IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung High Power Infrared Emitter (850 nm) Lead (Pb) Free Product - RoHS Compliant SFH 4253 R

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1 IR-Lumineszenzdiode (8 nm) mi hoher Ausgangsleisung High Power Infrared Emier (8 nm) Lead (Pb) Free Produc - RoHS Complian SFH 423 R DRAF - his design is for reference only. Subjec o change wihou noice. Wesenliche Merkmale Infraro LED mi hoher Ausgangsleisung Kurze Schalzeien Anwendungen Infrarobeleuchung für Kameras IR-Daenüberragung Sensorik Sicherheishinweise Je nach Beriebsar emiieren diese Baueile hochkonzenriere, nich sichbare Infraro- Srahlung, die gefährlich für das menschliche Auge sein kann. Produke, die diese Baueile enhalen, müssen gemäß den Sicherheisrichlinien der IEC-Normen 682- und 6247 behandel werden. Feaures High Power Infrared LED Shor swiching imes Applicaions Infrared Illuminaion for cameras IR Daa ransmission Opical sensors Safey Advices Depending on he mode of operaion, hese devices emi highly concenraed non visible infrared ligh which can be hazardous o he human eye. Producs which incorporae hese devices have o follow he safey precauions given in IEC 682- and IEC yp ype Besellnummer Ordering Code SFH 423 R on reques 6.3 (yp. 2) Srahlsärkegruppierung ) ( = 7 ma, p = 2 ms) Radian Inensiy Grouping ) I e (mw/sr) ) gemessen bei einem Raumwinkel Ω =. sr / measured a a solid angle of Ω =. sr

2 Grenzwere ( A = 2 C) Maximum Raings Bezeichnung Parameer Beriebs- und Lageremperaur Operaing and sorage emperaure range Sperrspannung Reverse volage Vorwärsgleichsrom Forward curren Soßsrom, p = μs, D = Surge curren Verlusleisung Power dissipaion Wärmewidersand Sperrschich - Umgebung bei Monage auf FR4 Plaine, Padgröße je 6 mm 2 hermal resisance juncion - ambien mouned on PC-board (FR4), padsize 6 mm 2 each Wärmewidersand Sperrschich - Löselle bei Monage auf Meall-Block hermal resisance juncion - soldering poin, mouned on meal block Kennwere ( A = 2 C) Characerisics Bezeichnung Parameer Wellenlänge der Srahlung Wavelengh a peak emission = 7 ma Schwerpunks-Wellenlänge der Srahlung Cenroid wavelengh = 7 ma Spekrale Bandbreie bei % von I max Specral bandwidh a % of I max = 7 ma Absrahlwinkel Half angle Akive Chipfläche Acive chip area Wer Value op, sg 4 + C V R V 7 ma SM 7 ma Einhei Uni P o 4 mw R hja R hjs 28 Wer Value K/W K/W λ peak 86 nm λ cenroid 8 nm Δλ 3 nm Einhei Uni ϕ ± 6 Grad deg. A.4 mm

3 Kennwere ( A = 2 C) Characerisics (con d) Bezeichnung Parameer Abmessungen der akiven Chipfläche Dimension of he acive chip area Schalzeien, I e von % auf 9% und von 9% auf %, bei = 7 ma, R L = Ω Swiching imes, Ι e from % o 9% and from 9% o %, = 7 ma, R L = Ω Durchlassspannung Forward volage = 7 ma, p = 2 ms = ma, p = µs Sperrsrom Reverse curren Gesamsrahlungsfluss oal radian flux = 7 ma, p = 2 ms emperaurkoeffizien von I e bzw. Φ e, = 7 ma emperaure coefficien of I e or Φ e, = 7 ma emperaurkoeffizien von V F, = 7mA emperaure coefficien of V F, = 7 ma emperaurkoeffizien von λ, = 7 ma emperaure coefficien of λ, = 7 ma L B L W.2.2 mm² r, f 2 ns V F.6 (< 2.) V F 2.4 (< 3.) I R Wer Value no designed for reverse operaion Einhei Uni V V μa Φ e yp 4 mw C I. %/K C V.7 mv/k C λ +.3 nm/k

4 Srahlsärke I e in Achsrichung ) gemessen bei einem Raumwinkel Ω =. sr Radian Inensiy I e in Axial Direcion a a solid angle of Ω =. sr Bezeichnung Parameer Were Values Einhei Uni SFH 423 R-Q SFH 423 R-R Srahlsärke Radian inensiy = 7 ma, p = 2 ms I e min 6.3 I e max 2. 2 mw/sr mw/sr Srahlsärke Radian inensiy = ma, p = 2 µs I e yp 37 6 mw/sr ) Nur eine Gruppe in einer Verpackungseinhei (Sreuung kleiner 2:) / Only one bin in one packing uni (variaion lower 2:) Absrahlcharakerisik Radiaion Characerisics I rel = f (ϕ) OHL66 ϕ

