electronica 2012: Alle Termine im Überblick automotive Forum

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1 automotive Forum The Texas Instruments Analog Design Contest 11:00-13:00 h Texas Instruments Hall-based Magnetic Position Sensing? Robustness and Safety as Key Features in Automotive Applications Heinz Oyrer, ams AG ams AG (zuvor austriamicrosystems AG), Unterpremstätten High Performance EMC-Solutions with Nanocrystalline VITROPERM Cores for Hybrid- and E-Vehicles Dr. Armin Kipper Vacuumschmelze GmbH & Co. KG, Hanau European Funding Project MotorBrain? Addressing Key Factors for Electric Mobility: Safety, Efficiency, Cost Reduction Dr. Philip Brockerhoff Infineon Technologies AG, Neubiberg KOSTAL Inductive Charging System Frank Wendland KOSTAL Kontakt Systeme GmbH, Lüdenscheid PCI, Projected Capacitive Inputsystems Lillian Chao, Apex Material Technology Corp. (AMT) / SCHURTER GmbH 13:00-13:30 h 13:30-14:00 h 14:00-14:30 h 14:30-15:00 h 15:00-15:30 h :00 Seite 1

2 automotive Forum Thermal Management Solutions are key for efficient Electric Vehicle Designs 15:30-16:00 h Mark Amberg, The Bergquist Company GmbH The Bergquist Company GmbH, Pinneberg Tiny-ECU: Aktuatornahe Anbringung und flexible Anwendungsmöglichkeiten Alexander Pressl, MELECS EWS GmbH & Co KG MELECS EWS GmbH & Co KG, Siegendorf Technologies and Trends for Ambience Light Rainer Böhm, Lear Corporation GmbH Wiring and Interconnection Technology for LED Lighting in Automotive Applications Dr. Harald Schenk Mektec Europe GmbH, Weinheim Podiumsdiskussion "Lichtkonzepte & LED" Moderator: Alfred Vollmer, AUTOMOBIL-ELEKTRONIK Teilnehmer: Lars Reger, NXP Semiconductors Germany GmbH Dr. Wolfgang Bochtler, Mektec Europe GmbH Holger Seibold, Automotiv Lighting Reutlingen GmbH Michael Brandl, Osram Opto Semiconductors GmbH Rainer Böhm, Lear Corporation GmbH 16:00-16:30 h 10:00-10:30 h 10:30-11:00 h 11:00-12:00 h :00 Seite 2

3 automotive Forum Challenges for Electronic Solutions in Automotive LED Lighting 12:00-12:30 h Lars Regner, NXP Semiconductors Germany GmbH NXP Semiconductors Netherlands B.V., EINDHOVEN Emerging LED Based Automotive Applications -Challenges and Solutions Michael Brandl, OSRAM Opto Semiconductors GmbH OSRAM Opto Semiconductors GmbH, Regensburg Trends in LED-Lighting Concepts for Headlamps Holger Seibold, Automotive Lighting Reutlingen GmbH Automotive Lighting Increasing Efficiency in Automotive with 48V Batteries Mustafa Dinc, Vishay Electronic Vishay Europe Sales GmbH c/o Vishay Electronic GmbH, Selb Future Impact on Advanced SMT Interconnects in Automotive and Electronic and Electronics Greg Costatino DSM Engineering Plastics, Sittard Semiconductor Concepts for the Connected, Conscious and Clean Car of the Future Kent Robinett, Maxim Integrated Products GmbH 12:30-13:00 h 13:00-13:30 h 13:30-14:00 h 14:00-14:30 h 14:30-15:00 h :00 Seite 3

4 automotive Forum Semiconductor concepts for the connected, conscious and clean car of the future 14:30-15:00 h Kent Robinett, Maxim Integrated Products GmbH Maxim Integrated Products, San Jose, CA SiC Power Technology for EV/HEV and beyond Nobuhiro Hase, Rohm Semiconductor GmbH ROHM Semiconductor GmbH, Willich SSDs in the Cloud Computing Era: PCI Express Interface and NVMe Rino Micheloni IDT - Integrated Device Technology, San Jose, CA Touch-Displays mit taktiler Rückmeldung auf Basis der Oberflächen-Aktuation Michael Nussbaumer next system Germany Vertriebsgesellschaft mbh, Kirchardt Technology Trends in Power Electronics for Future Mobility Dr. Martin Rittner, Robert BOSCH Robert Bosch GmbH Automotive Electronics Semiconductors & Sensors, Reutlingen 15:00-15:30 h 15:30-16:00 h 16:00-16:30 h 10:00-10:30 h :00 Seite 4

5 automotive Forum Improved Lifetime of Power Modules by the Use of Silver Sintering Materials and Aluminum-Coated Copper Wires 10:30-11:00 h Thomas Krebs, Heraeus Materials Technology GmbH & Co. KG Podiumsdiskussion Leistungselektronik 5P /1h Moderator: Alfred Vollmer, AUTOMOBIL-ELEKTRONIK Peter Dietrich, Fuji Electric Europe GmbH Dr. Martin Rittner,, Robert Bosch GmbH Alexander Brand, Heraeus Materials Technology GmbH & Co. KG Mark Münzer, Infineon Technologies AG Nunzio Abbate, STMicroelectronics Application GmbH Robert Bosch GmbH Automotive Electronics Semiconductors & Sensors, Reutlingen Infineon Technologies AG, Neubiberg Trends in automotive power semiconductor packaging Peter Dietrich, Fuji Electric Europe GmbH Future Requirements of Power Electronics in Automotive and the Solutions Coming from a More than Moore Roadmap Nunzio Abbate, STMicroelectronics Application GmbH Affordable reliability for automotive power modules Mark Muenzer, Infineon Infineon Technologies AG, Neubiberg 11:00-12:00 h 12:00-12:30 h 12:30-13:00 h 13:00-13:30 h :00 Seite 5

6 automotive Forum Functional Safety ISO the new challenge 13:30-14:00 h Berthold Arends, Marquardt Peter Drießen, Marquardt Marquardt Mechatronik GmbH, Rietheim-Weilheim Robustness Validation: Facts and Figures Why to Replace the Historical AEC Qualification Methods AEC Qxxx Helmut Keller, Keller Consulting Keller Consulting The Introduction of First-Mate-Last-Break grounding contacts in the automotive industry Christoph Thienel, Robert BOSCH Robert Bosch GmbH Automotive Electronics Semiconductors & Sensors, Reutlingen Phase-Out Management of Electronic Components in the Automotive Aftermarket Stephan Lehmann Freescale Halbleiter Deutschland GmbH, München Thermal Caused Damage Mechanism for Electronic Components / Assemblies and its Prevention Bernd Enser, Sanmina SCI SANMINA - SCI Holding GmbH & Co. KG, Gunzenhausen 14:00-14:30 h 14:30-15:00 h 15:00-15:30 h 15:30-16:00 h :00 Seite 6

