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GaAlAs-IR-Lumineszenzdioden (88 nm) GaAlAs Infrared Emitters (88 nm) Lead (Pb) Free Product - RoHS Compliant SFH 484 SFH 485 SFH 484 SFH 485 Wesentliche Merkmale GaAlAs-LED mit sehr hohem Wirkungsgrad Hohe Zuverlässigkeit Gute spektrale Anpassung an Si-Fotoempfänger Gegurtet lieferbar (im Ammo-Pack) Gruppiert lieferbar SFH 484: Gehäusegleich mit LD 274 SFH 485: Gehäusegleich mit SFH 3, SFH 23 Anwendungen IR-Fernsteuerung von Fernseh- und Rundfunkgeräten, Videorecordern, Lichtdimmern Gerätefernsteuerungen für Gleich- und Wechsellichtbetrieb Rauchmelder (UL-Freigabe) Sensorik Diskrete Lichtschranken Features Very highly efficient GaAlAs-LED High reliability Spectral match with silicon photodetectors Available on tape and reel (in Ammopack) Available in bins SFH 484: Same package as LD 274 SFH 485: Same package as SFH 3, SFH 23 Applications IR remote control of hi-fi and TV-sets, video tape recorders, dimmers Remote control for steady and varying intensity Smoke detectors (UL-approval) Sensor technology Discrete interrupters Typ Type Bestellnummer Ordering Code Gehäuse Package SFH 484 Q6273Q92 5-mm-LED-Gehäuse (T 1 3 / 4 ), klares violettes SFH 484-2 Q6273Q1756 Epoxy-Gießharz, Anschlüsse im 2.54-mm-Raster ( 1 / ), Anodenkennzeichung: kürzerer Anschluß SFH 485 Q6273Q93 5 mm LED package (T 1 3 / 4 ), violet-colored epoxy resin, SFH 485-2 Q6273Q1547 solder tabs lead spacing 2.54 mm ( 1 / ), anode marking: short lead 24-12-2 1

Grenzwerte (T A = 25 C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Durchlaßstrom Forward current Stoßstrom, t p = µs, D = Surge current Verlustleistung Power dissipation Wärmewiderstand, freie Beinchenlänge max. mm Thermal resistance, lead length between package bottom and PC-board max. mm Wert Value T op ; T stg 4 + C V R 5 V I F ma I FSM 2.5 A Einheit Unit P tot 2 mw R thja 375 K/W 24-12-2 2

Kennwerte (T A = 25 C) Characteristics Bezeichnung Parameter Wellenlänge der Strahlung Wavelength at peak emission I F = ma Spektrale Bandbreite bei 5% von I rel Spectral bandwidth at 5% of I rel I F = ma Abstrahlwinkel Half angle SFH 484 SFH 485 Aktive Chipfläche Active chip area Abmessungen der aktiven Chipfläche Dimension of the active chip area Abstand Chipoberfläche bis Linsenscheitel Distance chip front to lens top SFH 484 SFH 485 Schaltzeiten, I e von % auf 9% und von 9% auf %, bei I F = ma, R L = 5 Ω Switching times, Ι e from % to 9% and from 9% to %, I F = ma, R L = 5 Ω Kapazität Capacitance V R = V, f = 1 MHz Durchlaßspannung Forward voltage I F = ma, t p = 2 ms I F = 1 A, t p = µs Sperrstrom, Reverse current V R = 5 V Gesamtstrahlungsfluß, Total radiant flux I F = ma, t p = 2 ms Wert Value λ peak 88 nm λ 8 nm ϕ ϕ ± 8 ± 2 Einheit Unit Grad deg. A.9 mm 2 L B L W H H.3.3 mm 5.1 5.7 4.2 4.8 mm mm t r, t f.6/.5 µs C o 15 pf V F 1.5 ( 1.8) V F 3. ( 3.8) V V I R.1 ( 1) µa Φ e 25 mw 24-12-2 3

