The Reliable Source of Passive and Electromechanical. Issue # 0905

The Reliable Source of Passive and Electromechanical Components Issue # 95

High Power Heat Sinks INTRODUCTION DAU was founded in 197 and is located in Ligist, Austria - km south from Vienna. Currently the company s main plant site extends over sq.m of which 3 sq.m are covered. Since its foundation DAU has been involved in the manufacture of electromechanical components, and during the last 2 years has become well known as a company specialized in solving thermal management problems, particularly for the high power electronics industry. Due to its wide range of heat dissipating products, DAU can offer a solution for nearly every thermal problem. Besides its thermal management products, DAU also offers problem-solving support services such as CFD software analyses for thermal problems. After modelling virtual prototypes and creating CAD drawings in either AutoCAD or Pro Eng., a highly specialized and automated mechanical department manufactures both the simulated prototypes as well as production parts on CNC controlled milling machines. A modern in house test department, furnished with computerized equipment provides excellent testing facilities. These include wind tunnel and liquid flow test equipment, leakage test equipment and temperature controlled chambers which are used to verify the technical specification of all products. Quality is a main priority aspect in every production step to guarantee the high standard of DAU thermal products. DAU offers a comprehensive range of thermal management products which are used to cater for virtually every thermal dissipation necessity. These include: Heat Spreaders (Stamping, Aluminum Extrusions, Die Casting) Naturally Convected Heat Sinks (Aluminum Extrusions and High Power Bonded Fin Technology) Fan Forced Heat Sinks (Bonded Fin Technology, Metal Bond Technology) Attachment Devices (Springs, Clips, Adhesives) Liquid Cooling Devices (Water Cooling, Fluid Cooling, Oil Cooling) Heatpipes and Heatpipe Assemblies (both Mesh Type Wick and Sintered Wick Heatpipes) Heatexchangers and Heatpipe Heatex changers (Liquid to Air, Liquid to Liquid) Interface Materials (bought-in product from well known suppliers) The most important Heat Sink Technologies of DAU are: 1) Advanced Air Cooling: Modern high power semiconductors must be cooled efficiently to take advantage of their high current capabilities. Conventionally air cooled extruded aluminium heat sinks have been an accepted cooling method used since the beginning of the semiconductor age. Now, with increasingly higher power densities, the thermal performance demand for effective heat dissipation exceeds the limits achievable with conventional extruded heat sinks. To meet the increased performance demand DAU has designed a new generation of power heat sinks - HIGH POWER BONDED FIN HEAT- SINKS. These heat sinks are produced by using an extruded aluminium base section into which separate fins are assembled. The joint between the extruded base section and the fin is made by using a special, high density epoxy developed by DAU together with a well-known producer of epoxy resin to guarantee optimal heat flow from the base plate to the fins. The thermal conductivity of this material is extremely high in comparison to other epoxy materials, and so enables the bonded fin heatsink to achieve a high thermal performance which exceeds all other assembly techniques. The manufacturing process DAU has developed ensures error free products due to careful control of especially selected materials, surface preparations and strictly controlled assembly procedures. The particular manufacturing methods used result in a high strength attachment of the fins to base plate to resist mechanical stresses and stresses caused by high resonant frequency vibration without failure. Usually highly conductive aluminium is used for the base plate. The fins are made of pure aluminum and therefore offer a % better conductivity than extruded fins. Overall performance is therefore increased and the small loss incurred through the poxy interface is more than compensated for. Bonded fin heat sinks offer great advantages especially for high power design. Normally extruded heat sinks are only available with a fin height to fin spacing ratio of max 8:1. 2