7 automotive Forum Updates and Improvements in standardized PCN process 16:00-16:30 h Dr Olaf Autzen, Robert Bosch GmbH Robert Bosch GmbH Automotive Electronics Semiconductors & Sensors, Reutlingen SiC Power Technology for EV/HEV and beyond Nobuhiro Hase, Rohm Semiconductor GmbH ROHM Semiconductor GmbH, Willich Batterietestsysteme für F+E Dr. Rene Groiß BaSyTec GmbH E-Mobility for Fleets? Solutions for Load and Energy Management Thorsten Temme PHOENIX CONTACT GMBH & CO. KG, Blomberg High Voltage Connectors - Moderne Hochvoltsteckverbinder für die Elektromobilität Thomas Scherer KOSTAL Kontakt Systeme GmbH, Lüdenscheid 16:30-17:00 h Fr :00-10:30 h Fr :30-11:00 h Fr :00-11:30 h :00 Seite 7

8 automotive Forum Energy Conversion: the challenge for Electro-Mobility Fr :30-12:00 h Reiner Schwartz, STMicroelectronics Application GmbH STMicroelectronics, Plan Les Quates Galvanic Isolated Current Measuring with Hall Sensors Harald Staeb Seuffer GmbH & Co. KG TESTLAB: Das Neue VDE-Batterie- und Umwelttestzentrum in Offenbach Heiko Sattler VDE Prüf- und Zertifizierungsinstitut GmbH, Offenbach Fr :00-12:30 h Fr :30-13:00 h :00 Seite 8

9 electronica Forum CEO Round Table Semiconductor Solutions for Smart Grid Challenges 11:00-12:00 h Moderator: Killian Reichert Teilnehmer: Carlo Bozotti, President and CEO, STMicroelectronics Application GmbH Rick Clemmer, President and CEO, NXP Semiconductors Germany GmbH Gregg A. Lowe, President and CEO, Freescale Semiconductor Dr. Reinhard Ploss, CEO, Infineon Technologies AG STMicroelectronics, Plan Les Quates NXP Semiconductors Netherlands B.V., Eindhoven Freescale Halbleiter Deutschland GmbH, München Infineon Technologies AG, Neubiberg Electronics industry outlook European opportunities and challenges ahead Sébastien Rospide, Senior consultant and project manager, DECISION Consulting Introduction Joachim Weitzel, Infineon Technologies AG / ZVEI The MEMS Market - Where are the sweet spots? Jérémie Bouchaud, IHS isuppli The Future of Automotive MEMS Sensors Dr. Frank Schäfer, Robert Bosch GmbH Robert Bosch GmbH Automotive Electronics Semiconductors & Sensors, Reutlingen 12:30-13:00 h 13:00-13:15 h 13:15-13:45 h 13:45-14:15 h :00 Seite 9

10 electronica Forum From Smartphones to Clothes: How MEMS are Changing your Life 14:15-14:45 h Roberto De Nuccio STMicroelectronics GmbH, Aschheim Microsystems beyond MEMS Ralf Bornefeld, Infineon Technologies AG Infineon Technologies AG, Neubiberg Low stress packages for MEMS Albert Birkicht, HARTING Harting Deutschland GmbH & Co. KG, Minden Public Funding of MEMS/Microsystems in Europe Wolfgang Geßner, VDI/VDE-IT Balance statt Burn-out Peter Buchenau Electronics Then & Now: where were you in 1972 and where will the electronics industry be in 2052? Welcome/Introduction Caroline Hayes, Editor-in-Chief, EPN EPN, EDNE, IAN Reed Electronics Group Division of Reed Business Information, Issy-les-Moulineaux 14:45-15:15 h 15:15-15:45 h 16:15-16:45 h 17:00-18:00 h 10:05-10:10 h :00 Seite 10

11 electronica Forum Electronics Then & Now: where were you in 1972 and where will the electronics industry be in 2052? Helping the Engineer in a Digital Age 10:10-10:30 h RS Components GmbH, Mörfelden-Walldorf Electronics Then & Now: where were you in 1972 and where will the electronics industry be in 2052? Automotive Benjamin Jackson, Product Manager Automotive Products Business Unit, International Rectifier International Rectifier GmbH, Neu-Isenburg Electronics Then & Now: where were you in 1972 and where will the electronics industry be in 2052? Current Transducers Evolution Hans Dieter Huber, VP Industry, LEM Electronics Then & Now: where were you in 1972 and where will the electronics industry be in 2052? Changes in the Design Community over the Lifetime of EPN Mark Burr-Lonnon, VP Europe & Asia, Mouser Electronics Mouser Electronics, München Electronics Then & Now: where were you in 1972 and where will the electronics industry be in 2052? How Power Efficiency Affects Design - From Mobile Phones to LED Systems Doug Bailey, VP, Marketing, Power Integrations Power Integrations, San Jose, CA 10:35-10:55 h 11:00-11:20 h 11:30-11:50 h 11:55-12:15 h :00 Seite 11

12 electronica Forum Electronics Then & Now: where were you in 1972 and where will the electronics industry be in 2052? Medical 12:20-12:40 h Oliver Bischoff, Industry Manager, Molex Molex Deutschland GmbH, Walldorf Vital Signs Monitoring / Ambient Assisted Living Vital Signs Monitoring for Mobile Home Tony Zarola, Analog Devices Analog Devices, München Vital Signs Monitoring / Ambient Assisted Living Wearable Vital Sign Monitoring Steve LaJeunesse, Maxim Integrated Products GmbH Maxim Integrated Products, Inc., San Jose, CA Vital Signs Monitoring / Ambient Assisted Living Microcontrollers Designed to Support Ambient Assisted Living Ralf Brederlow, Texas Instruments Texas Instruments Deutschland GmbH, Freising Keeping Pace With the Demographic Shift Final Discussion: Challenges in Ambient Assisted Living Prof. Dr. Petra Friedrich, University Kempten 14:00-14:25 h 14:30-14:55 h 15:00-15:25 h 15:30-16:00 h :00 Seite 12

13 electronica Forum Simulation and Verification in the Smart Grid 16:00-16:20 h Dr. Joachim Schlosser, Senior Team Leader Application Engineering MathWorks, Aachen Core Technology for Smart Grids Wolfgang Heinz-Fischer, Head of Marketing, TQ Group TQ Group, Seefeld Beyond the Smart Meter - an Explosion of Electronics Enabling a Smarter Society Andy Harding, Senior Manager, Lifestyle & Smart Energy Segment Management, Industrial Business Group Renesas Electronics, Düsseldorf Organic and Printed Electronics Applications Introduction Dr. Klaus Hecker, Managing Director, OE-A Organic and Printed Electronics Applications Conducting Polymers - Components for Innovative Electronics Dr. Stephan Kirchmeyer, Head of Business Unit Functional Coatings, Heraeus Precious Metals GmbH & Co. KG Organic and Printed Electronics Applications Optical Sensors in Printed Electronics Transform Plastic and Glass in Smart and Interactive Surfaces Laurent Jamet, Co-founder, Business Development, ISORG 16:20-16:40 h 16:40-17:00 h 10:00-10:15 h 10:15-10:40 h 10:40-11:05 h :00 Seite 13

