MCM integration technologies for GHz applications
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1 Research Collection Doctoral Thesis MCM integration technologies for GHz applications Author(s): Grzyb, Janusz Publication Date: 2004 Permanent Link: Rights / License: In Copyright - Non-Commercial Use Permitted This page was generated automatically upon download from the ETH Zurich Research Collection. For more information please consult the Terms of use. ETH Library
2 Diss. ETH No MCM Integration Technologies for GHz Applications A dissertation submitted to the SWISS FEDERAL INSTITUTE OF TECHNOLOGY ZURICH for the degree of Doctor of Sciences ETH Zürich presented by Janusz Grzyb Dipl. El.-Ing. Technical University of Gdansk, Poland born 26th May 1972 citizen of Suwalki, Poland accepted on the recommendation of Prof. Dr. Gerhard Tröster, examiner Prof. Dr. Rüdiger Vahldieck, co-examiner 2004
3 Abstract This research addresses the development of a set of MCM (Multi-Chip Module) integration technologies for GHz applications. It spans different topics related to their extensive characterisation and to the establishment of precise measurement and de-embedding methods of series of material and circuit parameters at mm-wave frequencies. The first developed technology aims at a single substrate integration of mm-wave modules. It is a modified multi-layer BCB-based (Benzocyclobute) MCM-D (Multi-Chip Module with deposited interconnect) process with a performance-oriented optimally chosen dielectric thickness. An extensive study of various factors determining the performance of integrated interconnect structures, distributed passives and antennas at frequencies up to 100 GHz was carried out. This information was used to justify the choice of the microstrip configuration based on the BCB dielectric only with its appropriate thickness. To outline the potential of the developed technology for the integration at GHz, over 1000 S-parameter measurements of different transmission line elements, loads, distributed passives and antennas were performed up to 100 GHz. The simulated performance of some other integrated passives at 78 GHz and 94 GHz, including patch antenna arrays, shows the capability of the developed technology for applications at even higher frequencies. A concept of a mixed MCM-D/L technology was developed for an enhancement of the patch antenna efficiency and bandwidth. Additionally, the constraints of the CPW configuration usage in hybrid technologies at mm-wave frequencies were analysed. On the basis of this analysis, a twolayer quasi-cpw configuration, formed by an elevated centre conductor, was proposed. It results in a via-less realisation of bridges and tunnels, therefore, promoting further miniaturisation of different transmission line discontinuities, required at these frequencies. The other developed process is an MCM-L (Multi-Chip Module with laminated interconnect) build-up. It is supposed to be used for the realisation of SMT (Surface Mount Technology) compatible single die packages and standard functional units consisting of several chip bare dies and some optional integrated passive components at V-band, allowing an efficient implementation of a modular approach for the system integration. Active and passive devices integrated in the modules are positioned in cavities, allowing wire-bond suppression. Of special importance was the use of the liquid crystal polymer
4 viii (LCP) laminates, showing excellent thermo-mechanical, chemical and electrical properties at V-band frequencies. In order to accurately characterise the performance of the newly developed MCM processes, reliable calibration techniques had to be developed. Relying on an off-wafer calibration only can lead to erroneous measurement results at mm-wave frequencies. An accurate on-wafer fabrication of calibration standards is, however, difficult if the goal is the characterisation of a newly established technology. Therefore, a technique, accounting for the differences between off- and on-wafer feed structures, was implemented using a principle of the calibration-comparison method [1 4]. Moreover, a thorough study of the state-of-the-art methods for de-embedding of the CPW line characteristic impedance was performed. As a result of this study, a novel technique with an automatic detection of the reference plane position was developed. This procedure was extended to the taper-fed CPW and Finite- Width CBCPW lines. Furthermore, a state-of-the-art two-step characteristic impedance de-embedding technique for microstrip lines, valid at mm-wave frequencies, was developed. Finally, an in-situ procedure for a wideband determination of dielectric permittivities for thin dielectric layers was developed. It is based on the probe-tip measurements of microstrip line sets consisting of different line cross-sections and lengths. The high-frequency line dispersion at mm-wave frequencies and the low-frequency dispersion caused by slow-wave effects, considerably influencing the behaviour of thin microstrip lines, are addressed with high accuracy. Not only standard single-layer microstrip lines are considered but also more realistic in interconnect technologies composite dielectric build-ups and substrates with passivation layer. This work was conducted within the European research projects LAP 1 and LIPS 2. 1 LAP, Low Cost Large Area Panel Processing of MCM-D Substrates and Packages, Esprit Project no , BBW no LIPS, Low Cost Interconnect, Packaging and Sub-system Integration Technologies for Millimetre-wave Applications, IST Project no , BBW no
