Gabellichtschranke Slotted Interrupter Lead (Pb) Free Product - RoHS Compliant SFH 9500

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Gabellichtschranke Slotted Interrupter Lead (Pb) Free Product - RoHS Compliant SFH 9500 Vorläufige Daten/ Preliminary Data Wesentliche Merkmale Geeignet für Oberflächenmontage (SMT) Kompaktes Gehäuse

1 Gabellichtschranke Slotted Interrupter Lead (Pb) Free Product - RoHS Compliant SFH 9500 Vorläufige Daten/ Preliminary Data Wesentliche Merkmale Geeignet für Oberflächenmontage (SMT) Kompaktes Gehäuse aus schwarzem LCP GaAs-IR-Sendediode (940 nm) Si-Fototransistor mit Tageslichtsperrfilter Mit Positionspin Geeignet für pick and place Montage Hohe Genauigkeit (Schlitzbreite 0,5 mm) Große Spaltbreite zwischen Sender und Empfänger (5 mm) Hohe Stabilität auf PCB durch große Bauelementabmessung (6,8 mm) Anwendungen Geschwindigkeitsüberwachung Motorsteuerung Überwachung des Papiervorschubs in Druckern, Kopier- und Faxgeräten Speicherlaufwerke Steuerung des Druckkopfes in Druckern Münzdetektion Optoelektronische Schalter Features Suitable for surface mounting (SMT) Compact housing out of black LCP GaAs infrared emitter (940 nm) Silicon phototransistor detector with daylight-cutoff filter With positioning pin Suitable for pick and place High sensing accuracy (slit width: 0.5 mm) Wide gap between emitter and detector (5 mm) High stability on pcb due to large width of device (6.8 mm) Applications Speed control Motor control Monitoring of paper feed in printers, copiers, facsimiles Disk drives Control of print head in printers Coin detection Optoelectronic switches Typ Type Bestellnummer Ordering Code SFH 9500 Q65110A I CE min. [ma] (I F = 20 ma; V CE = 5 V)

2 Grenzwerte Maximum Ratings Bezeichnung Parameter Wert Value Einheit Unit Sender (GaAs-Diode) Emitter (GaAs Diode) Sperrspannung Reverse voltage Durchlaßstrom, T A 25 C Forward current Verlustleistung, T A 25 C Power dissipation Wärmewiderstand Thermal resistance V R 5 V I F (DC) 60 ma P tot 100 mw R thja 280 K/W Empfänger (Si-Fototransistor) Detector (Silicon Phototransistor) Kollektor-Emitter-Spannung Collector-emitter voltage Kollektor-Emitter-Spannung, (t 2 min) Collector-emitter voltage Emitter-Kollektor-Spannung Emitter-collector voltage Kollektorstrom Collector current, T A 25 C Verlustleistung, T A 25 C Total power dissipation Wärmewiderstand Thermal resistance V CE 30 V V CE 70 V EC 7 I C 50 ma P tot 150 mw R thja 280 K/W

3 Grenzwerte Maximum Ratings Bezeichnung Parameter Wert Value Einheit Unit Gabellichtschranke Slotted Interrupter Lagertemperatur Storage temperature range Betriebstemperatur Operating temperature range Elektrostatische Entladung Electrostatic discharge T stg C T op ESD 2 kv

4 Kennwerte T A = 25 C Characteristics Bezeichnung Parameter Wert Value Einheit Unit Sender (GaAs-Diode) Emitter (GaAs Diode) Wellenlänge der Strahlung Wavelength of peak emission Durchlaβspannung Forward voltage I F = 20 m, t p = 20 ms Sperrstrom Reverse current V R = 5 V Kapazität Capacitance V R = 0 V, f = 1 MHz λ peak 940 nm V F 1.2 ( 1.4) V I R 0.01 ( 1) µa C 0 16 pf Empfänger (Si-Fototransistor) Detector (Silicon Phototransistor) Wellenlänge der max. Fotoempfindlichkeit Wavelength of max. sensitivity Spectr. Bereich der Fotoempfindlichkeit Spectral range of sensitivity S = 10% of S max Kapazität Capacitance V CE = 0 V, f = 1 MHz, E = 0 Dunkelstrom, V CE = 20 V Dark current λ S max 920 nm λ nm C CE 6.5 pf I CEO 2 ( 50) na