14 electronica Forum Organic and Printed Electronics Applications Touch Applications Based on Roll to Roll Printed PolyTC Metal Mesh Sensors 11:05-11:30 h Dr. Wolfgang Clemens, Head of Applications Organic and Printed Electronics Applications Applications of O-TFT Driven Displays Konrad Herre, COO, Plastic Logic Organic and Printed Electronics Applications Printable Electronic Products? a (potential) Users Guide Dr Neil Chilton, Technical Director Printed Electronics Ltd., Tamworth Staffs Organic and Printed Electronics Applications New Plastics Product Concepts Base on Hybrid In-Mould Integration Kari Rönkä, Principal Scientist, Product Line Manager, Printed Hybrid Systems, VTT Technical Research Centre of Finland Organic and Printed Electronics Applications Bi-directional OLED microdisplays for interactive data eye-glasses Dr. Rigo Herold, Fraunhofer COMEDD Time to Market Teilnehmer: Jon Barrett, Electronics Sourcing Rob Rospedzihowski, Farnell Europe Mark Burr, Mouser Shaun Mellors, AEL Crystals Mark Cundle, RS Components 11:30-11:55 h 11:55-12:20 h 12:20-12:45 h 12:45-13:10 h 14:00-14:45 h :00 Seite 14

15 electronica Forum Supply Chain Security in a Turbulent World 14:45-15:30 h Teilnehmer: Jon Barrett, Electronics Sourcing Mark Rinehart, ICBins Gary Ramsdale, AEL Crystals Brian Ellison, America II Electronics Smart Grids & Smart Homes - Technologies for More Efficiency Markus Staeblein, General Manager - Smart Grid Business Unit Texas Instruments Deutschland GmbH, Freising Security in the Smart Grid Roger Westberg Maxim Integrated, San Jose, CA Innovating the Energy Grid - Drivers and Inhibitors Robert Klosterboer, Senior Vice President and General Manager, Automotive, Industrial, Medical & Mil/Aero Group ON Semiconductor, Windsor, Berks 16:00-16:20 h 16:20-16:40 h 16:40-17:00 h Student Day Fr :00-14:00 h :00 Seite 15

16 embedded Forum Enable a Battery-free world with MSP430 and FRAM! 13:00-13:30 h Halle A6 / A6.359 Jacob Borgeson Texas Instruments Deutschland GmbH, Freising Micros &DSPs XMC4000. One Microcontroller platform. Countless solutions. Manfred Choutka, Senior Manager Regional Marketing EMEA, Infineon Technologies AG Infineon Technologies AG, Neubiberg Facts about low-power and how to select the right MCU Christian Daniel Texas Instruments Deutschland GmbH, Freising Smart Metering Integrated solutions for reliable and cost effective energy metering Mohit Berry, Business Development Manager, Infineon Technologies AG Infineon Technologies AG, Neubiberg Smart Metering Embedded Security in the Smart Grid Kris Ardis, Business Director, Advanced Metering Infrastructure, Maxim Integrated Products Maxim Integrated, San Jose, CA 13:30-14:00 h 14:00-14:30 h 15:00-15:30 h 15:30-16:00 h Halle A6 / A6.359 Halle A6 / A6.359 Halle A6 / A6.359 Halle A6 / A :00 Seite 16

17 embedded Forum Energy Mangement & Efficiency Halle A6 / A6.359 Microcontrollers enabling Greener Society 10:30-11:00 h Mohammed Dogar, European Microcontroller Marketing Manager, Renesas Renesas Electronics, Düsseldorf Energy Mangement & Efficiency Total power conversion solutions using the latest technologies from Vishay Siliconix David Grey, Vishay Electronic Vishay Europe Sales GmbH c/o Vishay Electronic GmbH, Selb ARM Cortex-M3-based SmartFusion2 SoC FPGAs for Power Management and High Efficiency designs Luca Cattaneo Microsemi Corp., Neufahrn 11:00-11:30 h 11:30-12:00 h Halle A6 / A6.359 Halle A6 / A6.359 Small Form Factor Boards The ARM module market is broadly positioned and complicates the choice for the user as there are many form 12:30-13:00 h factors and standards. The presentation provides an overview to find the best fitting module. Halle A6 / A6.359 Wolfgang Heinz-Fischer, Head of Marketing, TQ Group TQ Group, Seefeld Small Form Factor Boards The new ARM Computer-on-Modules Standard Peter Müller, Productline Manager Kontron Computer-on-Modules, Kontron Kontron AG, Eching 13:30-14:00 h Halle A6 / A :00 Seite 17

18 embedded Forum Small Form Factor Boards Halle A6 / A6.359 Rugged Small Form Factor Solution - with integrated Galvanic Isolation - for Industrial Control Applications 14:00-14:30 h Hubert Baierl, Infineon Technologies AG Infineon Technologies AG, Neubiberg Tools & Software Analog and Digital combined: Mixed-Signal Design and Verification in Simulink Alexander Schreiber, Mathworks MathWorks, Aachen Tools & Software Multi-core debugging? basics and hints Heiko Rießland, PLS Programmierbare Logik & Systeme GmbH PLS Programmierbare Logik & Systeme GmbH, Lauta Tools & Software JTAG Technologies and Embedded Electronics-Core Commander Peter van den Eijnden, JTAG Technologies BV JTAG Technologies BV, EINDHOVEN Tools & Software Multi-Board System Development Günther Schindler, CEO, EasyLogix 15:00-15:30 h 15:30-16:00 h 16:00-16:30 h 16:30-17:00 h Halle A6 / A6.359 Halle A6 / A6.359 Halle A6 / A6.359 Halle A6 / A :00 Seite 18

19 embedded Forum Overview of the broad TI ARM-based processors portfolio 10:30-11:00 h Halle A6 / A6.359 Arnaud Van-Den-Bossche Texas Instruments Deutschland GmbH, Freising ARM-based Controllers & Prozessors ARM-based MultiCore Qseven with single cable PCap touch panel solution Markus Mahl, Data Modul DATA MODUL AG, Munich ARM-based Controllers & Prozessors A field report - Android in industrial applications Tim Jaacks, Garz & Fricke GmbH Garz & Fricke GmbH, Hamburg Industrial Control & Communications Communication infrastructure solutions for Industrial Automation 2020 Christoph Hecker, Manager, Segment Marketing - Smart Factory, Renesas Renesas Electronics, Düsseldorf Industrial Control & Communications 2.5kV Galvanically Isolated High-Side Driver IC with Superior Diagnostics Support for Industrial Control Applications Hubert Baierl, Senior Business Manager, Infineon Technologies AG Infineon Technologies AG, Neubiberg 11:00-11:30 h 11:30-12:00 h 12:30-13:00 h 13:00-13:30 h Halle A6 / A6.359 Halle A6 / A6.359 Halle A6 / A6.359 Halle A6 / A :00 Seite 19

20 embedded Forum Embedded Computing Halle A6 / A6.359 From Model to Code? Fast Implementation with Automatic Code Generation 15:00-15:30 h Tobias Kuschmider, Mathworks MathWorks, Aachen Embedded Computing Will x86 still play a major role within the future industrial markets? Christian Blersch, CEO, EEPD Embedded Computing The right board solutions for different embedded applications Jan Felder, embedded-logic embedded-logic GmbH, Amerang Electronic Lighting Optoelectronic measurement - the right way Kevin Jensen MAZeT GmbH, Jena Electronic Lighting Clever Microcontrollers for Intelligent LED Lighting Steve Norman, European Smart Energy Marketing Manager, Renesas Renesas Electronics, Düsseldorf 15:30-16:00 h 16:00-16:30 h Fr :00-10:30 h Fr :00-11:30 h Halle A6 / A6.359 Halle A6 / A6.359 Halle A6 / A6.359 Halle A6 / A :00 Seite 20