High Power Heat Sinks Bonded fin heat sinks can be offered with a ratio of 3:1 or higher. This higher ratio gives more exposed surface area to the cooling air. More surface area means that more heat can be transferred away from the base plate and from the heat generating components. Therefore the junction temperature can be kept lower with bonded fin heat sink than with normally extruded heat sinks. To further increase thermal cooling performance of the DAU EASY SYSTEM, DAU has developed special flow accelerators so called turbulators which increase the coolant velocity in the channels, with only minimal increase in system back pressure. DAU recommends the use of turbulators generally and especially with water - glycol mixtures. 3 2) Advanced Liquid Cooling: In addition to the leading edge bonded fin technology, the time has come to offer also dependable thermal management with liquid cooling technology. To provide the customer with the best heat dissipation DAU has already begun to develop highly advanced liquid cooling systems. This goal in mind and to give the design engineers the possibility not to be restricted in size and to overcome a large number of current liquid cooled heat sink limitations DAU has designed a variety of liquid cooled heat sinks. The first of these is the famous DAU EASY SYSTEM which has become the favourite choice with an increasing number of major manufactures of high power electronic drive systems. Users can choose from 3 standard heat sink widths, which are all available to any desired length up to a maximum of mm. A variety of parallel and series flow configurations are available to choose from to give the best flow situation to suit the customers specific request. The position of the water channels has been designed in such a way that 98% of all available power semiconductors can be accommodated. For applications requiring an open cooling system or requiring cooling coils with copper tubing DAU offers the Series KL, KLF and KLD with different tube materials to avoid corrosion. Usually in most designs the tubes are pressed into the aluminium cold plate with a special manufacturing method, which also seals out moisture and provides a uniformly consant interface for a dependable thermal performance. Latest additions to the DAU range of liquid cooling systems are the new Series UW and HP liquid cooling systems, two ultimate liquid cooling systems with very low thermal resistance performance. Series UW has micro channels positioned especially in the hot zone area which achieve the best possible heat dissipation from the power semiconductor. This micro channel is positioned especially in the hot zone area to develop a vacuum soldering process. Series HP is especially designed for disc power semiconductors like GTO s, IGBT s and IGCT s. The chill block is used in compressive clamp systems and is designed to dissipate heat losses of 1.5 KW and up. Due to its internal construction the pressure drop is very small. Furthermore a majority of cooling products involve some form of customization, this means different cooling techniques as well as production methods. Complete design analysis, modelling, prototyping, design assistance and manufacturing is provided by DAU. For custom product assistance please consult DAU Applications Engineering Department.

High Power Bonded Fin Heat Sinks SERIES FT BF 2 All types are available in any desired length and fin height. Faster airflow and taller fin height improve the thermal values. On request parts can be supplied with surface finish. Customer specific designs are welcome. Please send us your requirements. Sämtliche Ausführungen sind in jeder gewünschten Kühlkörperlänge und Finnenhöhe lieferbar. Höhere Luftgeschwindigkeit bzw. Finnen verbessern die thermischen Werte. Auf Wunsch können die Teile auch mit Oberflächenvergütung geliefert werden. Kundenspezifische Ausführungen und Formen sind möglich. Bitte senden Sie uns Ihre Anforderungen. Standard type Details for Rth definition D Flange type add F to type BP Breite BP Dicke An. Finnen Finnendicke Länge Höhe Rth 6% (K/W) Rth % (K/W) Type B D N FT L H mm mm mm mm mm mm 1 m/s 3 m/s 5 m/s 1 m/s 3 m/s 5 m/s Details zur Rth Definition Rth 6% means that heat source size is 6% of heat sink base plate surface. Rth 6% bedeutet, dass die Größe der Wärmequelle 6% der Grundfläche der Basisplatte beträgt. Rth % means that heat source is he same size as the heat sink base plate surface. Rth % bedeutet, dass die Größe der Wärmequelle % der Grundfläche der Basisplatte beträgt. 4

High Power Bonded Fin Heat Sinks SERIES BF Rth Curves 6%-% / Rth Kurven 6%-% BF 2-2 BF 2-2,3,3,25,25 Rth (K/W),2, Rth (K/W),2,,,,5,3 38,2 61,2 84,1 7, 13, 3, Volume Flow (m 3 /h),5 1, 2,5 4, 5,5 7, 8,5, Velocity (m/s) BF 1-2 BF 1-2,25,25,2,2 Rth (K/W),, Rth (K/W),,,5,5, 22,8 57, 91,1 125, 9, 194, 228, Volume Flow (m 3 /h), 1, 2,5 4, 5,5 7, 8,5, Velocity (m/s) BF 176-2 BF 176-2,,,12,12 Rth (K/W),9,6 Rth (K/W),9,6,3,3, 26,5 66,2 6, 146, 185, 225, 265, Volume Flow (m 3 /h), 1, 2,5 4, 5,5 7, 8,5, Velocity (m/s) BF 32-32 BF 32-32,8,8,6,6 Rth (K/W),5,3 Rth (K/W),5,3,2,2 5, 73,2 183, 293, 2, 512, 622, 732, Volume Flow (m 3 /h), 1, 2,5 4, 5,5 7, 8,5, Velocity (m/s)

