Verarbeitungshinweise Handling Instructions. FIXPITCH - / FREEPITCH Sensoren FIXPITCH - / FREEPITCH Sensors. Gehäuse LGA6x Package LGA6x

Transkript

1 FIXPITCH - / FREEPITCH Sensoren FIXPITCH - / FREEPITCH Sensors Gehäuse LGA6x Package LGA6x

2 Gehäuse LGA6x package LGA6x 1. Anlieferform 1. Packaging Die Sensoren werden in vacuumverpackter, ESD-konformer Verpackung angeliefert. Die Serienlieferform ist Tape & Reel und die Verpackunsgeinheit (VPE) beträgt 2500 Stück pro Rolle. The sensors are delivered in vacuum sealed, ESD-conformed dry bag. The series delivery form is tape & reel with a packaging unit (PU) of 2500 parts per reel. 2. Lagerbedingungen 2. Storage Die Sensoren können zeitlich unbegrenzt bei -20 C bis +80 C gelagert werden. The sensors can be stored without time limit in a temperature range of -20 C to +80 C. Die Sensoren sind gemäß MSL2. Geöffnete Verpackungen können nach JEDEC Standard J-STD-020 bis zu einem Jahr (30 C / 60% RH) gelagert werden. The sensors are according to MSL2. Opened dry bag shall be assembled according JEDEC standard J-STD-020 within one year (30 C / 60% RH). Nach der zulässigen Lagerdauer sind die Sensoren vor der Weiterverarbeitung nach folgender Tabelle zu behandeln, um Schäden durch den Lötprozess vorzubeugen. After the allowed storage time, the sensors shall be preconditioned before processing to prevent damage of the sensor during soldering process. View table below for details. Tab. 1: Vorkonditionierung der Komponenten nach der zulässigen Lagerdauer. Tab. 1: Preconditioning of the components after the allowable storage time. Excerpt of IPC/JEDEC J-STD-033 Bake Conditions for Drying Mounted or Unmounted SMD Package (User Bake: Floor life begins counting at time = 0 after bake) Package Body MSL 125 C 90 C 5% RH 40 C 5% RH Time > 72 h Time 72 h Time > 72 h Time 72 h Time > 72 h Time 72 h Thickness > 1.4 mm 2.0 mm 2 18 hours 15 hours 63 hours 2 days 25 days 20 days Seite Page 2/7

3 Gehäuse LGA6x package LGA6x 3. Verarbeitungsbedingungen 3. Handling and mounting 3.1 Allgemeine Hinweise 3.1 General advice Es handelt sich um ESD-empfindliche Bauteile. Die allgemeinen ESD-Sicherheitsmaßnahmen sind einzuhalten. The sensors are ESD sensitive. General ESD-precautions need to be observed. Bei der Verwendung von Sensoren aus bereits geöffneter Vacuumverpackung sind die Hinweise von Kapitel 2. Lagerbedingen zu beachten und wenn nötig eine thermische Vorkonditionierung der Sensoren vorzunehmen (siehe Tabelle 1). When using sensors from already open vacuum packaging, you have to note the instructions of chapter 2. Storage. If necessary a thermal preconditioning of the sensors needs be done (see tab. 1). Die Empfehlungen für Padgeometrie und Lotpaste sind vor dem Einsatz auf der verwendeten Maschine zu überprüfen. The recommendations for the PCB layout and the solder paste should be checked prior to use on the machine. DIE NICHTBEACHTUNG EINES ODER MEHRERER DER ANGEGEBENEN HINWEISE KANN ZUM VERLUST DER GEWÄHRLEISTUNG FÜHREN. EINE HAFTUNG VON SENSITEC GMBH FÜR DIE HIERAUS ENTSTEHENDEN FOLGEN IST EBENFALLS AUSGESCHLOSSEN. PLEASE NOTE THAT NONCOMPLIANCE WITH ONE OR MORE OF THE ADVICES MAY RESULT IN THE LOSS WARRANTY. SENSITEC GMBH SHALL BE IN NO CASE BE LIABLE FOR THE CONSEQUENCES THEREOF. Seite Page 3/7