21 embedded Forum Software Development Fr Halle A6 / A6.359 The RAM revolution: How would you use 2.5MB more RAM in your application? 12:00-12:30 h Robert Kalman, European Microcontroller Marketing Manage, Renesas and Colin Walls, Outbound Marketing Manager, Mentor Graphics, Renesas Renesas Electronics, Düsseldorf DAVE 3 makes embedded software development much faster Georg Huba Infineon Technologies AG, Neubiberg Software Development API: a helpful tool for the analysis of electromagnetic designs Dr. Doug Craigen, INTEGRATED Engineering Software Integrated Engineering Software, Winnipeg Fr :00-13:30 h Fr :30-14:00 h Halle A6 / A6.359 Halle A6 / A :00 Seite 21

22 PCB & Components Market Place High Speed Digital Coax Connections 12:30-13:00 h Halle C1 / C1.320 Stefan Erker HUBER+SUHNER GmbH - Deutschland, Taufkirchen "Mass Reduction for Automotive Bordnet and Wiring Harness Systems" Waldemar Stabroth Tyco Electronics AMP GmbH a TE Connectivity Ltd. company, Bensheim 25 Gbps over Copper: Dream or Reality Herbert Endres Molex Deutschland GmbH, Walldorf Challenges in Today?s Interconnect Requirements Thierry Goossens, FCI Deutschland GmbH FCI Deutschland GmbH, Oberursel Selektive Veredelung Falko A. Eidner FMB Technik GmbH, Sternenfels 13:00-13:30 h 13:30-14:00 h 14:00-14:30 h 14:30-15:00 h Halle C1 / C1.320 Halle C1 / C1.320 Halle C1 / C1.320 Halle C1 / C :00 Seite 22

23 PCB & Components Market Place Speeding up Connectors Development - How to Meet High Speed Data Rates and Rugged Halle C1 / C1.320 Environments. 15:00-15:30 h Guenter Rohr Dr. Stephan Doerfler ODU Steckverbindungssysteme GmbH & Co. KG, Mühldorf a. Inn Optimized Common Mode Chokes for High Current Applications Dr. Swen Graubner, Sekels Sekels GmbH, Ober-Mörlen Business Outlook for the Global Electronics Industry Walt Custer Custer Consulting Group, The Sea Ranch, CA EPC-eStat: the European Passive Components Statistic Rob Derksen Die Welt des Testens - mit Sicherheit die gewünschte Qualität ZVEI-Services in EMS Initiative. Moderator: Michael Velmeden, cms electronics GmbH Teilnehmer: Erich Baumgartner, CCS Customer Care&Solution Holding AG Mario Berger, GÖPEL electronic GmbH Gustl Keller, Eltroplan GmbH Harald Kaderabek, SRI Radio Systems GmbH 15:30-16:00 h 16:00-16:30 h 16:30-17:00 h 10:00-11:15 h Halle C1 / C1.320 Halle C1 / C1.320 Halle C1 / C1.320 Halle C1 / C :00 Seite 23

24 PCB & Components Market Place Zuverlässigkeit von Leiterplatten 11:15-12:15 h Halle C1 / C1.320 Moderator: Annemarie Biener, Mektec Europe GmbH & Mitglied ZVEI Teilnehmer: Reinhold Münch, Robert Bosch GmbH Rüdiger Dietrich, Lackwerke Peters GmbH u. Co. KG Bruno Meile, Varioprint AG Lagerfähigkeit Dr. Rolf Becker, Robert Bosch GmbH Ulrich Niklas, Zollner Elektronik AG Repair/Rework von elektronischen Baugruppen Thomas Lauer EADS Deutschland GmbH Traceability? Synergy Opportunities a Global Requirement Bernd Enser SANMINA - SCI Holding GmbH & Co. KG, Gunzenhausen EMS-Spezialitäten?made in Germany?- Qualität und vorausschauende Beratungskompetenz im Product-Life-Cylce Susanne Mackensen-Eder, Letron electronic GmbH Letron electronic GmbH, Osterode 12:15-12:45 h 12:45-13:15 h 13:15-13:45 h 14:00-14:30 h Halle C1 / C1.320 Halle C1 / C1.320 Halle C1 / C1.320 Halle C1 / C :00 Seite 24

25 PCB & Components Market Place RFID on PCB - How to Increase and Protect the Value of your Electronics Product 14:30-15:00 h Halle C1 / C1.320 Alexander M. Schmoldt Murata Elektronik GmbH, Nürnberg Integriertes Wärmemanagement benötigt technische Innovationen und Gesamtlösungen Norbert Kruett, FELA GmbH FELA Leiterplattentechnik GmbH, Villingen-Schwenningen Next Generation Low Loss and Thermally Reliable Base Materials Alun Morgan Isola GmbH, Düren Business Outlook for the Global Electronics Industry Walt Custer Custer Consulting Group, The Sea Ranch, CA Marktsession - Markt, Trends and Ausblick Moderator: Georg Höller, ZVEI e.v. Teilnehmer: Michael Gasch, Data 4PCB Dr. Erwin Effenberger, Siegert electronic GmbH Bernhard Rindt, SRI Radio Systems GmbH 15:00-15:30 h 15:30-16:00 h 16:00-16:30 h 10:00-11:00 h Halle C1 / C1.320 Halle C1 / C1.320 Halle C1 / C1.320 Halle C1 / C :00 Seite 25

26 PCB & Components Market Place Leiterplatte :00-13:00 h Halle C1 / C1.320 Moderator: Elke Krüger, CCI Eurolam Teilnehmer: Dr. Felix Betschon, vario-optics ag Jean-Claude Roth, CCI Group Nils Tolle, Hotoprint Elektronik GmbH & Co. KG Thermisch induzierte Damage-Mechanismen elektronischer Baugruppen und Ableitung von Korrekturmaßnahmen Bernd Enser SANMINA - SCI Holding GmbH & Co. KG, Gunzenhausen Bauteilsauberkeit Dr. Marc Nikolussi Robert Bosch GmbH Automotive Electronics Semiconductors & Sensors, Reutlingen Prozessinnovation als Erfolgsfaktor - der Weg zu Best Cost Michael Polligger cms electronics gmbh, Klagenfurt am Wörthersee Overview of Modern RF/Microwave Design Software and Linking RF Design and Test Heikki Rekonen National Instruments Germany GmbH, München 13:00-13:30 h 13:30-14:00 h 14:00-14:30 h 14:30-15:00 h Halle C1 / C1.320 Halle C1 / C1.320 Halle C1 / C1.320 Halle C1 / C :00 Seite 26

27 PCB & Components Market Place FPGA based RF-measurements for research and test 15:00-15:30 h Halle C1 / C1.320 Christian Gindorf National Instruments Germany GmbH, München Business Outlook for the Global Electronics Industry Walt Custer Custer Consulting Group, The Sea Ranch, CA Material Data for Assemblies - Cooperation on the Declaration of Material Data Between ZVEI and the Automotive Industry Karin Oldenburg, Core Team Electronic Components and Systems ZVEI Core Team Electronic Components and Systems ZVEI Tier 1 manufacturers and material data implementation in IMDS Dr Stafan Dully, Core Team Electronic Components and Systems ZVEI Core Team Electronic Components and Systems ZVEI Declaration of Material Data of electronic Components by using Umbrella Specification Dr Gerd Schulz, Core Team Electronic Components and Systems ZVEI Core Team Electronic Components and Systems ZVEI 15:30-16:00 h Fr :00-10:30 h Fr :30-11:00 h Fr :00-11:30 h Halle C1 / C1.320 Halle C1 / C1.320 Halle C1 / C1.320 Halle C1 / C :00 Seite 27

