versagen, kann davon ausgegangen werden, dass die Gesundheit und das Leben des Patienten in Gefahr ist
22 Glossary 1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal reproducibility of ± 8 % and an expanded uncertainty of ± 11 % (acc. to GUM with a coverage factor of k = 3). 2) Reverse Operation: A minimum of 10 hours of reverse operation is permisable in total. Continuous reverse operation is not allowed. 3) Chromaticity coordinate groups: Chromaticity coordinates are measured during a current pulse of typically 25 ms, with an internal reproducibility of ± and an expanded uncertainty of ± 0.01 (acc. to GUM with a coverage factor of k = 3). 4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ± 0.05 V and an expanded uncertainty of ± 0.1 V (acc. to GUM with a coverage factor of k = 3). 5) Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16mm² per pad) 6) Thermal Resistance: Rth max is based on statistic values (6σ). 7) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differences between single LEDs within one packing unit. 9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. Glossar 1) Helligkeit: Helligkeitswerte werden während eines Strompulses einer typischen Dauer von 25 ms, mit einer internen Reproduzierbarkeit von ± 8 % und einer erweiterten Messunsicherheit von ± 11 % gemessen (gemäß GUM mit Erweiterungsfaktor k = 3). 2) Rückwärtsbetrieb: Eine Gesamtbetriebszeit von wenigstens 10 Stunden in Sperrrichtung ist gewährleistet. Ein permanenter Betrieb in Rückwärtsrichtung ist nicht gestattet. 3) Farbortgruppen: Farbkoordinaten werden während eines Strompulses einer typischen Dauer von 25 ms, mit einer internen Reproduzierbarkeit von ± 0,005 und einer erweiterten Messunsicherheit von ± 0,01 gemessen (gemäß GUM mit Erweiterungsfaktor k = 3). 4) Durchlassspannung: Vorwärtsspannungen werden während eines Strompulses einer typischen Dauer von 8 ms, mit einer internen Reproduzierbarkeit von ± 0,05 V und einer erweiterten Messunsicherheit von ± 0,1 V gemessen (gemäß GUM mit Erweiterungsfaktor k = 3). 5) Wärmewiderstand: RthJA ergibt sich bei Montage auf PC-Board FR 4 (Padgröße 16mm² je pad) 6) Wärmewiderstand: Rth max basiert auf statistischen Werten (6σ). 7) Typische Werte: Wegen der besonderen Prozessbedingungen bei der Herstellung von LED können typische oder abgeleitete technische Parameter nur aufgrund statistischer Werte wiedergegeben werden. Diese stimmen nicht notwendigerweise mit den Werten jedes einzelnen Produktes überein, dessen Werte sich von typischen und abgeleiteten Werten oder typischen Kennlinien unterscheiden können. Falls erforderlich, z.b. aufgrund technischer Verbesserungen, werden diese typischen Werte ohne weitere Ankündigung geändert. 8) Kennlinien: Im gestrichelten Bereich der Kennlinien muss mit erhöhten Abweichungen zwischen Leuchtdioden innerhalb einer Verpackungseinheit gerechnet werden. 9) Maßtoleranz: Wenn in der Zeichnung nicht anders angegeben, gilt eine Toleranz von ±0,1. Maße werden in mm angegeben
23 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D Regensburg All Rights Reserved
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