Innovative High Power Bonded Fin Heat Sinks SERIES SERIES IHM/IHV FT 2 This new design offers many benefits over conventional heatsinks with standard flat baseplate. The series IHM/ IHV has been developed especially for IGBT with outside dimensions of 13 x 1 mm and 19 x 1 mm. 1. Because of the tight fin spacing, the highest possible heat transfer per unit volume is achieved. 2.Due to the special shape of the baseplate, a 2 to 25% higher heat dissipation is achieved as compared to conventional baseplate designs. 3.Typical properties of these heatsinks are: small temperature gradient high latent heat capacity high heat time constant The thermal resistance depends on the length and air flow volume (m3/s). Any desired length can be supplied. On request the IHM/IHV heat sinks can be supplied with fan. Type X mm L mm H mm Typ R th per Modul Dieses neue Design bietet viele Vorteile gegenüber den üblichen Kühlkörpern mit flacher Basisplatte. Die Serie IHM/IHV wurde deshalb speziell für IGBT mit den Abmessungen 13 x 1 mm und 19 x 1 mm entwickelt. 1. Durch den geringen Finnenabstand wird der größtmögliche Wärmetransfer pro Volumeneinheit erzielt. 2. Durch die spezielle Form der Basisplatte werden um 2-25% bessere Wärmeabfuhrwerte gegenüber konventionellen Basisplattenformen erreicht. 3. Typische Merkmale dieser Serie sind: geringer Temperaturgradient große Wärmekapazität große Wärmezeitkonstante IHM IHV 26 33 min max 1 1 Stand. 163 183 K/kW 24 Der thermische Widerstand ist abhängig von der Länge und vom Volumenstrom der Kühlerluft. Es kann jede beliebige Länge hergestellt werden. Auf Wunsch kann der IHM/IHV Kühler auch mit Lüfter geliefert werden. 6

Innovative High Power Bonded Fin Heat Sinks THERMAL PERFORMANCE IHM/IHV The curve on the right shows the thermal resistance of the heat sink as a function of the heat sink length x volume flow rate. To calculate for example the necessary volume flow rate for a given heat sink proceed as follows: Number of IGBT modules: 3 Power rating per module: W Total length of heat sink: 1 m Max. temperature rise: K Total volume flowrate =? Die nebenstehende Kurve zeigt den Wärmewiderstand in Abhängigkeit der Kühlkörperlänge x Volumenstrom. Um den notwendigen Volumenstrom für einen gegebenen Kühlkörper zu berechnen, verfahren Sie nach folgendem Beispiel: Anzahl IGBT Module: 3 Verlustleistung pro Modul: W Komplette Kühlerlänge: 1 m Max.Temperaturerhöhung: K Volumenstrom Gesamtkühlk.=? Rth [K/kW] 54 52 48 46 44 42 38 36 34 32 3 28 26 24 22 2 18 16 14 12 8 6 4 2 Calculation example for IHM R th Modul R th per module to LV for IHV/IHM Heat Sink 33 mm/26 mm wide,5,1,,2,25,3,35,4,45,5 LV [m 4 /s] (= Length x Volume flow) ] Berechnungsbeispiel für IHM = T = P Modul [ K = K/KW get from curve factor LV for this R th W [ ] [ ] IHV IHM LV = 3.7. -2 m -4 L V GK = v x (Nr. of Mod. ) 2 m -4. =.37 x 3 2 1 =.332 m 3 /s s total length s 1 =========== m 7