28 PCB & Components Market Place Printed Circuit Board Manufacturers and material declaration Fr :30-12:00 h Halle C1 / C1.320 Ramona Edelbluth, Core Team Electronic Components and Systems ZVEI Core Team Electronic Components and Systems ZVEI Internet of Things via seamless Ethernet device connectivity Thilo Maier, RIA CONNECT GmbH RIA CONNECT GmbH, Blumberg Business Outlook for the Global Electronics Industry Walt Custer Custer Consulting Group, The Sea Ranch, CA Fr :00-12:30 h Fr :30-13:00 h Halle C1 / C1.320 Halle C1 / C :00 Seite 28

29 exhibitor Forum Power Entry Modules and Filters for Medical Application 13:30-14:00 h Halle B5 / B5.351 Herbert Blum SCHURTER AG, Luzern Supply Chain? It?s a Risky Business - Supply Chain Trends & Risk Management for 2013 Doug Kent Brian Wilken Avnet Supply Chain Solutions Embedded Computing Platform Claus Merle Esterline Interface Technologies, Coeur d'alene, ID How to recover and recycle ICs from obsolete and scrap PCBs safely Tony Boswell Retronix The Five Ways to Creating Value with Light Takashi Kato Stanley Electric GmbH, Mörfelden-Walldorf 14:00-14:30 h 14:30-15:00 h 15:00-15:30 h 15:30-16:00 h Halle B5 / B5.351 Halle B5 / B5.351 Halle B5 / B5.351 Halle B5 / B :00 Seite 29

30 exhibitor Forum Safety and Surge Immunity Requirements for Indoor and Outdoor LED Lighting Applications 10:00-10:30 h Halle B5 / B5.351 Bharat Shenoy Littelfuse Europe GmbH, Bremen Next Generation Humidity Sensor Vincent Hess Sensirion AG, Staefa FPGA-enabled Automated Test Applications Christoph Landmann National Instruments Germany GmbH, München Wirbelstromsensoren- Einsatz, Funktionen, Schnittstellen und Applikationen Michael Reiter WayCon Positionsmesstechnik GmbH, Taufkirchen Adding magnetic sensors? more trouble than they?re worth? Becky Oh Willow Technologies Limited, Copthorne 10:30-11:00 h 11:00-11:30 h 11:30-12:30 h 12:30-13:00 h Halle B5 / B5.351 Halle B5 / B5.351 Halle B5 / B5.351 Halle B5 / B :00 Seite 30

31 exhibitor Forum Hybrid DC Power Solutions for unstable grids on wireless sites 13:30-14:00 h Halle B5 / B5.351 Ingo Meyer b+w Electronic Systems GmbH & Co.KG, Oberhausen Capitalizing on Complexity: Reducing Multi-tier Supply Risk Pascal Fernandez Avnet Supply Chain Solutions The Changing Environment in Electronics Manufacturing Eric H. Miscoll Charlie Barnhart & Associates LLC Nutzung globaler Quellen im Einkauf Die webbasierte Lösung Bay-2 Quote für Richtangebote in kürzester Zeit Helmut Krautwurm Bay-Soft GmbH Branchenlösung Elektronik, Obernzell The Technology Keeps Going Michael Liedtke Maxwell Technologies GmbH, München 14:00-14:30 h 14:30-15:00 h 15:00-15:30 h 15:30-16:00 h Halle B5 / B5.351 Halle B5 / B5.351 Halle B5 / B5.351 Halle B5 / B :00 Seite 31

32 exhibitor Forum LED Pixel Light Solution for Automotive Advanced Front Lighting Systems 16:00-16:30 h Halle B5 / B5.351 Leo Aichriedler Paul Decloedt ON Semiconductor, Windsor, Berks What to Look for in Your Next Power Supply Cochise Mapa SL Power Electronics, South Molton Informed Outsourcing Decision Making? the Profitable Proximity Conundrum Doug Kent Avnet Supply Chain Solutions Stress- / Dehnungs- Messung an Platinen (PCB), mit KYOWA DMS (KFRS, KFG) und den Messsystemen DEWESoft DS-43 / Sirius Gallus Lindner ZSE Mess-Systeme & Sensortechnik GmbH Making it really Software Defined? up to Microwave frequencies Nicolas Chantier e2v semiconductors, Saint Egreve 10:00-10:30 h 10:30-11:00 h 11:00-11:30 h 11:30-12:00 h Halle B5 / B5.351 Halle B5 / B5.351 Halle B5 / B5.351 Halle B5 / B :00 Seite 32

33 exhibitor Forum Stock Around the Clock 12:00-12:30 h Halle B5 / B5.351 Tilo Rollwa RUTRONIK Elektronische Bauelemente GmbH, Ispringen Bioplastic the future fo plastic costs Egon Weinlein OKW Odenwälder Kunststoffwerke Gehäusesysteme GmbH, Buchen IMST enables realization of high density Integrated power solutions for increasingly challenging automotive and industrial applications Leo Aichriedler ON Semiconductor, Windsor, Berks Calm Waters or Eye of Storm? Global, Local factors impacting the EMEA Supply Chain Erwin Luginsland Avnet Supply Chain Solutions Beyond Outsourcing: The Future Landscape of Electronics Manufacturing Eric H. Miscoll Charlie Barnhart & Associates LLC 12:30-13:00 h 13:30-14:00 h 14:00-14:30 h 14:30-15:00 h Halle B5 / B5.351 Halle B5 / B5.351 Halle B5 / B5.351 Halle B5 / B :00 Seite 33

34 exhibitor Forum Lötfreie Anschlusstechnik 15:00-15:30 h Halle B5 / B5.351 Werner Moritz Unimet GmbH, Rieden PRECI-DIP company and products technology presentation Patrick Loviat PRECI-DIP, Delémont 15:30-16:00 h Halle B5 / B :00 Seite 34

35 electronica automotive conference (kostenpflichtige Vorträge) China: The Market for New Innovative Automotive Information Technology Mo :00-10:30 h - Room 5 Klaus Zimmer, Senior Vice President of Neusoft Corporation / President of Neusoft Europe AG, Neusoft Racing to Win: How Automotive Innovation Needs to Be Redefined in Light of the Post-PC Revolution Harald Grübel, President & CEO, Consulting4Drive Timm Kellermann, Principal, Consulting4Drive Mo :30-11:00 h - Room 5 What Must Change to Deliver an In-Vehicle Cloud Experience? Christian Feltgen, Director, Global Cockpit Electronics Technologies, Visteon Innovation & Technology GmbH Mo :30-12:00 h - Room 5 Visteon Innovation & Technology GmbH, Kerpen LTE, Automotive Broadband Data Connectivity Ulrich Moehlmann, Director LTE Automotive, Alcatel-Lucent Deutschland AG Powertrain Electrification: Current Challenges and Solutions in Development of Power Electronics Dr. Rupert Stützle Robert Bosch GmbH Automotive Electronics Semiconductors & Sensors, Reutlingen Strategies of Suppliers in the Markets of Motors and Inductive Charging for Electric Mobility Gerald Teuschl, BROSE-SEW ELEKTROMOBILITÄTS GmbH & Co. KG Managing Complexity. System Architecture Aspects for Safe and Efficient Mobility Enno Kelling, Continental AG Mo :00-12:30 h Mo :30-14:00 h Mo :00-14:30 h Mo :00-15:30 h - Room 5 - Room 5 - Room 5 - Room :00 Seite 35

