IR-Lumineszenzdiode (94 nm) mit hoher Ausgangsleistung High Power Infrared Emitter (94 nm) Lead (Pb) Free Product - RoHS Compliant SFH 446 Wesentliche Merkmale Infrarot LED mit hoher Ausgangsleistung Kurze Schaltzeiten Anwendungen Infrarotbeleuchtung für Kameras Sensorik Datenübertragung Sicherheitshinweise Je nach Betriebsart emittieren diese Bauteile hochkonzentrierte, nicht sichtbare Infrarot- Strahlung, die gefährlich für das menschliche Auge sein kann. Produkte, die diese Bauteile enthalten, müssen gemäß den Sicherheitsrichtlinien der IEC-Normen 682- und 6247 behandelt werden. Features High Power Infrared LED Short switching times Applications Infrared Illumination for cameras Sensor technology Data transmission Safety Advices Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 682- and IEC 6247. yp ype Bestellnummer Ordering Code SFH 446 Q6A896 63 (typ. 3) Strahlstärkegruppierung ) (I F = ma, t p = 2 ms) Radiant Intensity Grouping ) I e (mw/sr) ) gemessen bei einem Raumwinkel =. sr / measured at a solid angle of =. sr 22-2-3
SFH 446 Grenzwerte ( A = 2 C) Maximum Ratings Bezeichnung Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Vorwärtsgleichstrom Forward current Stoßstrom, t p s, D = Surge current Verlustleistung Power dissipation Wärmewiderstand Sperrschicht - Umgebung bei Montage auf FR4 Platine, Padgröße je 6 mm 2 hermal resistance junction - ambient mounted on PC-board (FR4), padsize 6 mm 2 each Kennwerte ( A = 2 C) Characteristics Bezeichnung Wellenlänge der Strahlung Wavelength at peak emission I F = ma Schwerpunkt-Wellenlänge der Strahlung Centroid wavelength I F = ma Spektrale Bandbreite bei % von I max Spectral bandwidth at % of I max I F = ma Abstrahlwinkel Half angle Aktive Chipfläche Active chip area Abmessungen der aktiven Chipfläche Dimension of the active chip area Wert Value op, stg 4 + C V R V I F ma I FSM A Einheit P tot 8 mw R thja 4 Wert Value K/W peak 9 nm centroid 94 nm 42 nm Einheit 2 Grad deg. A.9 mm 2 L B L W.3.3 mm² 22-2-3 2
SFH 446 Kennwerte ( A = 2 C) Characteristics (cont d) Bezeichnung Schaltzeiten, I e von % auf 9% und von 9% auf %, bei I F = ma, R L = Switching times, e from % to 9% and from 9% to %, I F = ma, R L = Durchlassspannung Forward voltage I F = ma, t p = 2 ms I F = A, t p = µs Sperrstrom Reverse current Gesamtstrahlungsfluss otal radiant flux I F = ma, t p = 2 ms emperaturkoeffizient von I e bzw. e, I F = ma emperature coefficient of I e or e, I F = ma emperaturkoeffizient von V F, I F = ma emperature coefficient of V F, I F = ma emperaturkoeffizient von, I F = ma emperature coefficient of, I F = ma t r, t f 2 ns V F V F I R Wert Value. (.8) 2.4 (< 3.) not designed for reverse operation Einheit V V A e typ mw C I. %/K C V 3 mv/k C +.3 nm/k 22-2-3 3
SFH 446 Strahlstärke I e in Achsrichtung ) gemessen bei einem Raumwinkel =. sr Radiant Intensity I e in Axial Direction at a solid angle of =. sr Bezeichnung Strahlstärke Radiant intensity I F = ma, t p = 2 ms Strahlstärke Radiant intensity I F = A, t p = 2 s I e min I e max SFH 446 -V 63 2 Werte Values SFH 446 -AW 2 SFH 446 -BW 6 32 Einheit mw/sr mw/sr I e typ 66 6 mw/sr ) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:) / Only one bin in one packing unit (variation lower 2:) Abstrahlcharakteristik Radiation Characteristics I rel = f () 4 3 2 ϕ. OHL392.8 6.6 7.4 8.2 9..8.6.4 2 4 6 8 2 22-2-3 4
SFH 446 Relative Spectral Emission I rel = f () I rel % 8 6 4 OHF434 Radiant Intensity I e ma = f (I F ) Single pulse, t p = 2 s I e e ( ma) I - I e OHF382 Max. Permissible Forward Current I F = f ( A ), R thja = 4 K/W Ι F 2 ma 7 OHR88 2-2 2 8 8 9 9 nm 2 λ Forward Current I F = f (V F ) Single pulse, t p = s I F A - -2-3 OHF3822-3 2 3 ma I F Permissible Pulse Handling Capability I F = f (), A = 2 C, duty cycle D = parameter OHF438.2 t P A I t F D P = IF..8.6.4.2 D =...2.33...2. 2 4 6 8 C Permissible Pulse Handling Capability I F = f (), A = 8 C, duty cycle D = parameter OHF84.9 t A P I t F D P = I.8 F.7.6..4.3.2. D =...2...2. -4.. 2 V 2. V F - -4-3 -2 - t p s 2 - -4-3 -2 - t p s 2 22-2-3
SFH 446 Maßzeichnung Package Outlines Maße in mm (inch) / Dimensions in mm (inch). Empfohlenes Lötpaddesign Recommended Solder Pad Design Wellenlöten W W Soldering Anode 4.8 (.89) 4 (.7) OHLPY98 Maße in mm (inch) / Dimensions in mm (inch). 22-2-3 6
SFH 446 Lötbedingungen Soldering Conditions Wellenlöten (W) W Soldering 3 C 2 2 23 C - 26 C First wave Preheating 3 C 2 C C s max., max. contact time s per wave Δ < K Second wave ypical (nach IEC 676-) (acc. to IEC 676-) OHA464 Continuous line: typical process Dotted line: process limits Cooling ca. 3. K/s typical ca. 2 K/s ca. K/s 2 4 6 8 2 4 6 8 2 22 s 24 t Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93 Regensburg www.osram-os.com All Rights Reserved. he information describes the type of component and shall not be considered as assured characteristics. erms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components, may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 22-2-3 7