High Power Soldered Fin Heat Sinks SERIES FT SF 2 Width B Baseplate D1 Thickness D2 Fin Thickness FT Height H Length L min. 8 8,5 25 6 max. 25 2, 1 DAU SF heat sinks now offer the design engineer the ability to dissipate extremely high power on small volume heat sinks. The unique solder technique creates an excellent interface between the copper baseplate and the tin plated copper fins which has no measureable thermal resistance. DAU Soldered Fin Kühlkörper eröffnen dem Anwender komplett neue Möglichkeiten bei der Entwärmung von Bauelementen mit hoher Verlustleistung. Durch die speziell entwickelte Löttechnik können die Kupfer Basisplatte und Kupferfinnen ohne Wärmeverlust miteinander verbunden werden. Due to the thermal conductivity of copper being practically 2 times better than aluminum the fin efficiencies of the SF heat sinks are much higher than other types. Basically, all requested fin heights are available, butincreasing the heights of the fins without a reasonable T to the ambient temperature serves no useful purpose. Therefore Series SF allows smaller heatsinks or higher power losses with the same size. Durch die 2 mal höhere Wärmeleitfähigkeit des Kupfers gegenüber dem Aluminium ist die Finneneffektivität der SF Serie wesentlich besser als bei herkömmlichen Kühlkörpern. Grundsätzlich kann jede gewünschte Finnenhöhe gefertigt werden. Auf Grund des geringeren Finnenwirkungsgrades haben sich jedoch höhere Finnen als nicht sinnvoll erwiesen. Deshalb können entweder kleinere Kühlkörper oder höhere Verlustleistungen bei gleichem Raum realisiert werden. 8

High Power Soldered Fin Heat Sinks SERIES SF The SF heat sinks are designed for forced air convection. The thermal resistance depends mainly on the air velocity (airspeed) between the fins. Experience has shown that for good heat dissipation an air speed of 3 m/sec. or higher is necessary. Please contact us for details about pressure drop or fan selection. Die Serie SF wurde speziell für forcierte Kühlung entwickelt. Der Wärmewiderstand des Kühlkörpers hängt vor allem von der Luftgeschwindigkeit zwischen den Finnen ab. Die Erfahrung hat gezeigt, dass die Luftgeschwindigkeit mindestens 3 m/sek. betragen sollte. Für Fragen zur Lüfterwahl bzw. bezüglich des Druckabfalles stehen unsere Anwendungstechniker gerne jederzeit zur Verfügung. Below is a comparison that shows the difference between an Aluminium and Copper heat sink with the same dimensions. Nachfolgender Vergleich zeigt Unterschied zwischen Kupfer und Aluminium bei gleichen Abmessungen. Comparison of Thermal Performance Thermischer Vergleich For protection against corrosion, Series SF can be nickel plated. Um Korrosionsproblemen vorzubeugen, kann die Serie SF auch mit Nickelbeschichtung geliefert werden. We also offer computer simulations of the heat sink at the design stage. 9

High Power Pressed Fin Heat Sinks SERIES SERIES PRE/PRD FT 2 PRD PRE Type Height Type Width B Length L max. Heigth H Base D1 Base D2 Nr. of in mm in mm in mm in mm in mm Fins PRE 236-XXX-1 236,5 6 5 27-36 PRE 236-XXX-3 236,5 6 5 17-36 PRD 236-XXX-2 236,5 6 27 17 36 PRD 236-XXX-4 236,5 6 27 27 36 PRD 236-XXX-5 236,5 6 17 17 36 PRE 47-XXX-1 47 6 5 27-72 PRE 47-XXX-3 47 6 5 17-72 PRD 47-XXX-2 47 6 27 17 72 PRD 47-XXX-4 47 6 27 27 72 PRD 47-XXX-5 47 6 17 17 72 Other dimensions on request Andere Abmessungen auf Anfrage Technical Aspects In addition to the Bonded Fin Series BF DAU has developed a new heat sink concept Series PRE/PRD which is build equivalent to BF Series from two major components the base section and the fin section. For Series PRE/PRD the fins will be assembled to the base plate by a special developed and patent pending cold welding process instead of using thermal conductive glue. This assembling process ensures lowest thermal resistance between the base plate and the fins and allows therefore a nearly perfect heat transfer from the base plate to the fins. Technische Erläuterung In Ergänzung zur bestehenden Bonded Fin Serie BF hat die Firma DAU ein komplett neues Fertigungskonzept für ihre Serie PRE/PRD entwickelt. Diese Serie besteht, wie die Serie BF, aus zwei Hauptkomponenten, der Basisund der Finnensektion. Bei der Serie PRE/PRD werden die Finnen gegenüber der Serie BF nicht mit einem hochthermischen Kleber, sondern mittels eines in Patentierung befindlichen Kaltschweißprozesses mit der Basisplatte verbunden. Dieser neuartige Verbindungsprozess reduziert den thermischen Übergangswiderstand auf ein Minimum und erlaubt deshalb einen optimalen Wärmefluss von der Basisplatte zu den Finnen.

High Power Pressed Fin Heat Sinks SERIES PRE/PRD Curve for Modul Size 162 x 122 Rth (K/KW) 36, 34, 32, 3, 28, 26, 24, 22, 6 Pressure drop (Pa) 2, 223 312 1 491 624 714 83 892 Air flow (m3/h) Curve for Modul Size 1 x 13 Rth (K/KW) 38 36 34 32 3 28 26 24 22 6 Pressure drop (Pa) 2 223 312 1 491 624 714 83 892 Air flow (m3/h) Curve for Modul Size 12 x 12 42, 6, 38, Thermal Resistance (R th ): Based on semiconductor module size and airflow, values down to.22k/w per module (measured directly under the module) are possible. Thermische Werte (R th ): Abhängig von der Halbleitermodulgröße und vom Volumenstrom Werte bis,22k/w bezogen auf ein Modul (gemessen direkt unter dem Modul)möglich. Rth (K/KW) 36, 34, 32, 3, 28, 26, 24, 22, 2, 223 312 1 491 624 714 83 892 Air flow (m3/h) Pressure drop (Pa) 11

,,, Medium Power High Fin Density Extrusions SERIES FT 1 B B D D H H Durch spezielle Presstechnik ist es nun möglich Profile mit extrem hoher Finnendichte und gleichzeitiger Oberflächenvergrößerung durch zusätzliche Verrippung der Finne herzustellen. Durch modulare Bauweise mittels Reibrührschweißen können Vielfachbreiten bis zu mm kostengünstig hergestellt werden. Due to a special extrusion technique in our manufacturing process, it is now possible to produce high fin density extrusions with fin serrations to increase fin surface area. Additionally, we can increase the heatsink width up to mm by friction stir welding with minimal cost due to the modular design of this series. Type 1 2 3 4 5 Width B [mm]* 6,5 312 468 624 78 Basepl. 1) thickness D [mm] Fin Height H [mm] 6 6 6 6 6 Number of fins 16 32 48 64 8 Fin Spacing [mm] 9,78 9,78 9,78 9,78 9,78 1) Angegebene Basisplattendicke ist Rohmaß nach Bearbeitung reduziert sich diese noch um,5 bis 1, mm 1) Indicated base plate thickness D is a base dimension after machining this is reduced by,5 to 1 mm *Other dimensions on request Andere Abmessungen auf Anfrage. Thermal Performance for FT1 with width of 22 mm and length of mm and module size of 19 x 1 mm (1 module) Rth [K/kW] 45 2 35 3 25 25 3 Rth [K/kW] 35 45,,,, pressure drop [Pa] 6 2, Rth Dp, 6 Air flow rate [m³/h], Air flow rate [m³/h] Rth Dp,, pressure drop [Pa] 12