36 electronica automotive conference (kostenpflichtige Vorträge) Electronic Systems in Vehicles: Safety is Mandatory during the Whole Life-Time Cycle! Mo :30-16:00 h - Room 5 Horst Schneider, Member of the board of TÜV SÜD AG (strategic business segment mobility), TÜV SÜD AG Semiconductors in Automotive? How to Get the Best of Both Worlds to Jointly Drive Innovation Kurt Sievers, Executive Vice President and General Manager of the Automotive Business Unit NXP Semiconductors Netherlands B.V., Eindhoven Automotive Electronics? Accelerating Innovation Gregg Lowe, Chairman & CEO, Freescale Semiconductor Freescale Halbleiter Deutschland GmbH, München The Importance of Rational Standardization Serge Megazzini, Executive Vicepresident Sales and Marketing, Kostal Kontakt Systeme GmbH KOSTAL Kontakt Systeme GmbH, Lüdenscheid Semiconductor Solutions to Cut Energy Losses Dr. Alfons Graf, Director Automotive Systems, Infineon Technologies AG Infineon Technologies AG, Neubiberg Semiconductor Supporting Functional Safety Thomas Böhm, Microcontroller Application & Concept Engineering Automotive, Infineon Technologies AG Infineon Technologies AG, Neubiberg Mo :30-17:00 h Mo :00-17:30 h 09:00-09:30 h 09:30-10:00 h 09:30-10:00 h - Room 5 - Room 5 - Room 5 - Room 4 - Room :00 Seite 36

37 electronica automotive conference (kostenpflichtige Vorträge) More than Moore: Trends of MEMS Sensors 10:00-10:30 h - Room 5 Dr. Georg Bischopink, Vice President, Bosch Engineering Sensors for External Customers, Robert-Bosch GmbH Robert Bosch GmbH Automotive Electronics Semiconductors & Sensors, Reutlingen COOLiR²? Power Semiconductor Technologies for (H)EV Mobility Benjamin Jackson, Senior Manager, Automotive Power Switch & Module, Product Management, International Rectifier 10:00-10:30 h - Room 4 International Rectifier GmbH, Neu-Isenburg Security Challenges and Solutions for the Connected Car Rainer Makowitz, Manager Automotive System Solutions Engineering, Freescale Halbleiter Deutschland GmbH Freescale Halbleiter Deutschland GmbH, München Swirling Jet-StreamsTM-Technology? New Ways for Power Device Cooling Dr. Frank Rottmann, Consultant The Intelligent Antenna: A Proper Answer for the Connected World Michael Heise, CEO, Kathrein Automotive kathrein automotive 11:00-11:30 h 11:00-11:30 h 11:30-12:00 h - Room 5 - Room 4 - Room :00 Seite 37

38 electronica automotive conference (kostenpflichtige Vorträge) Die Attach Materials for DCB-Modules 11:30-12:00 h - Room 4 Thomas Krebs, Manager Development of Sintering Materials, Heraeus Materials Technology GmbH & Co. KG Heraeus Materials Technology GmbH & Co. KG Power- and Embedding PCBs for Hybrid and E Cars Christian Roessle, Vice President Sales & Marketing, Schweizer Electronic AG SCHWEIZER ELECTRONIC AG, Schramberg Connectivity for Vehicle Data Highways Dr. Thomas Ginsberg, Director Product Engineering, TE Connectivity Tyco Electronics AMP GmbH a TE Connectivity Ltd. company, Bensheim Optimized Power Electronic Components and Systems Norbert Pieper, Senior Vice President Sales Business Development, VISHAY Vishay Europe Sales GmbH c/o Vishay Electronic GmbH, Selb APIX next - Gbps-Networking for Automotive Robert Kraus, President/CEO, Inova Semiconductors INOVA Semiconductors GmbH, München 12:00-12:30 h 12:00-12:30 h 13:30-14:00 h 13:30-14:00 h - Room 4 - Room 5 - Room 4 - Room :00 Seite 38

39 electronica automotive conference (kostenpflichtige Vorträge) Automotive Interiors Becomes Smarter 14:00-14:30 h - Room 5 Dr. Andreas Eppinger, Group VP Technology Management, Johnson Controls Johnson Controls Antiglare Light Based on Electroluminescence for Plain and Curved Surfaces Elisabeth Warsitz, Development Engineer, Franz Binder GmbH + Co. elektrische Bauelemente KG Franz Binder GmbH + Co. Elektrische Bauelemente KG, Neckarsulm Traceability? Synergy Opportunities of a Global Requirement Bernd Enser, Director Quality and Operational Excellence, Sanmina-SCI SANMINA - SCI Holding GmbH & Co. KG, Gunzenhausen Panel Discussion: Concepts of Mobility (free of charge) Moderator: Peter Gresch, Steering Committee Automotive ZVEI Teilnehmer: Prof. Dr. Friedrich Indra, T.U. Wien Henri Richard, Senior Vice President, Chief Sales and Marketing Officer, Freescale Semiconductor Ian Riches, Director Global Automotive Practice, Strategy Analytics, Inc. Gerald Teuschl, BROSE-SEW ELEKTROMOBILITÄTS GmbH & Co. KG 14:00-14:30 h 14:30-15:00 h 15:30-17:00 h - Room 4 - Room 5 - Room :00 Seite 39

40 embedded platforms conference (kostenpflichtige Vorträge) Session 1: Embedded Design, Multicore, Future Challenges Where will you begin your next embedded design? Start with the CPU? The peripherals or further away from the hardware? 09:00-09:45 h Jean Labrosse, Micrium Farnell GmbH, Oberhaching Session 2: XMC4000 Family, DAVE3 The XMC4000-MCU family count-less solutions for industrial applications in one hardware platform Andreas Jansen, Infineon Technologies AG Infineon Technologies AG, Neubiberg Session 3: 8, 16 and 32 Bit RISC, CISC, Singlecore, Multicore? Overview of Cores, Peripherals and Tools Dieter Volland, MicroConsult GmbH Business Development, Munich Session 1: Embedded Design, Multicore, Future Challenges Migrating to Multicore Example of an eco-system and view on how multicore products will scale in the future Jean-Christophe Bodet, Freescale Farnell GmbH, Oberhaching Session 2: XMC4000 Family, DAVE4 Wide landscape of free and commercial tools and software solutions for the XCM4000-MCU family Georg Huba, Infineon Technologies AG Infineon Technologies AG, Neubiberg 09:00-10:00 h 09:00-12:30 h 09:45-10:30 h 10:00-10:30 h :00 Seite 40