5 Zusammenfassung Diese Dissertation beschäftigt sich mit der Entwicklung einer Reihe von MCM-Integrationstechnologien (Multi-Chip Module) für GHz-Anwendungen. Die Arbeit enthält verschiedene Themen, welche mit den etablierten technologischen Prozessen verwandt sind und deren extensiven Charakterisierung, präzisen Messung und Extraktionsmethoden für eine Reihe von Material- und Schaltungsparametern im Millimeterwellenbereich. Bei der ersten entwickelten Technologie handelt es sich um ein modifizierter mehrlagiger MCM-D Prozess, der auf BCB-Dünnfilm (Benzocyclobute) basiert. Dabei wurde die Gesamtdicke von BCB bezüglich optimaler Leistungsfähigkeit ausgëwahlt. Diese Technologie zielt auf die Integration von Millimeterwellenmodulen in einem einzigen Substrat. Ausführliche Studien von verschiedenen Faktoren wurden durchgeführt, welche das Verhalten der integrierten Verbindungsstrukturen, verteilten passiven Elemente und Antennen bei Frequenzen bis zu 100 GHz bestimmen. Die Resultate wurden benutzt für die Wahl einer Mikrostreifen-Konfiguration, welche nur auf dem BCB-Dielektrikum mit der entsprechenden Dicke basiert. Um das Potential der entwickelten Technologie für die Integration bei GHz validieren, wurden über 1000 S-Parameter-Messungen von verschiedenen Übertragungsleitungen, Lasten, verteilten passiven Elementen und Antennen bis zu 100 GHz vorgenommen. Die simulierte Leistung einiger anderer integrierter passiver Elemente, darunter Arrays von Patch-Antennen, bei 78 GHz und 94 GHz zeigt das Potential der entwickelten Technologie für Anwendungen bei noch höheren Frequenzen. Das Konzept einer gemischten MCM-D/ L Technologie wurde für eine Erweiterung der Effizienz und Bandbreite von Patch-Antennen entwickelt. Zusätzlich wurden die Bedingungen der Koplanarleitung-Konfiguration in hybriden Technologien im Millimeterwellenbereich analysiert. Auf der Basis dieser Untersuchung wurde eine zweilagige Quasi-Koplanarleitung-Konfiguration vorgeschlagen, die durch einen erhöhten mittleren Streifenleiter gebildet ist. Daraus resultiert eine durchkontaktierungslose Realisierung von bridges und tunnels. Damit wird eine weitere Miniaturisierung von verschiedenen Diskontinuitäten in Übertragungsleitungen möglich, was bei diesen Frequenzen erforderlich ist. Der zweite entwickelte Prozess ist ein MCM-L-Aufbau, der für die Realisation von SMT-kompatiblen Einzel-Chip-Packages und funktionellen Standard-Einheiten mit mehreren, unverpackten, integrierten Schaltungen
6 x und einigen optionalen integrierten passiven Elementen im V-Band verwendet werden kann. Er erlaubt eine effiziente Implementation eines modularen Ansatzes für die Integration. Aktive und passive Bauteile sind in Kavitäten positioniert, was das Verzicht auf Bonddrähten erlaubt. Von spezieller Bedeutung ist die Verwendung der Flüssigkristall-Polymer-Laminate (LCP), welche ausgezeichnete thermomechanische, chemische und elektrische Eigenschaften bei V-Band Frequenzen aufweisen. Um die Leistung des neu entwickelten MCM-Prozesses akkurat charakterisieren zu können, mussten zuverlässige Eichungs-Techniken entwickelt werden. Eine Beschränkung nur auf off-wafer Eichung kann zu fehlerhaften Messergebnissen im Millimeterwellenbereich führen. Eine genaue on-wafer Fabrikation von Eichungselementen ist allerdings schwierig, wenn das Ziel die Charakterisierung einer neu eingeführten Technologie ist. Darum wurde eine Technik unter Benutzung der Eichungs-Vergleichsmethode [1 4] implementiert, welche die Unterschiede zwischen on-wafer und off-wafer Zuleitungen berücksichtigt. Des Weiteren wurde eine eingehende Untersuchung von state-of-the-art-methoden zur Extraktion der charakteristischen Impedanz von Koplanarleitungen durchgeführt. Als Resultat dieser Studie wurde eine neue Technik mit automatischer Detektion der Position der Referenzebene entwickelt. Diese Technik wurde auf taper-fed Koplanarleitungen (CPW) und FW-CBCPW (Finite-Width Conductor-Backed CPW) Leitungen erweitert. Zusätzlich wurde eine zweistufige Technik zur Extraktion der charakteristischen Impedanz für Mikrostreifenleitungen entwickelt, welche im Millimeterwellenbereich anwendbar ist. Schliesslich wurde eine in-situ-prozedur für eine weitreichende Festlegung der dielektrischen Permittivitäten für dünne Lagen entwickelt. Sie basiert auf Probenspitzen-Messungen von Mikrostreifenleiter-Sätzen bestehend aus verschiedenen Leiterquerschnitten und -längen. Die Hochfrequenzdispersion im Millimeterwellenbereich und die durch slow-wave - Effekte verursachte Niederfrequenzdispersion, welche einen starken Einfluss auf das Verhalten von dünnen Mikrostreifenleitungen hat, werden berücksichtigt. Nicht nur die gewöhnliche Einlagige Mikrostreifen-Konfiguration wird berücksichtigt, sondern auch die in Verbindungstechnologien realistischeren, gemischten dielektrischen Aufbauten und Substrate mit Passivierung. Diese Arbeit wurde im Rahmen der europäischen Forschungsprojekte LAP 3 und LIPS 4 durchgeführt. 3 LAP, Low Cost Large Area Panel Processing of MCM-D Substrates and Packages, Esprit Project no , BBW no LIPS, Low Cost Interconnect, Packaging and Sub-system Integration Technologies for Millimetre-wave Applications, IST Project no , BBW no
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