,, Medium Power High Fin Density Extrusions SERIES FT 2 B B D D H H Durch spezielle Presstechnik ist es nun möglich Profile mit extrem hoher Finnendichte und gleichzeitiger Oberflächenvergrößerung durch zusätzliche Verrippung der Finne herzustellen. Durch modulare Bauweise mittels Reibrührschweißen können Vielfachbreiten bis zu 35 mm kostengünstig hergestellt werden. Due to a special extrusion technique in our manufacturing process, it is now possible to produce high fin density extrusions with fin serrations to increase fin surface area. Additionally, we can increase the heatsink width up to 35 mm by friction stir welding with minimal cost due to the modular design of this series. 2 25 3 Rth [K/kW] Type 1 2 3 4 5 Width B [mm]* 117 23 345 46 69 Basepl. 1) thickness D [mm] Fin Height H [mm] Number of fins 14 28 42 56 84 Fin Spacing [mm] 8, 8, 8, 8, 8, 1) Angegebene Basisplattendicke ist Rohmaß nach Bearbeitung reduziert sich diese noch um,5 bis 1, mm 1) Indicated base plate thickness D is a base dimension after machining this is reduced by,5 to 1 mm *Other dimensions on request Andere Abmessungen auf Anfrage. 35 Thermal Performance for FT2 with width of 23 mm and length of 36 mm and module size of 19 x 1 mm (2 modules) Rth [K/kW] 6 58 45 55 53 48 45 43 7 6 6 5 4 3 Dp [Pa] 38 2 35 33 1 6 3 28 25 1 2 3 4 air flow rate [m³/h], Rth_1 Rth_2 pressure drop Air flow rate [m³/h] Rth Dp,, pressure drop [Pa] 13,

,,, High Power Pressed Fin Heat Sinks SERIES PRE 72 FS Technische Grundlagen In Ergänzung zur bestehenden Bonded Fin Serie BF hat DAU ein komplett neues patentiertes Fertigungskonzept entwickelt. Zu diesem Zweck werden die Finnen mittels eines speziellen Kaltschweißprozesses mit der Basisplatte verbunden. Technical Aspects In addition to the Bonded Fin Series BF, DAU has developed a complete new patent pending manufacturing process for heat sinks. In this technique, the fins will be assembled by a special cold welding process to the base plate. Type 145 25 235 245 265 565 Width B [mm]* 145 25 235 245 265 565 Basepl. 1) thickness D [mm] 17 17 17 17 17 17 17 Fin Height H [mm] 72 72 72 72 72 72 72 Number of fins 14 2 22 24 26 28 56 Fin Spacing FS [mm] 1) Angegebene Basisplattendicke ist Rohmaß nach Bearbeitung reduziert sich diese noch um,5 bis 1, mm 1) Indicated base plate thickness D is a base dimension after machining this is reduced by,5 to 1 mm *Other dimensions on request Andere Abmessungen auf Anfrage. Rth [K/kW] Thermal Performance for PRE-245 with length of mm and module size of 1 x 13 mm 7 6 2 25 3 Rth [K/kW] 35 45,,,, pressure drop [Pa] 6 3, Rth Dp 2, 6 7 8 Air flow rate [m³/h], Air flow rate [m³/h] Rth Dp,, pressure drop [Pa] 14

Medium Power High Density Extruded Heat Sinks SERIES HK Die Serie HK ersetzt Kühlkörper, die bisher nur mit verpressten Rippen herstellbar waren. Vorteil dieser neuen Technik ist neben der Kostenersparnis auch die bessere mechanische Festigkeit (Rüttelfestigkeit) dieser Kühlkörper. Durch Verschweißen einzelner Grundelemente ist es möglich, Kühlkörper bis 1 mm Breite herzustellen. Als Schweißverfahren kann sowohl MIG Schweißen, als auch das zusatzfreie Reibrührschweißen zur Anwendung kommen. The new Series HK replaces Heat Sinks that up till now could only be produced by pressing technology. Advantages are cost reduction and much higher mechanical strength (vibration resistance) than pressing technology. Technical data for Natural Convection Technische Daten Natürliche Konvektion Type B A Lenghts / Länge (mm) Type Rth (K/W) per Lenghts length Rth Länge (K/W) (mm) pro Länge (mm) mm mm mm mm HK- 13,37,24,19,16 HK- 13,37,24,19,16 HK 21,3,19,,13 HK 21,3,19,,13 HK 29,24,,12,11 HK 29,24,,12,11 HK 37,2,12,96,84 HK 37,2,12,96,84 HK6 6 45,16,,78,68 HK6 6 45,16,,78,68 HK7 7 57,13,8,61,54 HK7 7 57,13,8,61,54 Technical data for Forced Convection 5m/sec Technische Daten forcierte Belüftung 5m/sek Type B A Rth Type (K/W) per Lenghts Lenghts length / Rth Länge Länge (K/W) (mm) (mm) pro Länge (mm) mm mm mm mm HK- 13,1,66,49,41 HK- 13,1,66,49,41 HK 21,82,46,34,29 HK 21,82,46,34,29 HK 29,63,36,25,22 HK 29,63,36,25,22 HK 37,51,28,19,17 HK 37,51,28,19,17 HK6 6 45,42,22,16,14 HK6 6 45,42,22,16,14 HK7 7 57,34,18,13,11 HK7 7 57,34,18,13,11 By welding of several base units it is possible to produce heat sinks up to 1 mm in width. Schweissverbindung Welding Zone Schweissverbindung Welding Zone