41 embedded platforms conference (kostenpflichtige Vorträge) Session 2: XMC4000 Family, DAVE5 Technical concept of code generation and resources management for embedded systems with DAVE3 11:00-11:30 h Oreste Bernardi, Infineon Technologies AG Infineon Technologies AG, Neubiberg Session 1: Embedded Design, Multicore, Future Challenges Future Challenges Are the next generation of engineers and programmers ready for the next generation of design challenges? Farnell GmbH, Oberhaching Session 2: XMC4000 Family, DAVE6 Life session to develop a complex embedded SW project with DAVE Apps in less than 1 hour Infineon Technologies AG, Neubiberg Session 5: Motor Control TOSHIBA Product Line-up for Motor Applications Roland Gehrmann, Toshiba Electronics Europe GmbH, Düsseldorf Toshiba Electronics Europe GmbH, Düsseldorf Session 6: ARM, Processor Selection, LINUX, Certification The ARM architecture on its way to industry. N.N., Texas Instruments Frank Walzer, Texas Instruments Open Source Automation Development Lab (OSADL) eg, Schramberg 11:00-12:30 h 11:30-12:30 h 13:30-14:00 h 13:30-14:15 h :00 Seite 41

42 embedded platforms conference (kostenpflichtige Vorträge) Session 4: Embedded Standardisation SGET and the world of embedded technologies standards 13:30-17:00 h Engelbert Hörmannsdorfer, SGET Standardization Group for Embedded Technologies e.v., Miesbach Session 5: Motor Control Introduction of TOSHIBA Cortex M370 based Motor control Architecture Andreas Kohl, Toshiba Electronics Europe GmbH, Düsseldorf Toshiba Electronics Europe GmbH, Düsseldorf Session 6: ARM, Processor Selection, LINUX, Certification How to select the best suitable processor for a given industrial application? Dr. Carsten Emde, OSADL eg Open Source Automation Development Lab (OSADL) eg, Schramberg Session 5: Motor Control Tools and SW Support Thomas Haase, Toshiba Electronics Europe GmbH, Düsseldorf Toshiba Electronics Europe GmbH, Düsseldorf Session 6: ARM, Processor Selection, LINUX, Certification Challenges and chances of real-time Linux Thomas Gleixner, Linutronix Open Source Automation Development Lab (OSADL) eg, Schramberg 14:00-15:00 h 14:15-15:00 h 15:30-16:00 h 15:30-16:15 h :00 Seite 42

43 embedded platforms conference (kostenpflichtige Vorträge) Session 5: Motor Control Practical Session 16:00-17:00 h Andreas Kohl, Toshiba Electronics Europe GmbH, Düsseldorf Thomas Haase, Toshiba Electronics Europe GmbH, Düsseldorf Toshiba Electronics Europe GmbH, Düsseldorf Session 6: ARM, Processor Selection, LINUX, Certification Current status of the GNU/Linux SIL2 certification Project Nicholas Mc Guire, Opentech Open Source Automation Development Lab (OSADL) eg, Schramberg Get together embedded platforms conference Session 8: Multicore, ARM, Safety Multicore Efficiency : how TI enables High Performance Computing, maximizing GFLOPS/Watt Jochen Schyma, Texas Instruments Texas Instruments Deutschland GmbH, Freising Session 9: FM3Connect? USB and Ethernet, ECO system for ARM Cortex? Embedded USB solutions? ready to use Manuel Schreiner, Fujitsu Semiconductor Europe, Langen 16:15-17:00 h 17:30-21:00 h 09:00-09:45 h 09:00-10:30 h :00 Seite 43

44 embedded platforms conference (kostenpflichtige Vorträge) Session 7: Power Architecture Modules, ARM Modules The Power Architecture module market 09:00-10:30 h Wolfgang Heinz-Fischer, Head of Marketing, TQ Group Frank Roux, Freescale Halbleiter Deutschland GmbH, München TQ Group, Seefeld Session 8: Multicore, ARM, Safety Helping developers unleash the best of ARM to the industrial market Yves Massè, Texas Instruments Texas Instruments Deutschland GmbH, Freising Session 9: FM3Connect? USB and Ethernet, ECO system for ARM Cortex? FM3Connect? The ECO system for connectivity application development Dirk Fischer, Fujitsu Semiconductor Europe, Langen Session 7: Power Architecture Modules, ARM Modules The ARM module market Wolfgang Heinz-Fischer, Head of Marketing, TQ Group Jean Louis Dolmeta, Freescale Halbleiter Deutschland GmbH TQ Group, Seefeld Session 8: Multicore, ARM, Safety TI?s microcontroller solutions for safety critical control applications Gerhard Wenderlein, Texas Instruments Dr. Kurt Böhringer, Hitex Development Tools GmbH Texas Instruments Deutschland GmbH, Freising 09:45-10:30 h 11:00-11:45 h 11:00-12:30 h 11:00-12:30 h :00 Seite 44

45 embedded platforms conference (kostenpflichtige Vorträge) Session 9: FM3Connect? USB and Ethernet, ECO system for ARM Cortex? FM3 TwinMAC? single and dual port Ethernet MCUs 11:45-12:30 h Christoph Nolte, Fujitsu Semiconductor Europe, Langen Session 11: Managing Project Uncertainties with the Right Development Platform Building your first project with Atmel Studio 6 and the Atmel Software Framework Jacob Lunn Lassen Joerg Berthold, Director of Marketing at Atmel Corporation ATMEL Corporation, San Jose, CA Session 12: Debug, Trace and Analysis Debugging of Complex Microcontrollers Principles and recommendations Heiko Rießland, PLS Programmierbare Logik & Systeme GmbH MicroConsult GmbH Business Development, Munich Session 10: QorIQ, i.mx 6, AMP Speed up your Multicore Designs with Embedded Board Solutions Frank Roux, Freescale Halbleiter Deutschland GmbH, München Jean Louis Dolmeta, Freescale Halbleiter Deutschland GmbH, München Freescale Halbleiter Deutschland GmbH, München 13:30-14:15 h 13:30-14:15 h 13:30-14:30 h :00 Seite 45

46 embedded platforms conference (kostenpflichtige Vorträge) Session 12: Debug, Trace and Analysis Trace-Streaming New Technology for debugging, performance tuning and quality assurance 14:15-15:00 h Andrea Martin, Lauterbach MicroConsult GmbH Business Development, Munich Session 11: Managing Project Uncertainties with the Right Development Platform Expanded project needs: moving your design to Cortex-M4 Maintaining your project progress while having to switch MCUs! Stephane Mainchane Joerg Berthold, Director of Marketing at Atmel Corporation ATMEL Corporation, San Jose, CA Session 10: QorIQ, i.mx 6, AMP Congatec : EBS Boards for i.mx Architecture Christian Eder, Director Marketing congatec AG, Deggendorf Session 10: QorIQ, i.mx 6, AMP Phytec : EBS Boards for i.mx Architecture Axel Berghoff PHYTEC Messtechnik GmbH, Mainz 14:15-15:00 h 14:30-15:00 h 15:30-16:00 h :00 Seite 46