Kennwerte (T A = 25 C) Characteristics (cont d) Bezeichnung Parameter Temperaturkoeffizient von I e bzw. Φ e, I F = ma Temperature coefficient of I e or Φ e, I F = ma Temperaturkoeffizient von V F, I F = ma Temperature coefficient of V F, I F = ma Temperaturkoeffizient von λ, I F = ma Temperature coefficient of λ, I F = ma Wert Value Einheit Unit TC I.5 %/K TC V 2 mv/k TC λ.25 nm/k Gruppierung der Strahlstärke I e in Achsrichtung gemessen bei einem Raumwinkel Ω =.1 sr bei SFH 484 bzw. Ω =.1 sr bei SFH 485 Grouping of Radiant Intensity I e in Axial Direction at a solid angle of Ω =.1 sr at SFH 484 or Ω =.1 sr at SFH 485 Bezeichnung Parameter Strahlstärke Radiant intensity I F = ma, t p = 2 ms I e min I e max SFH 484 5 - SFH 484-1 5 Wert Value SFH 484-2 8 - SFH 485 25 16 SFH 485-2 25 Einheit Unit mw/sr mw/sr Strahlstärke Radiant intensity I F = 1 A, t p = µs I e typ. 8 7 9 3 34 mw/sr 24-12-2 4

Radiation Characteristics, SFH 484 Ι rel = f (ϕ) 4 3 2 5 ϕ 1..8 OHR1891 6.6 7.4 8.2 9 1..8.6.4 2 4 6 8 12 Radiation Characteristics SFH 485 Ι rel = f (ϕ) 4 3 2 5 ϕ 1..8 OHR1892 6.6 7.4 8.2 9 1..8.6.4 2 4 6 8 12 24-12-2 5

Relative Spectral Emission I rel = f (λ) Ι rel % 8 OHR877 Radiant Intensity Single pulse, t p = 2 µs 2 Ι e Ι e (ma) 1 I e I e ma = f (I F ) OHR878 Max. Permissible Forward Current I F = f (T A ) Ι F 125 ma OHR88 6 75 4-1 5 2-2 25 75 8 85 9 95 nm λ Forward Current I F = f (V F ), single pulse, t p = 2 µs 1 A Ι F -1-2 OHR881-3 1 2 3 4 5 6 V 8 V F -3 1 2 3 ma 4 Ι F Permissible Pulse Handling Capability I F = f (τ), T A = 25 C, duty cycle D = parameter Ι F 4 ma 3 2.1.2.5 DC D =.5.1.2.5 t p D = T t p OHR886 T 1-5 -4-3 -2-1 1 s 2 t p Ι F 2 4 6 8 C T Forward Current vs. Lead Length between the Package Bottom and the PC-Board I F = f (l), T A = 25 C Ι F 12 ma 8 6 4 2 OHR949 5 15 2 25 mm 3 24-12-2 6

Maßzeichnung Package Outlines SFH 484 9. (.354).6 (.24).4 (.16) 2.54 (.) spacing 8.2 (.323) Area not flat.8 (.31).5 (.2) 7.8 (.37) 7.5 (.295) ø5.1 (.21) ø4.8 (.189) Cathode 5.9 (.232) 5.5 (.217) 1.8 (.71) 1.2 (.47) 29 (1.142) 27 (1.63) 5.7 (.224) 5.1 (.21) Chip position.6 (.24).4 (.16) GEXY6271 SFH 485 9. (.354).6 (.24).4 (.16) 2.54 (.) spacing 8.2 (.323) Area not flat.8 (.31).5 (.2) 7.8 (.37) 7.5 (.295) ø5.1 (.21) ø4.8 (.189) Cathode 5.9 (.232) 5.5 (.217) 1.5 (.59) 29 (1.142) 27 (1.63) 4.8 (.189) 4.2 (.165) Chip position.6 (.24).4 (.16) GEXY635 Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). 24-12-2 7

Empfohlenes Lötpaddesign Recommended Solder Pad Wellenlöten (TTW) TTW Soldering 4.8 (.189) 4 (.157) OHLPY985 Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). 24-12-2 8

Lötbedingungen Soldering Conditions Wellenlöten (TTW) (nach CECC 82) TTW Soldering (acc. to CECC 82) T 3 C 25 2 235 C... 26 C 1. Welle 1. wave s 2. Welle 2. wave Normalkurve standard curve Grenzkurven limit curves OHLY598 15 ca 2 K/s 5 K/s 2 K/s C... 13 C 5 2 K/s Zwangskühlung forced cooling 5 15 2 s 25 t Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-9349 Regensburg www.osram-os.com All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 24-12-2 9