High Power Air Cooling Heat Sinks HOCKEY PUCK COOLER SKL The Series SKL is designed specifically for air cooling applications of stacked or individual high power discshaped semiconductors. The thick, columnar fins permit high clamping forces necessary in stacked applications, and the serrated fin features enhance the surface area for optimal cooling performance. Additionally, the fins are attached to the baseplate with a patent pending cold weld process that ensures the lowest thermal interface resistance. Die Serie SKL wurde speziell für die Luftkühlung von Scheibenzellen-Halbleitern entwickelt. Die säulenartig gestalteten Finnen garantieren Stabilität auch bei hoher Spannkraft. Durch die geriffelte Form der Finnen wird eine optimale Kühlung auf kleinstem Raum erreicht. Mittels im Patentstadium befindlicher Presstechnik werden die Finnen mit der Basisplatte optimal und ohne thermischen Übergang verbunden. Dimensions Type B max Pressure (KN) SLK 64 B 45 SKL 116 B 45 SKL 2 B 75 SKL 2 B 5 A H B max mm mm mm 64 45 116 45 2 75 2 5 Surface Finish / Oberflächenbehandlung: D mm,5,5,5,5 Abmessungen Max Clamp Pressure (KN) 8 B = Blank / Blank A = Anodized / Eloxiert N = Nickel Plated / Vernickelt C = Alodine / Chromatiert 16

SKL 64-166-45 Load on one side / einseitig High Power Air Cooling Heat Sinks HOCKEY PUCK COOLER SKL THERMAL INFORMATION SKL 116-166-45 Load on one side / einseitig Rth [K/kW] 28 26 2 22 18 16 1 12 8 2 3 6 Dp V [m³/h] Rth disk 45mm SKL 2-18-75 Load on one side / einseitig 6 Dp [Pa] Rth [K/kW] 18 16 1 12 8 6 2 6 8 12 Dp V [m³/h] Rth disk 75mm SKL 2-18-75 Load on both side / zweiseitig 6 Dp [Pa] Rth[K/kW] 75 7 65 6 55 45 35 Pressure Rth drop Pressure drop D = Rth 78 mm 7 6 pressure drop[pa] Rth [K/kW] 75 7 65 6 55 45 35 Rth Pressure drop D = 78 mm Rth 8 7 6 pressure drop [Pa] 3 1 2 Air flow rate [m³/h] 3 1 2 Air flow rate [m³/h] SKL 2-18-5 Load on one side / einseitig SKL 2-18-5 Load on both side / zweiseitig 7 7 7 65 6 6 45 6 55 35 Rth [k/w] 45 35 3 25 Pressure drop Rth D=78mm Rth D=mm Pressure drop [Pa] Rth[K/kW] 3 25 2 5 Pressure drop drop Rth D=mm Rth D=78mm Pressure Drop [Pa] 2 1 2 3 Air flow rate [m³/h] 1 2 3 Air flow rate [m³/h] 17

High Power Air Cooling Heat Sink HOCKEY PUCK COOLER SKL-SF Special Heat Sink for efficient air cooling of Press Pack Disc Semiconductor like Diode, Thyristor, GTO and IGCT Modules. Material is copper with nickel coating. Other types and dimensions on request. Kühlkörper entwickelt für die effiziente Kühlung von Dioden, Thyristor, GTO und IGCT Modulen in Scheibenzellenausführung (so genannte Press Pack Module). Die Kühlung erfolgt im Stack durch forcierte Belüftung. Material ist Kupfer vernickelt. Andere Ausführungen und Abmessungen auf Anfrage lieferbar. Dimensions Abmessungen Type L Fins SKL-SF-127-17-T1 13,5 3 SKL-SF-127-17-T2 27 6 SKL-SF-127-17-T3,5 9 SKL-SF-127-17-T4 54 12 85, SKL-SF-127-17-T4 8, Rth [K/kW] 8, 75, 7, 65, Rth Rth Pressure pressure drop drop D = mm 7, 6,,,, pressure drop [Pa] 6,, 55,,, 12, 1, 16, 18,, 22, 2, 26, 28, flow rate [m³/h] 18