47 embedded platforms conference (kostenpflichtige Vorträge) Session 11: Managing Project Uncertainties with the Right Development Platform Satisfying RTOS needs: Resource contention, synchronization efficiency Solving increased project complexity with the use of an RTOS 15:30-16:15 h John Fogelin Richard Barry, Real Time Engineers Joerg Berthold ATMEL Corporation, San Jose, CA Session 12: Debug, Trace and Analysis Analysis of Code Execution and Data Access in Modern Microcontrollers Capabilities and limits Erol Simsek, isystem MicroConsult GmbH Business Development, Munich Session 10: QorIQ, i.mx 6, AMP Kontron: EBS Boards for QoRIQ Architecture Peter Müller, Productline Manager Kontron Computer-on-Modules Kontron AG, Eching Session 11: Managing Project Uncertainties with the Right Development Platform Optimizing your design: Maximizing resource utilization, space efficiency John Fogelin Johannes Bauer, ARM Joerg Berthold, Director of Marketing at Atmel Corporation ATMEL Corporation, San Jose, CA 15:30-16:15 h 16:00-16:30 h 16:15-17:00 h :00 Seite 47

48 embedded platforms conference (kostenpflichtige Vorträge) Session 12: Debug, Trace and Analysis Challenges on debugging and analysis tools - today and tomorrow How to meet the requirements of multicore, power efficient code, safety critical applications, etc. 16:15-17:00 h Martin Gisbert, IAR MicroConsult GmbH Business Development, Munich Session 10: QorIQ, i.mx 6, AMP TQS: EBS Boards for i.mx and i.mx architectures Wolfgang Heinz-Fischer, Head of Marketing, TQ Group TQ Group, Seefeld 16:30-17:00 h :00 Seite 48

49 Wireless Congress (kostenpflichtige Vorträge) OPENING KEYNOTE: Cloud Services, Smart Devices and M2M: Redefining The Wireless Communication Industry Paradigm 09:00-09:50 h Dale Ford, IHS isuppli Dr. Jagdish Rebello, IHS isuppli Session 1: 4G/Mobile Communication Internet for everything? trends and innovation Hamid-Reza Nazeman, Qualcomm Session 3: Industrial Wireless/Automation/M2M Wireless Automation and M2M: Components, Modules and Systems Cristian Toma, Microchip Technology Vivien Delport, Microchip Technology Microchip Technology, Ismaning Tutorial 1 What's the difference between the new Bluetooth versions? Rolf Nilsson, connectblue Pelle Svensson, connectblue connectblue, Malmö Session 1: 4G/Mobile Communication Bringing 4G to Emerging Markets Paul Marion, Marvell Semiconductors Marvell Semiconductor, Inc., Watford Herts. 10:00-10:30 h 10:00-10:30 h 10:00-11:00 h 10:30-11:00 h :00 Seite 49

50 Wireless Congress (kostenpflichtige Vorträge) Session 3: Industrial Wireless/Automation/M2M GSM Technology goes deep into Industrial Automation controllers 10:30-11:00 h Bruno Forgue, ProSoft Technology Pavel Matejka, Rockwell Automation Session 3: Industrial Wireless/Automation/M2M Energy Optimized Point-to-Point Communication of Energy Autarkic Smart Meters Using Mobile Communication Infrastructure Marcos G. Lima, University of Applied Sciences Offenburg Prof. Dr. Axel Sikora, University of Applied Sciences Offenburg Session 5: Automotive Wireless Technology Wireless charging for e-vehicles Thomas Nindl, Qualcomm Session 2: Bluetooth Technology 7 Billion and Counting: How Bluetooth Will Power the Connectivity Revolution Chuck Sabin, Bluetooth SIG Session 3: Industrial Wireless/Automation/M2M Network Simulation of Wireless M-Bus Networks Manuel Schappacher, Steinbeis Transfer Center Embedded Design und Networking Prof. Dr. Axel Sikora, University of Applied Sciences Offenburg Session 2: Bluetooth Technology Bluetooth - The Next 10 Billion Devices Peter Cooney, ABI Research 11:30-12:00 h 11:30-12:00 h 11:30-12:30 h 12:00-12:30 h 12:00-12:30 h :00 Seite 50

51 Wireless Congress (kostenpflichtige Vorträge) Session 5: Automotive Wireless Technology Remote Vehicle Monitoring 12:00-12:30 h Maurice Geraets, NXP Semiconductors NXP Semiconductors Netherlands B.V., EINDHOVEN Session 6: Energy Harvesting & Power Management Data security in energy harvesting wireless networks Dr. Wolfgang Heller, EnOcean Session 2: Bluetooth Technology Bluetooth low energy - new chips and new technical opportunities Roger Pedersen, Nordic Semiconductor Session 3: Industrial Wireless/Automation/M2M Wireless communication in rough industrial environments Prof. Dr. Stephan Schäfer, University of Applied Science HTW Berlin Dirk Schöttke, University of Applied Science HTW Berlin Session 3: Industrial Wireless/Automation/M2M Approach to Determining the Density of Industrial Wireless Systems Marko Krätzig, Institut für Automation und Kommunikation Session 2: Bluetooth Technology Bluetooth LE - Assessment within a Competing Wireless World Mohamed Habba, Atlantik Elektronik Atlantik Elektronik GmbH, Planegg 13:30-14:00 h 13:30-14:00 h 13:30-14:00 h 14:00-14:30 h 14:00-14:30 h :00 Seite 51

52 Wireless Congress (kostenpflichtige Vorträge) Session 6: Energy Harvesting & Power Management New solution addresses measurement challenges related to wireless devices driven by microharvester 15:00-15:30 h Carlo Canziani, Agilent Technologies Agilent Technologies GmbH, Böblingen Session 4: NFC/RFID Technology Emulating complex HF-RFID protocols for identity and sensing Prof. Dr. Marcel Meli, Zurich University of Applied Sciences Olivier Rion, Zurich University of Applied Sciences Session 2: Bluetooth Technology Bluetooth Classic and Low Energy - Points to consider Rudi Latuske, ARS Software Session 6: Energy Harvesting & Power Management Wireless Charging: where and what? Yves Legrand, Freescale Semiconductor Freescale Halbleiter Deutschland GmbH, München Session 2: Bluetooth Technology Developing a Bluetooth Low Energy Solution Brian Senese, Sybase, an SAP company 15:00-15:30 h 15:00-15:30 h 15:30-16:00 h 15:30-16:00 h :00 Seite 52

53 Wireless Congress (kostenpflichtige Vorträge) Session 4: NFC/RFID Technology NFC - New Applications and Devices 15:30-16:00 h Volker Rzehak, Texas Instruments Jürgen Mayer-Zintel, Texas Instruments Texas Instruments Deutschland GmbH, Freising Session 4: NFC/RFID Technology NFC - How standardization and certification ensures interoperability Heinz Mellein, Rohde & Schwarz Anasthasia Westphal, Rohde & Schwarz ROHDE & SCHWARZ GmbH & Co. KG, München Session 2: Bluetooth Technology An ultra low power Bluetooth Smart integrated solution Franz Dugand, RivieraWaves Vincent Peiris, CSEM CSEM Centre Suisse d'electronique et de Microtechnique SA, Neuchâtel Session 6: Energy Harvesting & Power Management Heat replaces batteries to power wireless sensors, meters and actuators Wladimir Punt, Micropelt Micropelt GmbH Energy Harvesting, Freiburg 16:00-16:30 h 16:00-16:30 h 16:00-16:30 h :00 Seite 53