Hyper TOPLED White LED LW T676 Vorläufige Daten / Preliminary Data Besondere Merkmale Gehäusetyp: weißes P-LCC-2 Gehäuse Besonderheit des Bauteils: extrem breite Abstrahlcharakteristik; ideal für Hinterleuchtungen und Einkopplungen in Lichtleiter Farbort: x =,3, y =,32 nach CIE 1931 (weiß) typische Farbtemperatur: 73 K Farbwiedergabeindex: 8 Abstrahlwinkel: extrem breite Abstrahlcharakteristik (12 ) Technologie: GaN optischer Wirkungsgrad: 2lm/W Gruppierungsparameter: Lichtstärke, Farbort Verarbeitungsmethode: für alle SMT-Bestücktechniken geeignet Lötmethode: IR Reflow Löten und Wellenlöten (TTW) Vorbehandlung: nach JEDEC Level 2 Gurtung: 8 mm Gurt mit 2/Rolle, ø18 mm oder 8/Rolle, ø33 mm ESD-Festigkeit: ESD-sicher bis 2 kv nach MIL STD 883 D, Method 31.7 Anwendungen Informationsanzeigen im Innenbereich Hinterleuchtung (LCD, Schalter, Tasten, Displays, Werbebeleuchtung, Allgemeinbeleuchtung) Innenbeleuchtung im Automobilbereich (z.b. Instrumentenbeleuchtung, u.ä.) Signal- und Symbolleuchten Markierungsbeleuchtung (z.b. Stufen, Fluchtwege, u.ä.) Allgemeinbeleuchtung Features package: white P-LCC-2 package feature of the device: extremely wide viewing angle; ideal for backlighting and coupling in light guides color coordinates: x =.3, y =.32 acc. to CIE 1931 (white) typ. color temperature: 73 K color reproduction index: 8 viewing angle: extremely wide (12 ) technology: GaN optical efficiency: 2lm/W grouping parameter: luminous intensity, color coordinates assembly methods: suitable for all SMT assembly methods soldering methods: IR reflow soldering and TTW soldering preconditioning: acc. to JEDEC Level 2 taping: 8 mm tape with 2/reel, ø18 mm or 8/reel, ø33 mm ESD-withstand voltage: up to 2 kv acc. to MIL STD 883 D, Method 31.7 Applications indoor displays backlighting (LCD, switches, keys, displays, illuminated advertising, general lighting) interior automotive lighting. (e.g. dashboard backlighting, etc.) signal and symbol luminaire marker lights (e.g. steps, exit ways, etc.) general lighting 21-1-3 1
Typ Type Emissionsfarbe Color of Emission Farbe der Lichtaustrittsfläche Color of the Light Emitting Area Lichtstärke Luminous Intensity I V (mcd) Lichtstrom Luminous Flux F V (mlm) Bestellnummer Ordering Code LW T676-M1N1-1 LW T676-N1P2-1 LW T676-M1 LW T676-M2 LW T676-N1 LW T676-N2 LW T676-P1 LW T676-P2 white colored diffused 18.... 3. 28.... 71. 18.... 22.4 22.4... 28. 28.... 3. 3.... 4. 4.... 6. 6.... 71. 8.3 (typ.) 148. (typ.) 6.6 (typ.) 7.6 (typ.) 9.3 (typ.) 12.8 (typ.) 11. (typ.) 19. (typ.) Q6273-Q17 Q6273-Q18 Helligkeitswerte werden mit einer Stromeinprägedauer von 2 ms und einer Genauigkeit von ±11 % ermittelt. Luminous intensity is tested at a current pulse duration of 2 ms and an accuracy of ±11 %. 21-1-3 2
Grenzwerte Maximum Ratings Bezeichnung Parameter Betriebstemperatur Operating temperature range Lagertemperatur Storage temperature range Sperrschichttemperatur Junction temperature Durchlaßstrom Forward current Sperrspannung Reverse voltage Leistungsaufnahme Power dissipation T A 2 C Wärmewiderstand Thermal resistance Sperrschicht/Umgebung Junction/ambient Sperrschicht/Lötpad Junction/solder point Montage auf PC-Board FR 4 (Padgröße ³ 16 mm 2 ) mounted on PC board FR 4 (pad size ³ 16 mm 2 ) Symbol Symbol Wert Value T op 4 + 1 C T stg 4 + 1 C T j + 1 C I F 2 ma V R V Einheit Unit P tot 9 mw R th JA R th JS 28 K/W K/W 21-1-3 3