4 Gehäuse LGA6x package LGA6x 3.2 Layoutempfehlung 3.2 Layout recommendation 2x0,24 Abstand 80 µm Distance 80 µm 2x0,36 6x0,36 6x0,24 Kupfer / Copper Lötstopp / Solder resist Bild 1: Padgeometrie LGA6S Fig. 1: Pad geometry LGA6S 4x0,24 4x0,36 Abstand 80 µm Distance 80 µm 6x0,24 6x0,36 Kupfer / Copper Lötstopp / Solder resist Bild 2: Padgeometrie LGA6L Fig. 2: Pad geometry LGA6L Lötschablone Solder mask Lötstopplack Solder resist Padöffnung (Pad 7-10): Padöffnung (Pad 1-6): 0,36 x 0,24 mm 0,24 x 0,36 mm Padöffnung (Pad 7-10): Padöffnung (Pad 1-6): 0,36 x 0,24 mm 2,64 x 0,68 mm Pad opening (pad 7-10): 0.36 x 0.24 mm Pad opening (pad 1-6): 0.24 x 0.36 mm Pad opening (pad 7-10): 0.36 x 0.24 mm Pad opening (pad 1-6): 2.64 x 0.68 mm Seite Page 4/7

5 Gehäuse LGA6x package LGA6x 3.3 Löthinweise 3.3 Reflow information Die Lötschablone sollte eine Stärke von 125 µm haben. Aufgrund der Schablonenstärke ist eine Lotpaste mit der Korngröße Typ 5 (z.b. Heraeus SAC F645 Serie / #305) vorzuziehen, um eine homogenere Füllung des Lötdepots zu gewährleisten. Es sollten die allgemeinen Herstellerhinweise der Lotpaste berücksichtig werden. The solder mask should have a thickness of 125 microns. Due to the thickness of the solder mask a paste with grain size of type 5 (e.g. Heraeus SAC F645 series / #305) should be preferred to ensure a more homogeneous filling of the solder deposits. The official manufacturer instructions for the solder paste should be considered. Lead-Free Reflow-Profile Recommendation (e.g. with SAC F645 / #305) Temperature [ C] peak: C Temperatur Temperature Zeit Time C sec C sec. To reach peak sec. > 217 C sec. Time [s] Bild 3: Lötprofil Fig. 3: Reflow profile Seite Page 5/7

6 Gehäuse LGA6x package LGA6x Disclaimer Sensitec GmbH reserves the right to make changes, without notice, in the products, including software, described or contained herein in order to improve design and/or performance. Information in this document is believed to be accurate and reliable. However, Sensitec GmbH does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Sensitec GmbH takes no responsibility for the content in this document if provided by an information source outside of Sensitec products. In no event shall Sensitec GmbH be liable for any indirect, incidental, punitive, special or consequential damages (including but not limited to lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) irrespective the legal base the claims are based on, including but not limited to tort (including negligence), warranty, breach of contract, equity or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, Sensitec product aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the General Terms and Conditions of Sale of Sensitec GmbH. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Unless otherwise agreed upon in an individual agreement Sensitec products sold are subject to the General Terms and Conditions of Sales as published at. Application information Applications that are described herein for any of these products are for illustrative purposes only. Sensitec GmbH makes no representation or warranty whether expressed or implied that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using Sensitec products, and Sensitec GmbH accepts no liability for any assistance with applications or customer product design. It is customer s sole responsibility to determine whether the Sensitec product is suitable and fit for the customer s applications and products planned, as well as for the planned application and use of customer s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Sensitec GmbH does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer s applications or products, or the application or use by customer s third party customer(s). Customer is responsible for doing all necessary testing for the customer s applications and products using Sensitec products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer(s). Sensitec does not accept any liability in this respect. Life critical applications These products are not qualified for use in life support appliances, aeronautical applications or devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Seite Page 6/7

7 Sensor solutions for length, angle, position, current and magnetic field - robust, accurate, dynamic. Copyright 2014 by Sensitec GmbH, Germany All rights reserved. No part of this document may be copied or reproduced in any form or by any means without the prior written agreement of the copyright owner. The information in this document is subject to change without notice. Please observe that typical values cannot be guaranteed. Sensitec GmbH does not assume any liability for any consequence of its use. Sensitec GmbH Georg-Ohm-Str Lahnau Germany Tel Fax sensitec@sensitec.com