Infrarot-LED Infrared-LED SFH 4281

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Jakob Egger
vor 7 Jahren
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Infrarot-LED Infrared-LED SFH 4281 Wesentliche Merkmale Emissionswellenlänge 88nm Homogene Abstrahlcharakteristik IR Reflow und TTW Löten geeignet Feuchte-Empfindlichkeitsstufe 2 nach JEDEC Standard

1 Infrarot-LED Infrared-LED SFH 4281 Wesentliche Merkmale Emissionswellenlänge 88nm Homogene Abstrahlcharakteristik IR Reflow und TTW Löten geeignet Feuchte-Empfindlichkeitsstufe 2 nach JEDEC Standard J-STD-2A Anwendungen Miniaturlichtschranken für Gleich- und Wechsellichtbetrieb Industrieelektronik Messen/Steuern/Regeln Automobiltechnik Sensorik Alarm- und Sicherungssysteme IR-Freiraumübertragung Features Typical peak wavelength 88nm Homogeneous Radiation Pattern Suitable for IR reflow and TTW soldering Moisture Sensitivity Level 2 according to JEDEC Standard J-STD-2A Applications Miniature photointerrupters Industrial electronics For drive and control circuits Automotive technology Sensor technology Alarm and safety equipment IR free air transmission Typ Type Bestellnummer Ordering Code Strahlstärkegruppierung 1) (I F = ma, t p = 2 ms) Radiant intensity grouping 1), I e (mw/sr) -P -Q SFH 4281 Q6272P ) gemessen bei einem Raumwinkel Ω =.1 sr / measured at a solid angle of Ω =.1 sr

2 Grenzwerte (T A = 25 C) Maximum Ratings Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Durchlaßstrom Forward current Stoßstrom, τ = µs, D = Surge current Verlustleistung Power dissipation Wärmewiderstand Sperrschicht - Umgebung bei Montage auf FR4 Platine, Padgröße je 16 mm 2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm 2 each Wärmewiderstand Sperrschicht - Lötstelle bei Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block Wert Value T op ; T stg 4 + C V R 5 V I F ma I FSM 2.5 A P tot 18 mw R thja R thjc 45 2 K/W K/W Kennwerte (T A = 25 C) Characteristics Wellenlänge der Strahlung Wavelength at peak emission I F = ma, t p = 2 ms Spektrale Bandbreite bei 5% von I max Spectral bandwidth at 5% of I max I F = ma Abstrahlwinkel Half angle Aktive Chipfläche Active chip area Abmessungen der aktiven Chipfläche Dimension of the active chip area Wert Value λ peak 88 nm λ 8 nm ϕ ± 6 Grad deg. A.9 mm 2 L B L W.3.3 mm

3 Kennwerte (T A = 25 C) Characteristics (cont d) Schaltzeiten, I e von % auf 9% und von 9% auf %, bei I F = ma, R L = 5 Ω Switching times, Ι e from % to 9% and from 9% to %, I F = ma, R L = 5 Ω Kapazität, Capacitance V R = V, f = 1 MHz Durchlaßspannung, Forward voltage I F = ma, t p = 2 ms I F = 1 A, t p = µs Sperrstrom, Reverse current V R = 5 V Gesamtstrahlungsfluß, Total radiant flux I F = ma, t p = 2 ms Temperaturkoeffizient von I e bzw. Φ e, I F = ma Temperature coefficient of I e or Φ e, I F = ma Temperaturkoeffizient von V F, I F = ma Temperature coefficient of V F, I F = ma Temperaturkoeffizient von λ, I F = ma Temperature coefficient of λ, I F = ma Wert Value t r, t f.5 µs C o 15 pf V F V F 1.5 ( 1.8) 3. ( 3.8) V V I R.1 ( 1) µa Φ e 23 mw TC I.5 %/K TC V 2 mv/k TC λ +.25 nm/k

4 Strahlstärke I e in Achsrichtung gemessen bei einem Raumwinkel Ω =.1 sr Radiant Intensity I e in Axial Direction at a solid angle of Ω =.1 sr Strahlstärke Radiant intensity I F = ma, t p = 2 ms I e min I e max 4 8 Werte Values -P -Q mw/sr mw/sr Strahlstärke Radiant intensity I F = 1 A, t p = µs I e typ. 5 6 mw/sr

5 Relative Spectral Emission I rel = f (λ) Ι rel % 8 OHR877 Ι Radiant Intensity e Ι e ma = f (I F ) Single pulse, t p = 2 µs 2 Ι e Ι e (ma) 1 OHR878 Max. Permissible Forward Current I F = f (T A ) 12 ma OHR R thja = 45 K/W nm λ Forward Current I F = f (V F ), single pulse, t p = 2 µs 1 A OHR ma 4 Permissible Pulse Handling Capability I F = f (t p ), T A = 25 C duty cycle D = 4 ma D = OHR C 12 T A V 8 V F Radiation Characteristics S rel = f (ϕ) OHL166 ϕ 1. 2 DC t p D = T t p T s 2 t p

6 Maßzeichnung Package Outlines 3.4 (.134) 3. (.118) 3. (.118) 2.6 (.2) 2.3 (.91) 2.1 (.83) (2.4 (.94)).3 (.12) max 2.1 (.83) 1.7 (.67) 1. (.39).9 (.35).3 (.12) min 5.4 (.213) 5. (.197) 4 ±1...1 (.4) Cathode marking.6 (.24).4 (.16) GPLY6899 Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch)

7 Löthinweise Soldering Conditions Bauform Types Tauch-, Schwall- und Schlepplötung Dip, Wave and Drag Soldering Reflowlötung Reflow Soldering Maximal zulässige Lötzeit Abstand Lötstelle Gehäuse Lötbadtemperatur Lötzonentemperatur Maximale Durchlaufzeit Temperature of the Soldering Bath Max. Perm. Soldering Time Distance between Solder Joint and Case Temperature of Soldering Zone Max. Transit Time TOPLED RG 26 C s 245 C s Zusätzliche Informationen über allgemeine Lötbedingungen erhalten Sie auf Anfrage. For additional information on general soldering conditions please contact us. Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-9349 Regensburg All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1, may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered

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