5 Relaive Specral Emission I rel = f (λ) I rel % Forward Curren = f (V F ) Single pulse, p = μs A OHF432 nm 9 λ OHF3826 Radian Inensiy I e 7 ma = f ( ) Single pulse, p = 2 μs e e (7 ma) I I - -2 Permissible Pulse Handling Capabiliy = f (τ), A = 2 C, duy cycle D = parameer.7 A.6 I e OHF ma 3 D = P P OHF3733 Max. Permissible Forward Curren = f ( A ), R hja = K/W 8 ma C 2 A Permissible Pulse Handling Capabiliy = f (τ), A = 8 C, duy cycle D = parameer A.6 D = P P OHF3732 OHF D = D = V3 V F s p s p

6 Maßzeichnung Package Oulines 3. (.8) 2.6 (.2) 2.3 (.9) 2. (.83).7 (.67). (.39) 2. (.83).9 (.3) 3.4 (.34) 3. (.8) (2.4 (.94)).3 (.2) max.3 (.2) min.4 (.23). (.97) A 4 ±... (.4) C Cahode marking.6 (.24).4 (.6) GPLY6899 Maße in mm (inch) / Dimensions in mm (inch). Gehäuse / Package Anschlussbelegung Pin configuraion OPLED, klarer Verguss / OPLED Reverse Gullwing, clear resin siehe Zeichnung see drawing

7 Empfohlenes Löpaddesign Recommended Solder Pad Design 6 (.236).2 (.47) 2.6 (.2) Padgeomerie für verbessere Wärmeableiung Paddesign for improved hea dissipaion 6 (.236).2 (.47) 2.6 (.2) Cu-Fläche > 6 mm Cu-area > 6 mm (.) 2.4 (.94) Hole on PCB Lösopplack Solder resis Maße in mm (inch) / Dimensions in mm (inch). OHLPY

8 Löbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Condiions Precondiioning acc. o JEDEC Level 2 Reflow Löprofil für bleifreies Löen (nach J-SD-2D.) Reflow Soldering Profile for lead free soldering (acc. o J-SD-2D.) 3 C C 27 C P L p OHA42 24 C S 2 C 2 2 s 3 Profileigenschafen Profile Feaure Aufheizrae zum Vorwärmen* ) / Ramp-up rae o prehea* ) 2 C o C Zei s von Smin bis Smax / ime s from Smin o Smax C o 2 C Bleifreier Aufbau / Pb-Free Assembly (SnAgCu) Empfehlung / Recommendaion 2 K / s 3 K / s Grenzwere / Max. Raings s min. 6 s max. 2 s Aufheizrae zur Spizenemperaur* ) / 2 K / s 3 K / s Ramp-up rae o peak* ) 8 C o P Liquidusemperaur L / 27 C Liquidus emperaure L Zei L über L / ime L above L 8 s max. s Spizenemperaur P / Peak emperaure P 24 C max. 26 C Verweilzei P innerhalb des spezifizieren Spizenemperaurbereichs P - K / ime P wihin he specified peak emperaure range P - K 2 s min. s max. 3 s Abkühlrae* ) / Ramp-down rae* ) P o C 3 K / s 6 K / s maximum Zeispanne von 2 C bis zur Spizenemperaur / ime from 2 C o peak emperaure max. 8 min. Alle emperauren beziehen sich auf die Baueilmie, jeweils auf der Baueiloberseie gemessen / All emperaures refer o he cener of he package, measured on he op of he package * Seigungsberechnung Δ/Δ: Δ max. s; erfüll über den gesamen emperaurbereich / slope calculaion Δ/Δ: Δ max. s; fulfillmen for he whole -range

9 Wellenlöen (W) (nach CECC 82) W Soldering (acc. o CECC 82) 3 C C C. Welle. wave s 2. Welle 2. wave Normalkurve sandard curve Grenzkurven limi curves OHLY98 ca 2 K/s K/s 2 K/s C... 3 C 2 K/s Zwangskühlung forced cooling 2 s 2 Published by OSRAM Opo Semiconducors GmbH Leibnizsraße 4, D-93 Regensburg All Righs Reserved. he informaion describes he ype of componen and shall no be considered as assured characerisics. erms of delivery and righs o change design reserved. Due o echnical requiremens componens may conain dangerous subsances. For informaion on he ypes in quesion please conac our Sales Organizaion. Packing Please use he recycling operaors known o you. We can also help you ge in ouch wih your neares sales office. By agreemen we will ake packing maerial back, if i is sored. You mus bear he coss of ranspor. For packing maerial ha is reurned o us unsored or which we are no obliged o accep, we shall have o invoice you for any coss incurred. Componens used in life-suppor devices or sysems mus be expressly auhorized for such purpose! Criical componens, may only be used in life-suppor devices or sysems 2 wih he express wrien approval of OSRAM OS. A criical componen is a componen usedin a life-suppor device or sysem whose failure can reasonably be expeced o cause he failure of ha life-suppor device or sysem, or o affec is safey or effeciveness of ha device or sysem. 2 Life suppor devices or sysems are inended (a) o be implaned in he human body, or (b) o suppor and/or mainain and susain human life. If hey fail, i is reasonable o assume ha he healh of he user may be endangered. Disclaimer OSRAM OS assumes no liabiliy whasoever for any use of his documen or is conen by recipien including bu no limied o, for any design-in aciviies based on his preliminary draf version. OSRAM OS may e.g. decide a is sole discreion o sop developing and/or finalising he underlying design a any ime