Kennwerte (T A =2 C) Characteristics Bezeichnung Parameter Farbkoordinate x nach CIE 1931 1) (typ.) Chromaticity coordinate x acc. to CIE 1931 1) Farbkoordinate y nach CIE 1931 1) (typ.) Chromaticity coordinate y acc. to CIE 1931 1) 1) Farbortgruppen Chromaticity coordinate groups Symbol Symbol Wert Value x.3 y.32 Einheit Unit 2j 12 Grad Abstrahlwinkel bei % I V (Vollwinkel) (typ.) Viewing angle at % I V deg. Durchlaßspannung (typ.) V F 3. V Forward voltage (max.) V F 4.2 V Sperrstrom (typ.) I R.1 ma Reverse current (max.) I R 1 ma V R =V Temperaturkoeffizient von x (typ.) TC x.7 1-3 /K Temperature coefficient of y Temperaturkoeffizient von y (typ.) TC y.2 1-3 /K Temperature coefficient of y Temperaturkoeffizient von V F (typ.) TC V 3.1 mv/k Temperature coefficient of V F Optischer Wirkungsgrad Optical efficiency Gruppe Group x y (typ.) h opt 2 lm/w Farbortgruppen werden mit einer Stromeinprägedauer von 2 ms und einer Genauigkeit von ±,1 ermittelt. min. max. min. max. 3.28.3.29.32 Chromaticity coordinate groups are tested at a 4.29.31.31.34 current pulse duration of 2 ms and an accuracy of ±.1..29.32.34.37 6.3.33.3.38 21-1-3 4
Relative spektrale Emission I rel = f (l), T A =2 C, Relative Spectral Emission V(l) = spektrale Augenempfindlichkeit Standard eye response curve 1 OHL467 I rel % 8 V λ 6 4 2 38 43 48 3 8 63 68 73 nm 78 λ Abstrahlcharakteristik I rel = f (j) Radiation Characteristic 4 3 2 1 OHL166 ϕ 1..8 6 7 8 9.6.4.2 1 1..8.6.4 2 4 6 8 1 12 21-1-3
Durchlaßstrom I F = f (V F ) Forward Current T A =2 C I F 1 2 OHL432 Relative Lichtstärke I V /I V(1 ma) = f (I F ) Relative Luminous Intensity T A =2 C I V 1 I V (1 ma) 1 OHL469 1 1 1 1 1 1-1 -2 1-1 1. 2 2. 3 3. 4 4. V 6 V Maximal zulässiger Durchlaßstrom I F = f (T) Max. Permissible Forward Current I F 3 ma 2 F OHL448 1-3 1-1 1 1 1 ma 1 2 I Relative Lichtstärke I V /I V(2 C) = f (T A ) Relative Luminous Intensity I V I V (2 C) 1.2 F OHL442 2.8 1 T A T S.6 1.4 TA temp. ambient T S temp. solder point 2 4 6 8 C 1 T.2-2 2 4 6 C 1 T A 21-1-3 6
Maßzeichnung Package Outlines 3. (.118) 2.6 (.12) 2.3 (.91) 2.1 (.83).1 (.4) (typ.) 2.1 (.83) 1.7 (.67).9 (.3).7 (.28) 3.4 (.134) 3. (.118) Cathode marking (2.4) (.9) 3.7 (.146) 1.1 (.43) 3.3 (.13) 4 ±1. (.2).18 (.7).12 (.).6 (.24).4 (.16) GPLY6724 Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). Kathodenkennung: Cathode mark: abgeschrägte Ecke bevelled edge 21-1-3 7
Lötbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Conditions Preconditioning acc. to JEDEC Level 2 IR-Reflow Lötprofil (nach IPC 91) IR Reflow Soldering Profile (acc. to IPC 91) 3 C OHLY97 T 2 24-24 C 1-4 s 2 1 12 to 18 s 183 C Ramp-down rate up to 6 K/s 1 Ramp-up rate up to 6 K/s Defined for Preconditioning: 2-3 K/s Defined for Preconditioning: up to 6 K/s 1 1 2 s 2 t 21-1-3 8
Wellenlöten (TTW) (nach CECC 82) TTW Soldering (acc. to CECC 82) T 3 C 2 2 23 C... 26 C 1. Welle 1. wave 1 s 2. Welle 2. wave Normalkurve standard curve Grenzkurven limit curves OHLY98 1 ca 2 K/s K/s 2 K/s 1 1 C... 13 C 2 K/s Zwangskühlung forced cooling 1 1 2 s 2 t 21-1-3 9
Empfohlenes Lötpaddesign Recommended Solder Pad IR Reflow Löten / Wellenlöten (TTW) IR Reflow Soldering / TTW Soldering 4. 2.6 1. 1. 4. Padgeometrie für verbesserte Wärmeableitung Paddesign for improved heat dissipation 2.6 Cu-Fläche > 16 mm Cu-area > 16 mm 2 2 Lötstopplack Solder resist OHLP97 21-1-3 1
Gurtung / Polarität und Lage Method of Taping / Polarity and Orientation Verpackungseinheit 2/Rolle, ø18 mm oder 8/Rolle, ø33 mm Packing unit 2/reel, ø18 mm or 8/reel, ø33 mm 1. 4 2 3. 1.7 C 3.6 8.1 2.9 4 A OHA2271 21-1-3 11
Revision History: 21-1-3 Previous Version: 21-1-3 Page Subjects (major changes since last revision) Patent List Patent No. US 6 66 861 Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-9349 Regensburg All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1, may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 21-1-3 12