5 Kennwerte T A = 25 C (cont d) Characteristics Bezeichnung Parameter Wert Value Einheit Unit Gabellichtschranke Slotted interrupter Kollektor-Emitterstrom Collector-emitter current I F = 20 ma; V CE = 5 V Kollektor-Emitter-Sättigungsspannung Collector-emitter-saturation voltage I F = 20 ma; I C = 0.3 ma Anstiegs- und Abfallzeit Rise and fall time V CC = 5 V, I C = 1 ma, R L = 1 kω I CEmin 1 ma V CE sat 0.4 V t r 13 t f 17 µs µs

6 Forward Current I F = f (V F ) Single pulse, t p = 20 µs 10 4 ma Ι F OHF00367 Max. Permissible Forward Current I F = f (T A ) 90 Ι F ma R thja = 280 K/W OHF00372 Dark Current I CEO = f (T A ) V CE = 20 V, E = 0 Ι 10 3 na CEO 10 2 OHF V 4 VF Total Power Dissipation for Emitter and Detector P tot = f (T A ) C 120 TA C 100 TA 160 Detector OHF00410 P tot Emitter C 100 TA

7 Maßzeichnung Package Outlines (0.244) 6.0 (0.236) (0.537) (0.272) 10.2 (0.402) 9.80 (0.386) Optical axis (0.522) 5.2 (0.205) 4.9 (0.193) 6.7 (0.264) 5.1 (0.201) 4.9 (0.193) (8.0 (0.315)) 7.1 (0.280) 6.9 (0.272) (2.2 (0.087)) 0.5 (0.020) 0.3 (0.012) 1.1 (0.043) 0.9 (0.035) 2.05 (0.081) 1.85 (0.073) 6.1 (0.240) 2.9 (0.114) 2.1 (0.082) 0.6 (0.024) 0.4 (0.016) 2.54 (0.100) 0.8 (0.031) 0.6 (0.024) 4.0 (0.157) 3.8 (0.150) 5.9 (0.232) (15.6 (0.614)) Coplanarity _< 0.1 Body to ground distance _< (0.024) 0.4 (0.016) 2 Circuitry 3 E S 1 4 Emitter Sensor GPXY6688 Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). General Tolerance: +/-0.1mm

8 Empfohlenes Lötpaddesign Recommended Solder Pad IR-Reflow Löten IR REflow Soldering 1.6 (0.063) 1.95 (0.077) 0.9 (0.035) 4.1 (0.161) 2.54 (0.100) 6.1 (0.240) 8.8 (0.346) Padgeometrie für verbesserte Wärmeableitung Paddesign for improved heat dissipation (7.4 (0.291)) Cu-Fläche > 16 mm 2 2 Cu-area > 16 mm E S Bauteil positioniert Component Location on Pad E S Lötstopplack Solder resist OHFY1950 Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). Löthinweise Soldering Conditions Bauform Type Peak Temp. of Soldering Zone Reflowlötung Reflow Soldering Max. Time in Peak Zone SFH C 10 s 30 s Tauch-, Schwalllötung Dip, Wave Soldering

9 Lötbedingungen Soldering Conditions IR-Reflow Lötprofil für bleifreies Löten IR Reflow Soldering Profile for lead free soldering (nach J-STD-020B) (acc. to J-STD-020B) T 300 C C 240 C 217 C Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile 10 s min 30 s max OHLA C 260 C -5 C 245 C ±5 C +5 C 235 C -0 C s max 100 s max Ramp Down 6 K/s (max) Ramp Up 3 K/s (max) 25 C s 300 t Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D Regensburg All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1, may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered

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