InGaAlP-High Brightness-Lumineszenzdiode (632 nm, High Optical Power) InGaAlP High Brightness Light Emitting Diode (632 nm, High Optical Power)

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1 InGaAlP-High Brightness-Lumineszenzdiode (632 nm, High Optical Power) InGaAlP High Brightness Light Emitting Diode (632 nm, High Optical Power) F 1998A Vorläufige Daten/Preliminary Data Wesentliche Merkmale Optimierte Lichtauskopplung durch Oberflächenstrukturierung und Stromverteilung Chipgröße 3 x 3 µm 2 Wellenlänge: 632 nm Typ. Lichtstärke: 9 2 ma (in TO18 Gehäuse) Typ. Lichtfluß: ma ( in PowerTOPLED Geh.) Anwendungen Ampeln Optischer Indikator Hinterleuchtung (LCD, Handy, Schalter, Tasten, Displays, Werbebeleuchtung, Allgemeinbeleuchtung) Beleuchtung im Automobilbereich (z.b. Instrumentenbeleuchtung, Bremslichter und Blinklichter) Ersatz von Kleinst-Glühlampen Markierungsbeleuchtung Signal- und leuchten Barcode-Scanner Feature Optimized light extraction due to surface structuring and current distribution Chip size 3 x 3 µm 2 Wavelength: 632 nm Typ. luminous intensity: 9 2 ma (TO18 package) Typ. luminous flux: ma (in PowerTOPLED pack.) Applications Traffic lights Optical indicators Backlighting (LCD, cellular phones, switches, keys, displays, illuminated advertising,general lighting) Automotive lighting (e.g. dashboard backlighting, brake lights, turn signal lamps, etc.) Substitution of micro incandescent lamps Marker lights Signal and symbol luminaire Barcode-Scanner Typ Type Bestellnummer Ordering Code Beschreibung Description F 1998A Q6722-C1446 Superrot emittierender Chip mit optimierter Lichtauskopplung durch Oberflächenstrukturierung, Oberseite Anodenanschluss Superred emitting chip with optimized light extraction due to surface structuring, top side anode connection

2 Elektrische Werte (gemessen auf TO18-Bodenplatte ohne Verguss, T A = 25 C) Electrical values (measured on TO18 header without resin, T A = 25 C) Bezeichnung Parameter Dominantwellenlänge Dominant wavelength I F = 2 ma Spektrale Bandbreite bei 5% von I max, Spectral bandwidth at 5% of I max I F = 2 ma Durchlaβspannung Forward voltage I F = 2 ma Lichtstärke 4) Luminous intensity 4) I F = 2 ma Lichtfluß 4) Luminous flux 4) I F = 2 ma Sperrspannung Reverse voltage Temperaturkoeffizient 2) von λ dom Temperature coefficient 2) of λ dom I F = 5 ma; - C < T < C Temperaturkoeffizient 2) von V F Temperature coefficient 2) of V F I F = 5 ma; - C < T < C Wert 1) Value 1) min. typ. max. λ dom nm λ 2 nm V F V Einheit Unit I V 65 9 mcd Φ V 2 27 mlm V R 12 V TC λdom.4 nm/k TC V -3.4 mv/k

3 Mechanische Werte Mechanical values Bezeichnung Parameter Chipkantenlänge (x-richtung) Length of chip edge (x-direction) Chipkantenlänge (y-richtung) Length of chip edge (y-direction) Durchmesser des Wafers Diameter of the wafer Chiphöhe Die height Bondpaddurchmesser Diameter of bondpad Wert 1) Value 1) min. typ. max. Einheit Unit L x mm L y mm D mm H µm d µm Bezeichnung Parameter Vorderseitenmetallisierung Metallization frontside Rückseitenmetallisierung Metallization backside Trennverfahren Dicing Verbindung Chip - Träger Die bonding Wert Value Aluminium Aluminum Goldlegierung Gold alloy Sägen Sawing Kleben Epoxy bonding

4 fjpe Grenzwert 3) ( T A = 25 C) Maximum Ratings 3) Bezeichnung Parameter Maximaler Betriebstemperaturbereich Maximum operating temperature range Maximaler Lagertemperaturbereich Maximum storage temperature range Maximaler Durchlaßstrom Maximum forward current Maximaler Pulsstrom, Maximum surge current t p = µs, D =.5 Maximale Sperrschichttemperatur Maximum junction temperature Wert Value T op C T stg C I F 7 ma I peak ma T j 125 C Einheit Unit

5 Durchlassstrom 2) I F = f (V F ) Forward Current T A = 25 C Relative Lichtstärke 2) I V /I V (5mA) = f (I F ) Relative Luminous Intensity T A = 25 C I F 2 ma OHL1382 I V I V (5 ma) 1 OHL V 2.5 Zulassige Impulsbelastbarkeit 2) I F = f (t P ) Permissible Pulse Handling Capability Duty cycle D = parameter, T A = 25 C I F.12 A V F OHL ma 2 I Zulassige Impulsbelastbarkeit 2) I F = f (t P ) Permissible Pulse Handling Capability Duty cycle D = parameter, T A = 85 C I F.12 A F OHL t p 1 s t p 1 s

6 Relative spektrale Emission 2) I rel = f (λ), T A = 25 C, I F = 5 ma Relative Spectral Emission V (λ) = spektrale Augenempfindlichkeit Standard eye response curve OHL1486 I rel % 8 V λ super-red nm 7 λ

7 Maßzeichnung Chip Outlines.114(.45).3(.118).22(.87) p-contact n-contact MaßMaße werden als typische 1) Werte wie folgt angegeben: mm (inch) / Dimensions are specified as typical 1) values as follows: mm (inch)

8 Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-9349 Regensburg All Rights Reserved. Attention please! The information generally describes the type of component and shall not be considered as assured characteristics or detailed specification. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our sales organization. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You will have to bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized by us for such purpose! Critical components 5), may only be used in life-support devices or systems 6) with the express written approval of OSRAM OS. 1) Typical (refered to as typ.) data are defined as long-term production mean values and are only given for information. This is not a specified value. For final electrical testing a spot check with sufficient statistical accuracy is carried out. Minimum and maximum values( refered to as min. and max.) refer to the limits of the sample measurement. 2) Based on data measured in OSRAM Opto Semiconductor s PowerTOPLED package. They represent typical 1) data. 3) Maximum ratings are strongly package dependent and may differ between different packages. The values given represent the chip in an OSRAM OS PowerTOPLED package and are only valid for this package. 4) Value is referenced to the vendor s measurement system (correlation to customer product(s) is required). 5) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 6) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered