Packaging for Systemintegration

Transkript

1 Packaging for Systemintegration Prof. Dr.-Ing. habil. Klaus-Jürgen Wolter

2 Electronics Packaging Procedures, processes and technologies to assemble electronic components and microtechnical modules Holistic approach Folie 2

3 Fields of activity of the Electronics Packaging Lab Bio-compatible electronics packaging PD Dr. Jürgen Uhlemann Thick-film technology Dr. Marco Luniak Photonic Packaging Dr. Ralf Rieske Wire bonding and Flip Chip technology Prof. Dr. Thomas Zerna Adhesive technology Dr. Angelika Paproth Assembly technologies Prof. Dr. Thomas Zerna Non-destructive inspection Dr. Martin Oppermann Board Level Reliability Dr. Mike Röllig Quality assurance in electronics Dr. Heinz Wohlrabe Process technology PD Dr. Gerald Weigert Young Scientists Group High Reliable 3D-Microsystems DI Karsten Meier Folie 3

4 System Integration Source: ITRS Roadmap Folie 4

5 Status of System in Package Source:Röllig et.al. Folie 5

6 3D-Integration, Stacked Packages Source: ITRS 2006 Folie 6

7 Quelle: TechSearch International stacked die memory with spacer 3D-Integration 3D-Integration Folie 7

8 3D-IC-Integration Folie 8 Source: Lau; ECTC 2010

9 Si-TSV-Technologies Via first Via Middle Via Last Source: ITRS Roadmap 2009 Folie 9

10 SLID Motivation & Concept Cu-Sn phase diagram SLID thermostable joints (IMCs) Cu-Sn Au-Sn Cu-SnAg enables multistacking of chips small joints (<10µm) low bond loads relatively simple processing low-lost technology 1. before bonding 3. after bonding SLID contact Folie 10

11 SLID Cu 6 Sn 5, Cu 3 Sn Cu 6 Sn 5, Cu 3 Sn Cu Cu Cu Sn Cu voids - Sn electroplating; - SLID process parameter optimization; - SLID microstructure & reliability characterization. Electroplated Sn Hull cell for Sn electroplating Folie 11

12 Self-Alignment self-alignment for electronics packaging: well-known phenomenon of SMT: self-alignment by liquid solder Reflow various research on self-alignment in the past: by liquid: magnetic: electrostatic: surface tension Capillary action S.B. Shetye et al., University of Florida J. Dalin, J. Wilde Universität Freiburg basic principle: force on the component in the direction of the minimisation of free energy Folie 12

13 ACANWF Technology ACANWF = Anisotropically Conductive Adhesive NanoWire Film: structured NW-arrays with NWs cm - ² molded in a polymer matrix with adhesive properties anisotrope conductive and adhesive film for assembly of semiconductor components metallic NWs polymer matrix TSV (Cu) passivation layer (SiO 2, TaN, ) Si SiO 2 adhesion promoter (mono layer) Chip level ACANWF advantages: electr. bonded NW: electrical interconnection heat transfer (thermal management) pitch >= 100 nm; diameter >= 40 nm (pro NW) film enables easy handling processes and adjustable thickness & NWresolution Folie 13

14 template-based plating process of Ag-nanowires (cooperation YRG+IFW Dresden): Nanowires cross section: l = ~4 µm Top view: template reveals well organized array of pores p = 100 nm, d = ~50 nm Folie 14

15 FEA of TSV structures Through Silicon Vias (TSV s) as a Key Technology in 3D Integration: enable connection through multiple die-/functional-levels application fields of finite element analysis: detect critical locations in TSV/die structure calculate and estimate appearing loads evaluation of crack risk evaluation of delamination appearance references on die layout/design to minimize loads von-mises stress distribution on a TSV-Cluster heated up to 150 C Folie 15

16 LIT - Electronic assemblies contain electrical conductive parts inductive heating sources - Amplitude modulated high power el.-mag. field modulated heat sources - Thermal diffusion wave gets attenuated & delayed - Evaluation: Fourier transformation of T surface (t) at f lock-in Folie 16

17 Application of 3D-IC-Integration Folie 17 Source: ITRS Roadmap 2009

18 Hetero System Integration Folie 18

19 Heteo-System-Integration Folie 19

20 Application of Hetero-System-Integration Mechanische Energie (J) Piezoelektrischer Energiewandler Auswertung Applikation Modul-AVT Energiespeicher Power Management Timing Funknetzwerk Protokoll-Software SoC HF Antenne Signal- Wandlung Mikro- Rechner Funk-Interface HF- Baugruppe US-Sensoren / Aktoren (MEMS) Prüfalgorithmen Datenspeicher WL-AVT [Hentschel, IzfP-D] Folie 20

21 Microfluidic Systems Components for microfluidic systems and sensors Ceramic-MEMS (MCMs, Sensor elements, hybrid modules) Embedded structures in ceramic substrates for special applications (fluidic) Cross section of a multilayer LTCC with embedded micro-channel Principle of a LTCC based micro fluid system Challenge for future substrates: Application of pastes with line width below 40µm Fine line printing of conducting lines Folie 21

22 Sensor Systems Ultrasonic Phased Array Sensor Head Housing Molding Koaxialkabel flexible Substrate Damping Sensor Adaption layer Phased Array Matrix, each column 50 x 50 µm Goals: Development of High Frequency Phased Array Sensor Heads (up to 50 MHz) Development of an alternative coupling concept for fast inline inspection in electronics production Folie 22

23 Sensor Systems Direct converting detector Aperture X-Ray Detector Protected electronics Absorber Folie 23

24 Photonic Packaging Coupling concepts: Direct coupling (without optics for redirection and collimation but precise mechanical alignment) Indirect coupling (redirection, often focusing elements) optical transmitter (VCSEL)/ optical receiver (PD) optical transmitter (VCSEL)/ optical receiver (PD) electrical layer electrical layer cladding cladding PCB integrated waveguide core core cladding PCB integrated waveguide cladding 45 reflective mirror Schematic diagram of coupling strategies, direct butt-coupling (left) and indirect coupling with beam redirection Challenges: Development of low-loss materials with increased thermal stability Fast large-area detectors Efficient coupling strategies that preferably base on passive alignment and surface mount technology Design software must address specific design rules and must be enhanced by simulations Folie 24

25 Board level reliability Board level reliability FEM analysis Life time prediction Physics of failures Characterization of material behavior Determination of failure modes of packaging structures Cross section of a BGA with polymeric core solder joint and its representation by a FEM mesh Crack in a FBGA joint, detailed view of the downer left side of the joint Folie 25

26 Non-destructive inspection Exploitation of new application possibilities for standard processes Ultrasonic inspection X-ray microscopy X-ray computed tomography Geometrical characterization of surfaces Tomography of µbga balls to detect voids Surface characterization using confocal microscopy, resolution in z - direction <1nm possible Folie 26

27 Advantages of Hetero-System-Integration Combination of electrical, mechanical, optical and fluidic functions in one package. Increasing functionality and therefore higher integration density per volume. Higher clock rates and higher performance of signal processing, especially for in-situ sensors. Wireless electrical power supply (Energy Harvesting / Energy Storage). Wireless communication with high data rates. Systemintegration of sensors and actuators. Folie 27