High Power Air Cooling Heat Sinks CUSTOMIZED AIR SERIES COOLING FT 2 Superior aluminum fabrication technology coupled with advanced equipment and progressive manufacturing techniques offer DAU customers the best conditions for the manufacturing of customized air cooled heat sinks. Various CAD Systems with different programs like Auto CAD and Pro Eng enable DAU to create computer models to verify the manufacturability of the parts before they go on a machine and also enable DAU to exchange drawings easily with the customer. Furthermore CFD Thermal Modelling Systems like Sauna and Flotherm ensure that the thermal performance of the designed heat sinks meet the customer s requirements. Die hervorragende Aluminiumbearbeitungstechnik gepaart mit modernster Maschinen- und Produktionstechnik bietet DAU die besten Voraussetzungen für die Fertigung von kundenspezifischen Kühlkörpern. CAD Systeme mit Programmen wie Pro Eng und Auto CAD ermöglichen eine optimale Planung der Teile bereits vor der Fertigung und vereinfachen auch den direkten Datenaustausch mit den Kunden. Durch den Einsatz von CFD Simulationsprogrammen wie Sauna und Flotherm lassen sich die thermischen Eigenschaften der Kühlkörper präzise bestimmen und den Kundenwünschen anpassen. CNC Machining CFD Simulation Friction Stir Welding CNC Bearbeitung CFD Berechnung Reibrührschweißen 19

Profiles SERIES DAU has established a comprehensive selection of extruded heat sink profiles with well-known extrusion manufacturing companies. Page 38 and 39 show only part of the existing range of DAU profiles. Please send a drawing of your profile request and DAU will inform you immediately if the profile is established or not. If no tool is available DAU will offer production of the tool at a reasonable price. Please note: DAU does not stock extrusion profiles due to the extensive range of profile requirements produced. Profiles production is always upon customer request within appropriate delivery time. All profiles are machined on modern CNC machines according to your specific drawing. 2

Profiles SERIES DAU hat bei namhaften Profilherstellern eine Vielzahl an Profilwerkzeugen eingerichtet. Seite 38 und 39 zeigen nur einen Teil der verfügbaren Profilausführungen, die ohne Werkzeugkosten geliefert werden können. Übermitteln Sie deshalb Ihre Profilzeichnung und DAU prüft umgehend, ob das von Ihnen benötigte Profil bereits eingerichtet ist. Sollte kein Werkzeug vorhanden sein, so wird Ihnen ein kostengünstiges Angebot für eine Werkzeugfertigung erstellt. DAU übernimmt auch die Entwicklung Ihrer kundenspezifischen Profilausrüstung. Bitte beachten Sie, dass DAU durch die unterschiedlichen Bearbeitungsausführungen üblicherweise keine Profile ab Lager liefert sie werden immer auftragsbezogen ge-fertigt. Durch spezielle Vereinbarungen mit den Profilherstellern ist jedoch trotzdem eine kurze Lieferzeit gesichert. Die Bearbeitung der beauftragten Profile erfolgt bei DAU auf modernen CNC Bearbeitungszentren nach Ihrer Zeichnung. 21

Other Products from DAU Mechnical Components Heat Pipes and Heat Pipe System Heat Exchanger Customer Designed Bus Bars Bonded Fin Heatsinks Liquid Cooled Cold Plates Bonded Hydrid Heatsinks Copper Finned Heatsinks Extruded Heatsinks Value Added Assemblies Heat Pipes Heat Pipe Heat Exchangers Liquid Cold Plates Bonded Fin Heatsinks Bonded Hybrid Copper Finned Heatsinks REPRESENTATIVE Thermal Solutions North America 1657 East Park Drive Macedon, NY 142 P 585-678-925 F 585-678-27 www.dauusa.com